Bassim Bachy - Academia.edu (original) (raw)

Papers by Bassim Bachy

Research paper thumbnail of Experimental lnvestigation, Modeling, Simulation and Optimization of Molded lnterconnect Devices (MID) Based on Laser Direct Structuring (LDS)

Die Arbeit dieser Arbeit konzentriert sich auf die MID-LDS-Technologie. Im Allgemeinen konzentrie... more Die Arbeit dieser Arbeit konzentriert sich auf die MID-LDS-Technologie. Im Allgemeinen konzentriert sie sich auf die Wirkung von LDS-Parametern, einschließlich Lasereinfallwinkel, Brennweite, Schraffur, Laserleistung, Lasergeschwindigkeit und Laserfrequenz auf die endgültigen Eigenschaften des strukturierten Bereichs, Genauigkeit, Qualität und Zuverlässigkeit des endgültigen MID-Produkts. Es enthält eine experimentelle Untersuchung, die auf dem DoE-Tool basiert, um die Korrelation zwischen angenommenen Parametern und entsprechenden Antworten zu beschreiben. Eine Computer-Simulation und Modellierung werden auch verwendet, um die Prozessleistung mit einfach zu modifizierenden Computermodellen vorherzusagen.

Research paper thumbnail of Simulation of Quenching Process by Numerical Heat Transfer Model

Research paper thumbnail of Mathematical Model to Investigate the Temperature and Hardness Distributions During the Annealing and Normalizing Treatment

Intelligent Transportation Systems Journal

Research paper thumbnail of Modeling and optimization of laser direct structuring process using artificial neural network and response surface methodology

International Journal of Industrial Engineering Computations, 2015

Laser direct structuring (LDS) is very important step in the MID process and it is a complex proc... more Laser direct structuring (LDS) is very important step in the MID process and it is a complex process due to different parameters, which influence on this process and its final product. Therefore, it is very important to use a reliable model to predict, analyze and control the performance of the (LDS) process and the quality of the final product. In this work we develop mathematical models by using Artificial Neural Network (ANN) and Response Surface Methodology (RSM) to study this process. The proposed models are used to study the effect of the LDS parameters on the groove dimensions (width and depth), lap dimensions (groove lap width and height) and finally the heat effective zone (interaction width), which are important to determine the line width/space in the MID products and the metallization profile after the metallization step. We also study the relationship between the LDS parameters and the surface roughness which is very important factor for the adhesion strength of MID structures. Moreover these models capable of finding a set of optimum LDS parameters that provide the required micro-channel dimensions with the best or the suitable surface roughness. A set of experimental tests are carried out to validate the developed ANN and the RSM models. It has been found that the predicted values for the proposal ANN and RSM models were closer to the experimental values, and the overall average absolute percentage errors were 4.02 % and 6.52%, respectively. Finally, it has been found that, the developed ANN model could be used to predict the response of the LDS process more accurately than RSM model.

Research paper thumbnail of Simulation of laser structuring by three dimensional heat transfer model

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014

In this study, a three dimensional numerical heat transfer model has been used to simulate the la... more In this study, a three dimensional numerical heat transfer model has been used to simulate the laser structuring of polymer substrate material in the Three-Dimensional Molded Interconnect Device (3D MID) which is used in the advanced multifunctional applications. A finite element method (FEM) transient thermal analysis is performed using APDL (ANSYS Parametric Design Language) provided by ANSYS. In this model, the effect of surface heat source was modeled with Gaussian distribution, also the effect of the mixed boundary conditions which consist of convection and radiation heat transfers have been considered in this analysis. The model provides a full description of the temperature distribution, as well as calculates the depth and the width of the groove upon material removal at different set of laser parameters such as laser power and laser speed. This study also includes the experimental procedure to study the effect of laser parameters on the depth and width of the removal groove metal as verification to the modeled results. Good agreement between the experimental and the model results is achieved for a wide range of laser powers. It is found that the quality of the laser structure process is affected by the laser scan speed and laser power. For a high laser structured quality, it is suggested to use laser with high speed and moderate to high laser power.

Research paper thumbnail of On the quality and the accuracy of the laser direct structuring, experimental investigation and optimization

Journal of Laser Applications, 2018

The enormous applications of the molded interconnect devices (MID) make these face many difficult... more The enormous applications of the molded interconnect devices (MID) make these face many difficult challenges, some of which are the quality and the reliability, as well as concerns on how to produce the micro-MID products. This drives to a hard competition between the different methods used in the MID technology. The laser direct structuring (LDS) has clearly been distinguished as the best method in comparison with the other MID processes. However, it also needs more development, especially in terms of the quality, accuracy, and their impact on the final MID quality of the two- (2D) and three-dimensional (3D) micro and normal products, especially with the decline or the limited availability of information in both of the industry and scientific research. In this work, the MID-LDS has been experimentally investigated by considering the effect of the important process parameters on the process responses and then to explore the relationship between these responses and the final MID qual...

