Material: Copper (Cu), bulk (original) (raw)
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| Property↑↓ | Value↑↓ | Conditions↑↓ | Reference↑↓ |
|---|---|---|---|
| Poisson's Ratio | 0.36 | Vias,used in a cell composed of a square copper via in a thin polyimide film mounted on top of a silicon substrate,properties are taken same as bulk properties. | Mechanics of Materials 23(1996), p.314 |
| Specific heat | 384.56 J/kg/K | At Temp=25 C. | CRC Materials Science and Engineering Handbook, p.260 |
| Thermal conductivity | 398 W/m/K | Value at temp=300 K. | CRC Materials Science and Engineering Handbook, p.270-274 |
| Yield strength | 100 MPa | Vias,used in a cell composed of a square copper via in a thin polyimide film mounted on top of a silicon substrate,properties are taken same as bulk properties. | Mechanics of Materials 23(1996), p.314 |
| Young's Modulus | 128 GPa | Vias,used in a cell composed of a square copper via in a thin polyimide film mounted on top of a silicon substrate,properties are taken same as bulk properties. | Mechanics of Materials 23(1996), p.314 |
| density | 8960 kg/m^3 | 25 degrees C | Handbook of the elements, S. Ruben, 2 nd printing (1987), Open Court Publishing |