Quilt packaging (original) (raw)

Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect packaging technology that utilizes “nodule” structures that extend out horizontally from the edges of microchips to make electrically and mechanically robust chip-to-chip interconnections. QP nodules are created as an integral part of the microchip using standard back end of the line semiconductor device fabrication techniques. Solder is then electroplated on top of the nodules to enable the chip to chip interconnection with sub-micron alignment accuracy.