Multi-leaded power package (original) (raw)
The multi-leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifiers. It was derived from single in-line package. The difference is the lead arrangement; multi-leaded power packages usually have the lead bent to zig-zag pattern. Multi-leaded power packages commonly have more than three leads; nine-, thirteen- and fifteen-lead units are common, units with five or seven leads with TO-220 style are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of multi-leaded power packages are simply stretched TO-220 packages. Components made in multi-leaded power packages can handle more power than those constructed in TO-220
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dbo:abstract | The multi-leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifiers. It was derived from single in-line package. The difference is the lead arrangement; multi-leaded power packages usually have the lead bent to zig-zag pattern. Multi-leaded power packages commonly have more than three leads; nine-, thirteen- and fifteen-lead units are common, units with five or seven leads with TO-220 style are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of multi-leaded power packages are simply stretched TO-220 packages. Components made in multi-leaded power packages can handle more power than those constructed in TO-220 cases, or even TO3 cases with thermal resistance no less than 1.5 C/W. One well-known STMicroelectronics brand of this type of package is Multiwatt. (en) |
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dbo:wikiPageLength | 3367 (xsd:nonNegativeInteger) |
dbo:wikiPageRevisionID | 943251656 (xsd:integer) |
dbo:wikiPageWikiLink | dbr:Mica dbr:Integrated_circuit dbr:STMicroelectronics dbr:TO3 dbc:Chip_carriers dbr:Thermal_conductivity dbr:Thermal_resistance dbr:Heatsink dbr:Ground_(electricity) dbr:Industry_Standard_Architecture dbr:Printed_circuit_board dbr:Single_in-line_package dbr:TO-220 dbr:Audio_amplifier dbr:Mains_(electric_power) dbr:Thermal_compound dbr:File:SIL9_ST_TDA4601.jpg |
dct:subject | dbc:Chip_carriers |
gold:hypernym | dbr:Style |
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rdfs:comment | The multi-leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifiers. It was derived from single in-line package. The difference is the lead arrangement; multi-leaded power packages usually have the lead bent to zig-zag pattern. Multi-leaded power packages commonly have more than three leads; nine-, thirteen- and fifteen-lead units are common, units with five or seven leads with TO-220 style are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of multi-leaded power packages are simply stretched TO-220 packages. Components made in multi-leaded power packages can handle more power than those constructed in TO-220 (en) |
rdfs:label | Multi-leaded power package (en) |
owl:sameAs | freebase:Multi-leaded power package yago-res:Multi-leaded power package wikidata:Multi-leaded power package dbpedia-fa:Multi-leaded power package https://global.dbpedia.org/id/4rd7n |
prov:wasDerivedFrom | wikipedia-en:Multi-leaded_power_package?oldid=943251656&ns=0 |
foaf:depiction | wiki-commons:Special:FilePath/SIL9_ST_TDA4601.jpg |
foaf:isPrimaryTopicOf | wikipedia-en:Multi-leaded_power_package |
is dbo:wikiPageRedirects of | dbr:Multiwatt |
is dbo:wikiPageWikiLink of | dbr:Dual_in-line_package dbr:Kombinat_Mikroelektronik_Erfurt dbr:Zig-zag_in-line_package dbr:Multiwatt |
is foaf:primaryTopic of | wikipedia-en:Multi-leaded_power_package |