| dbo:abstract |
A bond-out processor is an emulation processor that takes the place of the microcontroller or microprocessor in the target board while an application is being developed and/or debugged. Bond-out processors have internal signals and bus brought out to external pins. The term bond-out derives from connecting (or bonding) the emulation circuitry to these external pins. These devices are designed to be used within an in-circuit emulator and are not typically used in any other kind of system. Bond-out pins were marked as no-connects in the first devices produced by Intel, and were usually not connected to anything on the ordinary production silicon. Later bond-out versions of the microprocessor were produced in a bigger package to provide more signals and functionality. Bond-out processors provides capabilities far beyond those of a simple ROM monitor. A ROM monitor is a firmware program that runs instead of the application code and provides a connection to a host computer to carry out debugging functions. In general the ROM monitor uses part of the processor resources and shares the memory with the user code. Bond-out processors can handle complex breakpoints (even in ROM), real-time traces of processor activity, and no use of target resources. But this extra functionality comes at a high cost, as bond-outs have to be produced for in-circuit emulators only. Therefore, sometimes solutions similar to bond-outs are implemented with an ASIC or FPGA or a faster RISC processor that imitates the core processor code execution and peripherals. (en) |
| dbo:wikiPageExternalLink |
http://www.embedded.com/design/debug-and-optimization/4395414/Real-Time-Debugging-with-ROM-Monitors |
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38606873 (xsd:integer) |
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2364 (xsd:nonNegativeInteger) |
| dbo:wikiPageRevisionID |
1122912057 (xsd:integer) |
| dbo:wikiPageWikiLink |
dbr:Emulator dbr:Microcontroller dbc:Embedded_systems dbr:Intel dbr:Microprocessor dbr:In-circuit_emulator dbr:Breakpoints |
| dbp:wikiPageUsesTemplate |
dbt:Reflist dbt:Short_description dbt:Technical |
| dct:subject |
dbc:Embedded_systems |
| gold:hypernym |
dbr:Processor |
| rdf:type |
dbo:Software yago:Artifact100021939 yago:Instrumentality103575240 yago:Object100002684 yago:PhysicalEntity100001930 yago:System104377057 yago:Whole100003553 yago:WikicatEmbeddedSystems |
| rdfs:comment |
A bond-out processor is an emulation processor that takes the place of the microcontroller or microprocessor in the target board while an application is being developed and/or debugged. Bond-out processors have internal signals and bus brought out to external pins. The term bond-out derives from connecting (or bonding) the emulation circuitry to these external pins. These devices are designed to be used within an in-circuit emulator and are not typically used in any other kind of system. (en) |
| rdfs:label |
Bond-out processor (en) |
| owl:sameAs |
freebase:Bond-out processor yago-res:Bond-out processor wikidata:Bond-out processor https://global.dbpedia.org/id/f9ZV |
| prov:wasDerivedFrom |
wikipedia-en:Bond-out_processor?oldid=1122912057&ns=0 |
| foaf:isPrimaryTopicOf |
wikipedia-en:Bond-out_processor |
| is dbo:wikiPageWikiLink of |
dbr:Ceibo_emulator dbr:In-circuit_emulation |
| is foaf:primaryTopic of |
wikipedia-en:Bond-out_processor |