ts of thin-oxide devices and 12 layers of Cu-based metallization. This 28nm technology is a density-focused version of the 28nm technology used by Steamroller (SR) [1] featuring eight 1× metals for dense routing, one 2× and one 4× for low-RC routing and two 16x metals for power distribution.">

4.8 A 28nm x86 APU optimized for power and area efficiency (original) (raw)

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