GaAs - Gallium Arsenide - Epitaxy Ready Polished Wafers: Wafer Technology (original) (raw)

Mechanical Specifications
Gallium arsenide can be supplied as ingots or ingot sections or as-cut, etched or polished wafers. All gallium arsenide wafers are individually laser scribed with ingot and slice identity to ensure perfect tracability.

Packaging
Polished Wafers
Fluoroware type tray, individually sealed in two outer bags in inert atmosphere. (Empak type boxes available on request)As-cut Wafers
Empak type boxes (Glassine bag available on request)‘Process Trial’ wafers
Fluoroware tray, individually sealed in one outer bag. If you do not see
the specification you require,
please ask for details

Wafer Technology also offers GaAs wafers produced by the High Pressure Liquid Encapsulated Czochralski (LEC) method. Single crystal ingots are produced using high purity gallium and arsenic as the starting material