Giulio Pellegrini | CSIC (Consejo Superior de Investigaciones Científicas-Spanish National Research Council) (original) (raw)

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Research paper thumbnail of Future trends of 3D silicon sensors

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 2013

ABSTRACT Vertex detectors for the next LHC experiments upgrades will need to have low mass while ... more ABSTRACT Vertex detectors for the next LHC experiments upgrades will need to have low mass while at the same time be radiation hard and with sufficient granularity to fulfil the physics challenges of the next decade. Based on the gained experience with 3D silicon sensors for the ATLAS IBL project and the on-going developments on light materials, interconnectivity and cooling, this paper will discuss possible solutions to these requirements.

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Research paper thumbnail of A fourfold segmented silicon strip sensor with read-out at the edges

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 2015

ABSTRACT

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Research paper thumbnail of Ultra-Thin 3-D Detector: Charge Collection Characterization and Application for Microdosimetry

IEEE Transactions on Nuclear Science, 2014

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Research paper thumbnail of Special bump bonding technique for silicon pixel detectors

Nuclear Instruments and Methods in Physics Research Section a Accelerators Spectrometers Detectors and Associated Equipment, Jun 1, 2007

This paper presents a high-density bumping technique based on electrodeposition of the bump mater... more This paper presents a high-density bumping technique based on electrodeposition of the bump materials. The idea of such technique is to allow the packaging of densely populated chips such as array pixel detectors. Silicon pixel detector dummies have been designed and fabricated at CNM in order to evaluate the technique developed. Special test structures have been included in these dummies to evaluate the final yield of the process developed at CNM. The foreseen applications are Medical Imaging and X-ray systems. The new bumping technique developed will greatly improve the simplicity and the cost of the packaging process.

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Research paper thumbnail of Radiation detector, method of manufacturing a radiation detector and use of the detector for measuring radiation

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Research paper thumbnail of Technology development of 3D detectors for high energy physics and medical imaging

Various fabrications routes to create '3D'detectors hav... more Various fabrications routes to create '3D'detectors have been investigated and the electrical characteristics of these structures have been compared to simulations. The geometry of the detectors is hexagonal with a central anode surrounded by six cathode contacts. A ...

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Research paper thumbnail of Radiation Hardness Tests of Double-Sided 3D Detectors

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Research paper thumbnail of Direct charge sharing observation in single-photon-counting pixel detector

Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment

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Research paper thumbnail of 3D cylindrical silicon microdosimeters: fabrication, simulation and charge collection study

Journal of Instrumentation, 2015

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Research paper thumbnail of Radiation damage of SiGe HBT Technologies at different bias configurations

SiGe BiCMOS technologies are being proposed for the Front-end readout of the detectors in the mid... more SiGe BiCMOS technologies are being proposed for the Front-end readout of the detectors in the middle region of the ATLAS-Upgrade. The radiation hardness of the SiGe bipolar transistors is being assessed for this application through irradiations with different particles. Biasing conditions during irradiation of bipolar transistors or circuits have an influence on the damage and there is a risk of erroneous results. We have performed several irradiation experiments of SiGe devices from IHP in different bias conditions. We have observed a systematic trend in gamma irradiations, showing a smaller damage in transistors irradiated biased compared to shorted or floating terminals.

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Research paper thumbnail of Ionizing radiation detector sensitive to the 2d position

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Research paper thumbnail of High-Performance Magneto-Optic Surface Plasmon Resonance Sensor Design: An Optimization Approach

Plasmonics

High-performance intensity-interrogated magneto-optic surface plasmon resonance (MOSPR) sensors a... more High-performance intensity-interrogated magneto-optic surface plasmon resonance (MOSPR) sensors are designed by a multi-objective optimization approach. Designed devices show bulk refractive index sensitivity 1 order of magnitude larger than the current state of the art, while the design procedure allows to chose an appropriate trade-off between sensor performance and ease of fabrica-tion. Straightforward guidelines for the sensor design and fabrication emerge from the optimization process, indicat-ing that minimization of the optical losses takes precedence on the maximization of the magneto-optical modulation.

