형수 이 - Academia.edu (original) (raw)

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Papers by 형수 이

Research paper thumbnail of KS Compression Test

KITECH Force (-KN) vs Position (mm)

Research paper thumbnail of ScienceDirect Advanced molds and methods for the fundamental analysis of process induced interface bonding properties of hybrid, thermoplastic composites

Hybrid thermoplastic composites play an increasingly important role in lightweight applications. ... more Hybrid thermoplastic composites play an increasingly important role in lightweight applications. One key challenge in the intrinsic hybridization is to achieve an adequate interface bonding strength. In order to optimize the interface strength specific methods for characterization and process monitoring need to be developed. Thus, within this paper two advanced mold concepts are presented allowing online monitoring of the welding conditions at the spot and time of interest. The resulting part geometries are optimized for characterization of interface properties in a defined and reliable manner. Regarding this, adopted characterization setups are presented and validated allowing the characterization of three stress states.

Research paper thumbnail of KS Compression Test

KITECH Force (-KN) vs Position (mm)

Research paper thumbnail of ScienceDirect Advanced molds and methods for the fundamental analysis of process induced interface bonding properties of hybrid, thermoplastic composites

Hybrid thermoplastic composites play an increasingly important role in lightweight applications. ... more Hybrid thermoplastic composites play an increasingly important role in lightweight applications. One key challenge in the intrinsic hybridization is to achieve an adequate interface bonding strength. In order to optimize the interface strength specific methods for characterization and process monitoring need to be developed. Thus, within this paper two advanced mold concepts are presented allowing online monitoring of the welding conditions at the spot and time of interest. The resulting part geometries are optimized for characterization of interface properties in a defined and reliable manner. Regarding this, adopted characterization setups are presented and validated allowing the characterization of three stress states.

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