2 bandwidth density. Measurements of the fabricated SiP validate the functionality and performance of the cores, on-die data bus, and inter-chiplet link. The built-in LIPINCON eye-scan feature validates inter-chiplet connectivity at 8.0 Gb/s with an eye opening of 244 mV and 0.69 UI.">

A 7-nm 4-GHz Arm¹-Core-Based CoWoS¹ Chiplet Design for High-Performance Computing (original) (raw)

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