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Research paper thumbnail of Detection of Early Markers in Mammography Project

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Research paper thumbnail of Charge sharing measurements of pixilated CdTe using Medipix-II chip

Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510), 2004

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Research paper thumbnail of Silicon-based three-dimensional microstructures for radiation dosimetry in hadrontherapy

Applied Physics Letters, 2015

ABSTRACT

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Research paper thumbnail of CdTe/CZT pixel detector for gamma-ray spectrometry with imaging and polarimetry capability in astrophysics

Gamma-ray astrophysics in the MeV energy range plays a crucial role for the understanding of many... more Gamma-ray astrophysics in the MeV energy range plays a crucial role for the understanding of many exciting cosmic phenomena such as stellar explosions or cosmic accelerators (e.g., Supernovae, Novae, Supernova Remants (SNRs), Gamma-Ray Bursts (GRBs), Pulsars, etc). Cadmium Telluride (CdTe) and Cadmium Zinc Telluride (CdZnTe) are very attractive materials for gamma-ray detection, which have demonstrated a great potential onboard current space missions (such as IBIS/INTEGRAL and BAT/SWIFT). However, the energy coverage of these instruments has been limited up to a few hundred keV, and there has not been yet a dedicated instrument for polarimetry. Our technological activities aim to develop a gamma-ray spectrometer based on Cd(Zn)Te detectors, with imaging and polarimetry capability for astrophysical applications, in the energy range from a few hundred keV up to a few MeV. Within this framework, a gamma-ray polarimeter based on pixelated Cd(Zn)Te detectors in planar-transverse-field (P...

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Research paper thumbnail of Technology Development of 3D Detectors for Medical Imaging

Fabrication routes to realising '3D' detectors in gallium arsenide (GaAs) have been inves... more Fabrication routes to realising '3D' detectors in gallium arsenide (GaAs) have been investigated and their electrical characteristics measured. The geometry of the detector is hexagonal with a central anode surrounded by six cathode contacts. This geometry gives a uniform electric field with the maximum drift and depletion distance set by electrode spacings rather than detector thickness. The advantages of this

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Research paper thumbnail of 10μm thin transmissive photodiode produced by ALBA Synchrotron and IMB-CNM-CSIC

Journal of Instrumentation, 2015

ABSTRACT Thin silicon photodiodes are common X-ray beam diagnosis devices at synchrotron faciliti... more ABSTRACT Thin silicon photodiodes are common X-ray beam diagnosis devices at synchrotron facilities. Here we present a new device featuring an extremely thin layer that allows X-ray transmission over 90% for energies above 10 keV. The diode has a radiation-hard silicon junction with silicon dioxide passivation and a protective entrance window. These outstanding features make this device suited for diagnostic applications in X-ray synchrotron beamlines. Hereby preliminary results of X-ray transmission, responsivity and uniformity are presented.

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Research paper thumbnail of Journal Article

The ABCD3TA is a 128-channel ASIC with binary architecture for the readout of silicon strip parti... more The ABCD3TA is a 128-channel ASIC with binary architecture for the readout of silicon strip particle detectors in the Semiconductor Tracker of the ATLAS experiment at the Large Hadron Collider (LHC). The chip comprises fast front-end and amplitude discriminator circuits using bipolar devices, a binary pipeline for first level trigger latency, a second level derandomising buffer and data compression circuitry based on CMOS devices. It has been designed and fabricated in a BiCMOS radiation resistant process. Extensive testing of the ABCD3TA chips assembled into detector modules show that the design meets the specifications and maintains the required performance after irradiation up to a total ionising dose of 10 Mrad and a 1-MeV neutron equivalent fluence of 2×1014 n/cm2, corresponding to 10 years of operation of the LHC at its design luminosity. Wafer screening and quality assurance procedures have been developed and implemented in large volume production to ensure that the chips ass...

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Research paper thumbnail of Characterisation of Glasgow/CNM Double-Sided 3D Sensors

Physics Procedia, 2012

ABSTRACT 3D detectors are proposed as an alternative to planar silicon technology to withstand th... more ABSTRACT 3D detectors are proposed as an alternative to planar silicon technology to withstand the high radiation environments in planned future high energy physics experiments. Here we review the characterization of double-sided 3D detectors designed and built at CNM and the University of Glasgow. A non-irradiated sensor is characterized in a pion test-beamutilizing the Timepix telescope. The charge collection and detection efficiency across the unit pixel are shown. Area of inefficiency can be found at the columnar electrodes at perpendicular angles of beam incidence while the pixels are shown to be fully efficient at angles greater than ten degrees. A reduction in charge sharing compared to the planar technology is also demonstrated. Charge collection studies on irradiated devices with a Sr-90 source show higher charge collection efficiency for 3D over planar sensors at significantly lower applied bias. The sub-pixel response is probed by a micro-focused laser beam demonstrating areas of charge multiplication at high bias voltages. (C) 2012 Published by Elsevier B. V. Selection and/or peer review under responsibility of the organizing committee for TIPP 11.