Research paper thumbnail of Influence of the effective parameters on the quality of laser micro-cutting process: Experimental analysis, modeling and optimization

Surface roughness (Ra) after the laser micro-cutting process plays an important role in the quali... more Surface roughness (Ra) after the laser micro-cutting process plays an important role in the quality of the final product. On the other hand, this surface roughness depends on complex laser process parameters such as laser power, laser repetition rate, and laser scanning speed. Therefore, it is important to propose a reliable model to predict the surface roughness as well as to correlate it with important process parameters. This helps to achieve the highest required quality, reduce the effort, and save material wastage and cost for the required experimental tests. In this paper, mathematical models have been developed using Artificial Neural Network (ANN) and theoretical calculations to predicate the surface roughness for the substrate surface after laser micro-cutting. Moreover, these models can be used to find the importance of each process parameter and finally to propose the optimum process parameters. Experimental tests have been carried out to find out the relationship between...

Research paper thumbnail of Simulation and experimental investigation for the 2D and 3D laser direct structuring process

The molded interconnected devices (MID) technology is vastly growing as an important innovative t... more The molded interconnected devices (MID) technology is vastly growing as an important innovative technology in the field of electronics production. The laser direct structuring (LDS) method is one of the most common available technologies for building up MID’s products. The current existing knowledge in industry and in research about the standards in the respective manufacturing processes and process parameters is up to now not fully comprehensive in terms of mutual influencing and dependencies on each other. This is particularly the case for the three-dimensional applications and micro products. In the present contribution, a new simulation procedures based on a three-dimensional finite element model (FEM) has been developed. The effect of each of latent heat of fusion and temperature on the material properties as well as the 3D Gaussian heat source for the laser beam has been considered in this work. The used material was a polymer plate poly ether ether ketone (PEEK). The effect o...

Research paper thumbnail of Simulation, Optimization and Experimental Verification of the Over–Pressure Reflow Soldering Process

Procedia CIRP, 2017

Abstract The advanced technologies for electronics production and convection based soldering tech... more Abstract The advanced technologies for electronics production and convection based soldering technologies are growing steadily. The enhanced reflow soldering oven with an integrated hyper pneumatic module ensures a void-free solder connection, but it requires design and installation of the process parameters in the oven in order to ensure optimized heat transfer and derive the best energy efficiency performance. This paper presents a simulation model of the thermal soldering process in the over-pressure convection oven by finite element model. This model considers the effect of the complex boundary conditions during the soldering process. A set of experimental tasks were designed to investigate the variations in the temperature profiles at selected points on the surface of the demonstrator. Moreover, the heat transfer coefficient for each thermal profile has been calculated. The simulation model can be used to predict the temperature distribution for the solder materials together with the demonstrator board. The void content in the solder material was investigated by the X-Ray analysis and correlated with the thermal process in the simulation. Hence, the optimized relation between the process set-up parameters in the oven, simulated thermal behavior, and the voids fraction in solder material are studied in detail.

Research paper thumbnail of Laser-assisted Selective Activation of Injection Molded Chip Packaging Devices with Thermoset Substrate Materials for Intelligent Connectivity Systems in Automobiles

Procedia CIRP, 2017

Abstract The development of sensors, such as in the automotive sector is characterized by increas... more Abstract The development of sensors, such as in the automotive sector is characterized by increasing miniaturization and variety. Higher integration of functions in electrical and mechanical applications is therefore a logical consequence for further development. In this connection especially technologies can persuade, enabling high design flexibility, combination of electrical and mechanical functions and embedding of further applications. Mechatronic integrated devices are a considerable solution combining mechanical and various electrical functions in an entire component together. Specifically, the ability for insert moulding of MEMS sensor chips and the ability to create circuit carrier in nearly any shape with selective traces and laser drilled vias suite for this production method. A particular focus is on the durability of very fine conductor tracks. With increasing miniaturization especially in high temperature and high voltage applications the typical thermoplastic based substrate materials with their thin chemical plated circuits, reach boundaries in the thermal and mechanical properties. The use of thermoset materials provides a new suitable alternative in this field. The cross-linked, molecular structured thermosets obtain high temperature resistance, combined with high dimensional stability. The thermal expansion is comparative low. With appropriate selection of compound fillers, aligned laser activation parameters and suitable circuit plating system a reliable CTE composition of all materials can be achieved. Thermosetting plastic compounds with laser-activatable additives are indeed in focus of current researches. However, laser-based method for the selective activation of thermosets is currently not available on the market. As a result, it is investigated into alternative laser assisted activation methods which do not require special additives in the substrate compound for electro chemical potential. Instead an assimilated chemical palladium activation is utilized subsequently. Of particular importance is distinct and selective activation with suitable laser parameters, as well as the following electroless chemical copper and additionally galvanic copper plating with appropriate surface quality for electronic surface mount and assembly technologies. Within the article, the research results will be presented, describing the method and giving an insight into the qualified process parameters for the laser and palladium activation, their correlations among themselves as well as the implications onto the following chemical and galvanic plating.

