A Khairyanto - Academia.edu (original) (raw)
Papers by A Khairyanto
Virtual and Physical Prototyping, 2018
3-Dimensional (3D) scanning systems are becoming more common in the industry nowadays, for inspec... more 3-Dimensional (3D) scanning systems are becoming more common in the industry nowadays, for inspection and reverse engineering (RE) purposes. Although technical specifications are provided with commercially available scanners, a question could be raised pertaining to the degree of sufficiency of the technical specifications typically provided, with regard to specific application needs such as the scanning of challenging objects. These challenging objects present a less than ideal working condition for some 3D scanners, and the specified accuracy cannot be achieved. This effect varies across different types of 3D scanning technology. A more intuitive specification with regard to the time taken and ease of use will be beneficial to the user, but often not available. Hence, this paper proposes a Morphological Box Classification Framework based on the functional decomposition of the non-contact 3D scanning technology, in order to help users better understand and compare 3D scanners efficiently, and choose a scanner for their application that is able to perform within their desired accuracy, time taken, and ease of use. A case study of 3D scanners evaluation using the proposed framework for a RE application is conducted, and results presented.
2018 Joint 7th International Conference on Informatics, Electronics & Vision (ICIEV) and 2018 2nd International Conference on Imaging, Vision & Pattern Recognition (icIVPR), 2018
Automated remanufacturing process has been of interest to many industries. However, up to now, a ... more Automated remanufacturing process has been of interest to many industries. However, up to now, a fully automated remanufacturing process has not been implemented yet. One of the reasons is due to the technical limitations in the damage boundary detection. In this paper, a damage boundary detection algorithm for partially scanned models is presented. This algorithm consists of three parts: scanning boundary identification, facet angle thresholding and open-ended edges elimination. An experimental test to validate this algorithm was carried out. The result showed that this damage boundary detection algorithm can successfully detect the damage boundary of a virtually created model even with some common engineering features such as chamfer, fillet and sharp corner in it.
Automated remanufacturing or repair is of great interest in many industries. Most of the current ... more Automated remanufacturing or repair is of great interest in many industries. Most of the current remanufacturing processes are carried out manually, and hence, they are prone to human error, inconsistent in quality, and costly. Several research works have been performed towards achieving an automated remanufacturing process. However, up until now, a fully automated remanufacturing process has not yet been achieved. This may due to some technical limitations in automating the process. Therefore, this paper attempts to review the current state-of-the-art developments of automating the remanufacturing process and aims to provide directions for the future works. A framework that describes the automated remanufacturing process flow is also proposed.
Measurement and dimensioning is the primary purpose of the pre-processing stage in many generaliz... more Measurement and dimensioning is the primary purpose of the pre-processing stage in many generalized strategies for parts repair/remanufacturing. This work reports on a low cost system for the dimensioning of worn out parts. The system consists of both mechanical element made up of a Hokuyo URG-04LX-UG01 2D scanning laser rangefinder and a rotating mechanism actuated by a Dynamixel MX-28 servomotor and consolidated software element integrating motion control and point cloud generation. A case study involving the scanning of a rack is reported.