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Research paper thumbnail of Future trends of 3D silicon sensors

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 2013

ABSTRACT Vertex detectors for the next LHC experiments upgrades will need to have low mass while ... more ABSTRACT Vertex detectors for the next LHC experiments upgrades will need to have low mass while at the same time be radiation hard and with sufficient granularity to fulfil the physics challenges of the next decade. Based on the gained experience with 3D silicon sensors for the ATLAS IBL project and the on-going developments on light materials, interconnectivity and cooling, this paper will discuss possible solutions to these requirements.

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Research paper thumbnail of A fourfold segmented silicon strip sensor with read-out at the edges

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 2015

ABSTRACT

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Research paper thumbnail of Ultra-Thin 3-D Detector: Charge Collection Characterization and Application for Microdosimetry

IEEE Transactions on Nuclear Science, 2014

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Research paper thumbnail of Special bump bonding technique for silicon pixel detectors

Nuclear Instruments and Methods in Physics Research Section a Accelerators Spectrometers Detectors and Associated Equipment, Jun 1, 2007

This paper presents a high-density bumping technique based on electrodeposition of the bump mater... more This paper presents a high-density bumping technique based on electrodeposition of the bump materials. The idea of such technique is to allow the packaging of densely populated chips such as array pixel detectors. Silicon pixel detector dummies have been designed and fabricated at CNM in order to evaluate the technique developed. Special test structures have been included in these dummies to evaluate the final yield of the process developed at CNM. The foreseen applications are Medical Imaging and X-ray systems. The new bumping technique developed will greatly improve the simplicity and the cost of the packaging process.

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Research paper thumbnail of Radiation detector, method of manufacturing a radiation detector and use of the detector for measuring radiation

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Technology development of 3D detectors for high energy physics and medical imaging

Various fabrications routes to create '3D'detectors hav... more Various fabrications routes to create '3D'detectors have been investigated and the electrical characteristics of these structures have been compared to simulations. The geometry of the detectors is hexagonal with a central anode surrounded by six cathode contacts. A ...

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Research paper thumbnail of Radiation Hardness Tests of Double-Sided 3D Detectors

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Direct charge sharing observation in single-photon-counting pixel detector

Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment

Bookmarks Related papers MentionsView impact

Research paper thumbnail of 3D cylindrical silicon microdosimeters: fabrication, simulation and charge collection study

Journal of Instrumentation, 2015

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Radiation damage of SiGe HBT Technologies at different bias configurations

SiGe BiCMOS technologies are being proposed for the Front-end readout of the detectors in the mid... more SiGe BiCMOS technologies are being proposed for the Front-end readout of the detectors in the middle region of the ATLAS-Upgrade. The radiation hardness of the SiGe bipolar transistors is being assessed for this application through irradiations with different particles. Biasing conditions during irradiation of bipolar transistors or circuits have an influence on the damage and there is a risk of erroneous results. We have performed several irradiation experiments of SiGe devices from IHP in different bias conditions. We have observed a systematic trend in gamma irradiations, showing a smaller damage in transistors irradiated biased compared to shorted or floating terminals.

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Ionizing radiation detector sensitive to the 2d position

Bookmarks Related papers MentionsView impact

Research paper thumbnail of High-Performance Magneto-Optic Surface Plasmon Resonance Sensor Design: An Optimization Approach

Plasmonics

High-performance intensity-interrogated magneto-optic surface plasmon resonance (MOSPR) sensors a... more High-performance intensity-interrogated magneto-optic surface plasmon resonance (MOSPR) sensors are designed by a multi-objective optimization approach. Designed devices show bulk refractive index sensitivity 1 order of magnitude larger than the current state of the art, while the design procedure allows to chose an appropriate trade-off between sensor performance and ease of fabrica-tion. Straightforward guidelines for the sensor design and fabrication emerge from the optimization process, indicat-ing that minimization of the optical losses takes precedence on the maximization of the magneto-optical modulation.

