International Symposium on Physical Design 2021 (original) (raw)

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ISPD 2021: Virtual Event, USA

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  • Session 1: Opening Session and First Keynote
  • Session 2: Machine Learning for Physical Design (1/2)
  • Session 3: Advances in Placement
  • Session 4: Driving Research in Placement: a Retrospective
  • Session 6: Second Keynote
  • Session 7: Machine Learning for Physical Design (2/2)
  • Session 8: Monolithic 3D and Packaging Session
  • Session 9: Brains, Computers and EDA
  • Session 11: Third Keynote
  • Session 12: Physical Design at Advanced Technology Nodes
  • Session 13: Contest and Results

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• > Home > Conferences and Workshops > ISPD

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    Jens Lienig, Laleh Behjat, Stephen Yang:
    ISPD '21: International Symposium on Physical Design, Virtual Event, USA, March 22-24, 2021. ACM 2021, ISBN 978-1-4503-8300-4

Session 1: Opening Session and First Keynote

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    Frank J. C. Lee:
    Physical Design for 3D Chiplets and System Integration. 1

Session 2: Machine Learning for Physical Design (1/2)

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    Matthew E. Taylor:
    Reinforcement Learning for Electronic Design Automation: Successes and Opportunities. 3
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    Anna Goldie, Azalia Mirhoseini:
    Reinforcement Learning for Placement Optimization. 5
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    Yi-Chen Lu, Sai Pentapati, Sung Kyu Lim:
    The Law of Attraction: Affinity-Aware Placement Optimization using Graph Neural Networks. 7-14

Session 3: Advances in Placement

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    Andrew B. Kahng:
    Advancing Placement. 15-22
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    Stefan Hougardy, Meike Neuwohner, Ulrike Schorr:
    A Fast Optimal Double Row Legalization Algorithm. 23-30
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    Bo-Yang Chen, Chi-Chun Fang, Wai-Kei Mak, Ting-Chi Wang:
    Multiple-Layer Multiple-Patterning Aware Placement Refinement for Mixed-Cell-Height Designs. 31-38
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    Pruek Vanna-Iampikul, Chengjia Shao, Yi-Chen Lu, Sai Pentapati, Sung Kyu Lim:
    Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs. 39-46

Session 4: Driving Research in Placement: a Retrospective

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    Ismail S. Bustany, Jinwook Jung, Patrick H. Madden, Natarajan Viswanathan, Stephen Yang:
    Still Benchmarking After All These Years. 47-52

Session 6: Second Keynote

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    Ivo Bolsens:
    Scalable System and Silicon Architectures to Handle the Workloads of the Post-Moore Era. 53-54

Session 7: Machine Learning for Physical Design (2/2)

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    Wei Li, Guojin Chen, Haoyu Yang, Ran Chen, Bei Yu:
    Learning Point Clouds in EDA. 55-62
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    Bentian Jiang, Xiaopeng Zhang, Lixin Liu, Evangeline F. Y. Young:
    Building up End-to-end Mask Optimization Framework with Self-training. 63-70
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    Tonmoy Dhar, Kishor Kunal, Yaguang Li, Yishuang Lin, Meghna Madhusudan, Jitesh Poojary, Arvind K. Sharma, Steven M. Burns, Ramesh Harjani, Jiang Hu, Parijat Mukherjee, Soner Yaldiz, Sachin S. Sapatnekar:
    Machine Learning Techniques in Analog Layout Automation. 71-72

Session 8: Monolithic 3D and Packaging Session

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    Gage Hills:
    Advances in Carbon Nanotube Technologies: From Transistors to a RISC-V Microprocessor. 73
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    Sai Surya Kiran Pentapati, Bon Woong Ku, Sung Kyu Lim:
    ML-Based Wire RC Prediction in Monolithic 3D ICs with an Application to Full-Chip Optimization. 75-82
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    Siddhartha Nath, Vishal Khandelwal:
    Machine Learning-Enabled High-Frequency Low-Power Digital Design Implementation At Advanced Process Nodes. 83-90
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    Jai-Ming Lin, Yang-Tai Kung, Zheng-Yu Huang, I-Ru Chen:
    A Fast Power Network Optimization Algorithm for Improving Dynamic IR-drop. 91-98

Session 9: Brains, Computers and EDA

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    Louis K. Scheffer:
    A Lifetime of ICs, and Cross-field Exploration: ISPD 2021 Lifetime Achievement Award Bio. 99-100
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    Louis K. Scheffer:
    The Physical Design of Biological Systems - Insights from the Fly Brain. 101-108
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    Jan M. Rabaey:
    Of Brains and Computers. 109
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    Leon Stok:
    EDA and Quantum Computing: The key role of Quantum Circuits. 111

Session 11: Third Keynote

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    Juan C. Rey:
    Physical Verification at Advanced Technology Nodes and the Road Ahead. 113

Session 12: Physical Design at Advanced Technology Nodes

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    Johann Knechtel:
    Hardware Security for and beyond CMOS Technology. 115-126
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    Lingjun Zhu, Sung Kyu Lim:
    Physical Design Challenges and Solutions for Emerging Heterogeneous 3D Integration Technologies. 127-134
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    Ganesh Gore, Xifan Tang, Pierre-Emmanuel Gaillardon:
    A Scalable and Robust Hierarchical Floorplanning to Enable 24-hour Prototyping for 100k-LUT FPGAs. 135-142

Session 13: Contest and Results

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    Patrick Groeneveld, Michael James, Vladimir Kibardin, Ilya Sharapov, Marvin Tom, Leo Wang:
    ISPD 2021 Wafer-Scale Physics Modeling Contest: A New Frontier for Partitioning, Placement and Routing. 143-147

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