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011
An IMC based low temperature solder <200 °C with AuInSn compos... more An IMC based low temperature solder <200 °C with AuInSn composition is developed for 3D IC stacking application. Thermodynamic and mechanical simulations are conducted to study the phase change during the melting temperature and the stress due to the thin solder material. A three layer stack bonding with the developed solder has been characterized after bonding and reliability test. It
2009 59th Electronic Components and Technology Conference, 2009
Low temperature bonding technology was developed using In-alloy on Au at a low temperature below ... more Low temperature bonding technology was developed using In-alloy on Au at a low temperature below 200 o C forming robust intermetallics (IMC) joints with high remelting temperature (>300 o C), so that after bonding, the IMC joints can withstand the subsequent processes without any degradation. Process parameters on the solder joint were optimized extensively in bonding and annealing process (temperature, time, and pressure). The joint fabricated at an optimal condition, which is 180 o C for 45sec followed by annealing at 120 o C for 12hrs, was evaluated in terms of microstructure and compositional observations by means of scanning electron microscope (SEM) and transmittance electron microscope (TEM). As a result, it was confirmed that the joint was completely occupied with the Au-In based IMC phases. And the re-melting temperature was measured as above 400 o C by using Differential Scanning Calorimetery (DSC) and Thermo-Mechanical Analysis (TMA). This IMC joint showed a high bonding shear strength (>20MPa) and a low electrical resistance (<100mΩ). Based on this study, the 3 stacked dice with 8x8 mm 2 dies with ~1700 I/Os of 80um solder bumps were fabricated in a chip to chip stacking method. It showed uniform bonding all over the die in each layer and the high bonding strength of ~40 MPa and passed the 3 times reflow test at 260 o C. The IMC joint reliability was examined. After going through the multiple reflows at 260 o C, the bonded samples exhibited no delaminating and no changes in the bonding strength and the electrical resistance. 1 st Chip Back In-based Solder 3 rd Chip 2 nd Chip Face Through Si Via (TSV) Face Back
Volume 2: 31st Design Automation Conference, Parts A and B, 2005
With the advent of robots in modern-day manufacturing workcells, optimization of robotic workcell... more With the advent of robots in modern-day manufacturing workcells, optimization of robotic workcell layout (RWL) is crucial in ensuring the minimization of the production cycle time. Although RWL share many aspects with the well-known facility layout problem (FLP), there are features which set the RWL apart. However, the common features which they share enable approaches in FLP to be ported over to RWL. One heuristic gaining popularity is genetic algorithm (GA). In this paper, we present a GA approach to optimizing RWL by using the distance covered by the robot arm as a means of gauging the degree of optimization. The approach is constructive: the different stations within the workcell are placed one by one in the development of the layout. The placement method adopted is based on the spiral placement method first broached by Islier (1998). The algorithm was implemented in Visual C++ and a case study assessed its performance.
Problems of bilevel nature are inextricably linked to decentralized problems involving multiple d... more Problems of bilevel nature are inextricably linked to decentralized problems involving multiple decision-making typically with multiple objectives, as are those characterized by Nash equilibrium and variations of the Pareto optimization. These problems are to be found within a wide array of seemingly disparate engineering topics ranging from multidisciplinary complex system design to multi-echelon decentralized inventory planning. Due to the potential for different forms of decision-making (i.e. cooperative,
MOEMS and Miniaturized Systems VII, 2008
... E.Brezinski,Brett E.Bouma,Stephen A.Boppart, Costas Pitris,James F.Southern,James G.fujimoto ... more ... E.Brezinski,Brett E.Bouma,Stephen A.Boppart, Costas Pitris,James F.Southern,James G.fujimoto “ In Vivo Endoscopic Optical Biopsy with Optical Coherence Tomography” Science ,Vol.276,27 June 1997 pp2037-2039 3. Zahid Yaqoob, Jigang Wu, Emily J.McDowell, Xin Heng, ...
2008 58th Electronic Components and Technology Conference, 2008
2008 10th Electronics Packaging Technology Conference, 2008
Journal of Micromechanics and Microengineering, 2008
IEEE Transactions on Advanced Packaging, 2000
A miniaturized optical bioprobe package is developed using a 3-D micromirror and is tested for bi... more A miniaturized optical bioprobe package is developed using a 3-D micromirror and is tested for bio-imaging application. A silicon optical bench is designed and micromachined to assemble the fiber, lens, and the 3-D micromirror device. A 45 angle trench is used to place the micromirror to achieve larger scanning range. Trace lines are formed on the optical bench and are connected to silicon micromirror using solder. A GRIN lens with lower numerical aperture has been used to focus the optical beam onto the micromirror. The bioprobe is packaged and is tested in a time domain optical coherence tomography (OCT) setup and optical image is obtained for plant tissue.
2008 58th Electronic Components and Technology Conference, 2008
... CS Premachandran, John Lau, Ling Xie, Ahmad Khairyanto, Kelvin Chen , Myo Ei Pa Pa, Michelle ... more ... CS Premachandran, John Lau, Ling Xie, Ahmad Khairyanto, Kelvin Chen , Myo Ei Pa Pa, Michelle Chew and Won Kyoung Choi Institute of ... packaging using through hole filled via by liftoff polymer method for MEMS and 3D stack application ECTC May 2005, Las Vegas USA 2 ...