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Research paper thumbnail of Detection of Early Markers in Mammography Project

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Charge sharing measurements of pixilated CdTe using Medipix-II chip

Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510), 2004

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Research paper thumbnail of Silicon-based three-dimensional microstructures for radiation dosimetry in hadrontherapy

Applied Physics Letters, 2015

ABSTRACT

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Research paper thumbnail of CdTe/CZT pixel detector for gamma-ray spectrometry with imaging and polarimetry capability in astrophysics

Gamma-ray astrophysics in the MeV energy range plays a crucial role for the understanding of many... more Gamma-ray astrophysics in the MeV energy range plays a crucial role for the understanding of many exciting cosmic phenomena such as stellar explosions or cosmic accelerators (e.g., Supernovae, Novae, Supernova Remants (SNRs), Gamma-Ray Bursts (GRBs), Pulsars, etc). Cadmium Telluride (CdTe) and Cadmium Zinc Telluride (CdZnTe) are very attractive materials for gamma-ray detection, which have demonstrated a great potential onboard current space missions (such as IBIS/INTEGRAL and BAT/SWIFT). However, the energy coverage of these instruments has been limited up to a few hundred keV, and there has not been yet a dedicated instrument for polarimetry. Our technological activities aim to develop a gamma-ray spectrometer based on Cd(Zn)Te detectors, with imaging and polarimetry capability for astrophysical applications, in the energy range from a few hundred keV up to a few MeV. Within this framework, a gamma-ray polarimeter based on pixelated Cd(Zn)Te detectors in planar-transverse-field (P...

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Technology Development of 3D Detectors for Medical Imaging

Fabrication routes to realising '3D' detectors in gallium arsenide (GaAs) have been inves... more Fabrication routes to realising '3D' detectors in gallium arsenide (GaAs) have been investigated and their electrical characteristics measured. The geometry of the detector is hexagonal with a central anode surrounded by six cathode contacts. This geometry gives a uniform electric field with the maximum drift and depletion distance set by electrode spacings rather than detector thickness. The advantages of this

Bookmarks Related papers MentionsView impact

Research paper thumbnail of 10μm thin transmissive photodiode produced by ALBA Synchrotron and IMB-CNM-CSIC

Journal of Instrumentation, 2015

ABSTRACT Thin silicon photodiodes are common X-ray beam diagnosis devices at synchrotron faciliti... more ABSTRACT Thin silicon photodiodes are common X-ray beam diagnosis devices at synchrotron facilities. Here we present a new device featuring an extremely thin layer that allows X-ray transmission over 90% for energies above 10 keV. The diode has a radiation-hard silicon junction with silicon dioxide passivation and a protective entrance window. These outstanding features make this device suited for diagnostic applications in X-ray synchrotron beamlines. Hereby preliminary results of X-ray transmission, responsivity and uniformity are presented.

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Journal Article

The ABCD3TA is a 128-channel ASIC with binary architecture for the readout of silicon strip parti... more The ABCD3TA is a 128-channel ASIC with binary architecture for the readout of silicon strip particle detectors in the Semiconductor Tracker of the ATLAS experiment at the Large Hadron Collider (LHC). The chip comprises fast front-end and amplitude discriminator circuits using bipolar devices, a binary pipeline for first level trigger latency, a second level derandomising buffer and data compression circuitry based on CMOS devices. It has been designed and fabricated in a BiCMOS radiation resistant process. Extensive testing of the ABCD3TA chips assembled into detector modules show that the design meets the specifications and maintains the required performance after irradiation up to a total ionising dose of 10 Mrad and a 1-MeV neutron equivalent fluence of 2×1014 n/cm2, corresponding to 10 years of operation of the LHC at its design luminosity. Wafer screening and quality assurance procedures have been developed and implemented in large volume production to ensure that the chips ass...

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Characterisation of Glasgow/CNM Double-Sided 3D Sensors

Physics Procedia, 2012

ABSTRACT 3D detectors are proposed as an alternative to planar silicon technology to withstand th... more ABSTRACT 3D detectors are proposed as an alternative to planar silicon technology to withstand the high radiation environments in planned future high energy physics experiments. Here we review the characterization of double-sided 3D detectors designed and built at CNM and the University of Glasgow. A non-irradiated sensor is characterized in a pion test-beamutilizing the Timepix telescope. The charge collection and detection efficiency across the unit pixel are shown. Area of inefficiency can be found at the columnar electrodes at perpendicular angles of beam incidence while the pixels are shown to be fully efficient at angles greater than ten degrees. A reduction in charge sharing compared to the planar technology is also demonstrated. Charge collection studies on irradiated devices with a Sr-90 source show higher charge collection efficiency for 3D over planar sensors at significantly lower applied bias. The sub-pixel response is probed by a micro-focused laser beam demonstrating areas of charge multiplication at high bias voltages. (C) 2012 Published by Elsevier B. V. Selection and/or peer review under responsibility of the organizing committee for TIPP 11.

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