Simultaneous microwave characterization of wafer-level optoelectronic transceiver chips based on photonic sampling and mapping (original) (raw)
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Acknowledgements
This work was supported by National Natural Science Foundation of China (Grant No. 61927821) and Fundamental Research Funds for the Central Universities (Grant No. ZYGX2019Z011).
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Author notes
- He Y T and Zou X H have the same contribution to this work.
Authors and Affiliations
- Research Center for Microwave Photonics, State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Optoelectronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, 610054, China
Yutong He, Xinhai Zou, Ying Xu, Yali Zhang, Zhiyao Zhang, Shangjian Zhang & Yong Liu - Chongqing United Microelectronics Center (CUMEC), Chongqing, 400031, China
Zhihui Li, Naidi Cui & Junbo Feng - Xiongan Institute of Innovation, Chinese Academy of Sciences, Xiongan, 071899, China
Ninghua Zhu
Authors
- Yutong He
- Xinhai Zou
- Ying Xu
- Zhihui Li
- Naidi Cui
- Junbo Feng
- Yali Zhang
- Zhiyao Zhang
- Shangjian Zhang
- Yong Liu
- Ninghua Zhu
Corresponding author
Correspondence toShangjian Zhang.
Additional information
Supporting information Appendixes A–E. The supporting information is available online at info.scichina.com and link.springer.com. The supporting materials are published as submitted, without typesetting or editing. The responsibility for scientific accuracy and content remains entirely with the authors.
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He, Y., Zou, X., Xu, Y. et al. Simultaneous microwave characterization of wafer-level optoelectronic transceiver chips based on photonic sampling and mapping.Sci. China Inf. Sci. 67, 129402 (2024). https://doi.org/10.1007/s11432-023-3866-4
- Received: 24 March 2023
- Revised: 30 June 2023
- Accepted: 12 September 2023
- Published: 25 January 2024
- Version of record: 25 January 2024
- DOI: https://doi.org/10.1007/s11432-023-3866-4