Virtual and Physical Prototyping, 2018
3-Dimensional (3D) scanning systems are becoming more common in the industry nowadays, for inspec... more 3-Dimensional (3D) scanning systems are becoming more common in the industry nowadays, for inspection and reverse engineering (RE) purposes. Although technical specifications are provided with commercially available scanners, a question could be raised pertaining to the degree of sufficiency of the technical specifications typically provided, with regard to specific application needs such as the scanning of challenging objects. These challenging objects present a less than ideal working condition for some 3D scanners, and the specified accuracy cannot be achieved. This effect varies across different types of 3D scanning technology. A more intuitive specification with regard to the time taken and ease of use will be beneficial to the user, but often not available. Hence, this paper proposes a Morphological Box Classification Framework based on the functional decomposition of the non-contact 3D scanning technology, in order to help users better understand and compare 3D scanners efficiently, and choose a scanner for their application that is able to perform within their desired accuracy, time taken, and ease of use. A case study of 3D scanners evaluation using the proposed framework for a RE application is conducted, and results presented.
2018 Joint 7th International Conference on Informatics, Electronics & Vision (ICIEV) and 2018 2nd International Conference on Imaging, Vision & Pattern Recognition (icIVPR), 2018
Automated remanufacturing process has been of interest to many industries. However, up to now, a ... more Automated remanufacturing process has been of interest to many industries. However, up to now, a fully automated remanufacturing process has not been implemented yet. One of the reasons is due to the technical limitations in the damage boundary detection. In this paper, a damage boundary detection algorithm for partially scanned models is presented. This algorithm consists of three parts: scanning boundary identification, facet angle thresholding and open-ended edges elimination. An experimental test to validate this algorithm was carried out. The result showed that this damage boundary detection algorithm can successfully detect the damage boundary of a virtually created model even with some common engineering features such as chamfer, fillet and sharp corner in it.
Automated remanufacturing or repair is of great interest in many industries. Most of the current ... more Automated remanufacturing or repair is of great interest in many industries. Most of the current remanufacturing processes are carried out manually, and hence, they are prone to human error, inconsistent in quality, and costly. Several research works have been performed towards achieving an automated remanufacturing process. However, up until now, a fully automated remanufacturing process has not yet been achieved. This may due to some technical limitations in automating the process. Therefore, this paper attempts to review the current state-of-the-art developments of automating the remanufacturing process and aims to provide directions for the future works. A framework that describes the automated remanufacturing process flow is also proposed.
Measurement and dimensioning is the primary purpose of the pre-processing stage in many generaliz... more Measurement and dimensioning is the primary purpose of the pre-processing stage in many generalized strategies for parts repair/remanufacturing. This work reports on a low cost system for the dimensioning of worn out parts. The system consists of both mechanical element made up of a Hokuyo URG-04LX-UG01 2D scanning laser rangefinder and a rotating mechanism actuated by a Dynamixel MX-28 servomotor and consolidated software element integrating motion control and point cloud generation. A case study involving the scanning of a rack is reported.
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011
An IMC based low temperature solder &amp;amp;amp;amp;amp;amp;lt;200 °C with AuInSn compos... more An IMC based low temperature solder &amp;amp;amp;amp;amp;amp;lt;200 °C with AuInSn composition is developed for 3D IC stacking application. Thermodynamic and mechanical simulations are conducted to study the phase change during the melting temperature and the stress due to the thin solder material. A three layer stack bonding with the developed solder has been characterized after bonding and reliability test. It
2009 59th Electronic Components and Technology Conference, 2009
Low temperature bonding technology was developed using In-alloy on Au at a low temperature below ... more Low temperature bonding technology was developed using In-alloy on Au at a low temperature below 200 o C forming robust intermetallics (IMC) joints with high remelting temperature (>300 o C), so that after bonding, the IMC joints can withstand the subsequent processes without any degradation. Process parameters on the solder joint were optimized extensively in bonding and annealing process (temperature, time, and pressure). The joint fabricated at an optimal condition, which is 180 o C for 45sec followed by annealing at 120 o C for 12hrs, was evaluated in terms of microstructure and compositional observations by means of scanning electron microscope (SEM) and transmittance electron microscope (TEM). As a result, it was confirmed that the joint was completely occupied with the Au-In based IMC phases. And the re-melting temperature was measured as above 400 o C by using Differential Scanning Calorimetery (DSC) and Thermo-Mechanical Analysis (TMA). This IMC joint showed a high bonding shear strength (>20MPa) and a low electrical resistance (<100mΩ). Based on this study, the 3 stacked dice with 8x8 mm 2 dies with ~1700 I/Os of 80um solder bumps were fabricated in a chip to chip stacking method. It showed uniform bonding all over the die in each layer and the high bonding strength of ~40 MPa and passed the 3 times reflow test at 260 o C. The IMC joint reliability was examined. After going through the multiple reflows at 260 o C, the bonded samples exhibited no delaminating and no changes in the bonding strength and the electrical resistance. 1 st Chip Back In-based Solder 3 rd Chip 2 nd Chip Face Through Si Via (TSV) Face Back
Volume 2: 31st Design Automation Conference, Parts A and B, 2005
With the advent of robots in modern-day manufacturing workcells, optimization of robotic workcell... more With the advent of robots in modern-day manufacturing workcells, optimization of robotic workcell layout (RWL) is crucial in ensuring the minimization of the production cycle time. Although RWL share many aspects with the well-known facility layout problem (FLP), there are features which set the RWL apart. However, the common features which they share enable approaches in FLP to be ported over to RWL. One heuristic gaining popularity is genetic algorithm (GA). In this paper, we present a GA approach to optimizing RWL by using the distance covered by the robot arm as a means of gauging the degree of optimization. The approach is constructive: the different stations within the workcell are placed one by one in the development of the layout. The placement method adopted is based on the spiral placement method first broached by Islier (1998). The algorithm was implemented in Visual C++ and a case study assessed its performance.
Problems of bilevel nature are inextricably linked to decentralized problems involving multiple d... more Problems of bilevel nature are inextricably linked to decentralized problems involving multiple decision-making typically with multiple objectives, as are those characterized by Nash equilibrium and variations of the Pareto optimization. These problems are to be found within a wide array of seemingly disparate engineering topics ranging from multidisciplinary complex system design to multi-echelon decentralized inventory planning. Due to the potential for different forms of decision-making (i.e. cooperative,
MOEMS and Miniaturized Systems VII, 2008
... E.Brezinski,Brett E.Bouma,Stephen A.Boppart, Costas Pitris,James F.Southern,James G.fujimoto ... more ... E.Brezinski,Brett E.Bouma,Stephen A.Boppart, Costas Pitris,James F.Southern,James G.fujimoto “ In Vivo Endoscopic Optical Biopsy with Optical Coherence Tomography” Science ,Vol.276,27 June 1997 pp2037-2039 3. Zahid Yaqoob, Jigang Wu, Emily J.McDowell, Xin Heng, ...
2008 58th Electronic Components and Technology Conference, 2008
2008 10th Electronics Packaging Technology Conference, 2008
Journal of Micromechanics and Microengineering, 2008
IEEE Transactions on Advanced Packaging, 2000
A miniaturized optical bioprobe package is developed using a 3-D micromirror and is tested for bi... more A miniaturized optical bioprobe package is developed using a 3-D micromirror and is tested for bio-imaging application. A silicon optical bench is designed and micromachined to assemble the fiber, lens, and the 3-D micromirror device. A 45 angle trench is used to place the micromirror to achieve larger scanning range. Trace lines are formed on the optical bench and are connected to silicon micromirror using solder. A GRIN lens with lower numerical aperture has been used to focus the optical beam onto the micromirror. The bioprobe is packaged and is tested in a time domain optical coherence tomography (OCT) setup and optical image is obtained for plant tissue.
2008 58th Electronic Components and Technology Conference, 2008
... CS Premachandran, John Lau, Ling Xie, Ahmad Khairyanto, Kelvin Chen , Myo Ei Pa Pa, Michelle ... more ... CS Premachandran, John Lau, Ling Xie, Ahmad Khairyanto, Kelvin Chen , Myo Ei Pa Pa, Michelle Chew and Won Kyoung Choi Institute of ... packaging using through hole filled via by liftoff polymer method for MEMS and 3D stack application ECTC May 2005, Las Vegas USA 2 ...