Research paper thumbnail of Novel Ceramic-Based Material for the Applications of Molded Interconnect Devices (3D-MID) Based on Laser Direct Structuring

Advanced Engineering Materials

Research paper thumbnail of Experimental lnvestigation, Modeling, Simulation and Optimization of Molded lnterconnect Devices (MID) Based on Laser Direct Structuring (LDS)

Die Arbeit dieser Arbeit konzentriert sich auf die MID-LDS-Technologie. Im Allgemeinen konzentrie... more Die Arbeit dieser Arbeit konzentriert sich auf die MID-LDS-Technologie. Im Allgemeinen konzentriert sie sich auf die Wirkung von LDS-Parametern, einschließlich Lasereinfallwinkel, Brennweite, Schraffur, Laserleistung, Lasergeschwindigkeit und Laserfrequenz auf die endgültigen Eigenschaften des strukturierten Bereichs, Genauigkeit, Qualität und Zuverlässigkeit des endgültigen MID-Produkts. Es enthält eine experimentelle Untersuchung, die auf dem DoE-Tool basiert, um die Korrelation zwischen angenommenen Parametern und entsprechenden Antworten zu beschreiben. Eine Computer-Simulation und Modellierung werden auch verwendet, um die Prozessleistung mit einfach zu modifizierenden Computermodellen vorherzusagen.

Research paper thumbnail of Simulation of Quenching Process by Numerical Heat Transfer Model

Research paper thumbnail of Mathematical Model to Investigate the Temperature and Hardness Distributions During the Annealing and Normalizing Treatment

Intelligent Transportation Systems Journal

Research paper thumbnail of Modeling and optimization of laser direct structuring process using artificial neural network and response surface methodology

International Journal of Industrial Engineering Computations, 2015

Laser direct structuring (LDS) is very important step in the MID process and it is a complex proc... more Laser direct structuring (LDS) is very important step in the MID process and it is a complex process due to different parameters, which influence on this process and its final product. Therefore, it is very important to use a reliable model to predict, analyze and control the performance of the (LDS) process and the quality of the final product. In this work we develop mathematical models by using Artificial Neural Network (ANN) and Response Surface Methodology (RSM) to study this process. The proposed models are used to study the effect of the LDS parameters on the groove dimensions (width and depth), lap dimensions (groove lap width and height) and finally the heat effective zone (interaction width), which are important to determine the line width/space in the MID products and the metallization profile after the metallization step. We also study the relationship between the LDS parameters and the surface roughness which is very important factor for the adhesion strength of MID structures. Moreover these models capable of finding a set of optimum LDS parameters that provide the required micro-channel dimensions with the best or the suitable surface roughness. A set of experimental tests are carried out to validate the developed ANN and the RSM models. It has been found that the predicted values for the proposal ANN and RSM models were closer to the experimental values, and the overall average absolute percentage errors were 4.02 % and 6.52%, respectively. Finally, it has been found that, the developed ANN model could be used to predict the response of the LDS process more accurately than RSM model.

Research paper thumbnail of Simulation of laser structuring by three dimensional heat transfer model

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014

In this study, a three dimensional numerical heat transfer model has been used to simulate the la... more In this study, a three dimensional numerical heat transfer model has been used to simulate the laser structuring of polymer substrate material in the Three-Dimensional Molded Interconnect Device (3D MID) which is used in the advanced multifunctional applications. A finite element method (FEM) transient thermal analysis is performed using APDL (ANSYS Parametric Design Language) provided by ANSYS. In this model, the effect of surface heat source was modeled with Gaussian distribution, also the effect of the mixed boundary conditions which consist of convection and radiation heat transfers have been considered in this analysis. The model provides a full description of the temperature distribution, as well as calculates the depth and the width of the groove upon material removal at different set of laser parameters such as laser power and laser speed. This study also includes the experimental procedure to study the effect of laser parameters on the depth and width of the removal groove metal as verification to the modeled results. Good agreement between the experimental and the model results is achieved for a wide range of laser powers. It is found that the quality of the laser structure process is affected by the laser scan speed and laser power. For a high laser structured quality, it is suggested to use laser with high speed and moderate to high laser power.

Research paper thumbnail of On the quality and the accuracy of the laser direct structuring, experimental investigation and optimization

Journal of Laser Applications, 2018

The enormous applications of the molded interconnect devices (MID) make these face many difficult... more The enormous applications of the molded interconnect devices (MID) make these face many difficult challenges, some of which are the quality and the reliability, as well as concerns on how to produce the micro-MID products. This drives to a hard competition between the different methods used in the MID technology. The laser direct structuring (LDS) has clearly been distinguished as the best method in comparison with the other MID processes. However, it also needs more development, especially in terms of the quality, accuracy, and their impact on the final MID quality of the two- (2D) and three-dimensional (3D) micro and normal products, especially with the decline or the limited availability of information in both of the industry and scientific research. In this work, the MID-LDS has been experimentally investigated by considering the effect of the important process parameters on the process responses and then to explore the relationship between these responses and the final MID qual...

Research paper thumbnail of Influence of the effective parameters on the quality of laser micro-cutting process: Experimental analysis, modeling and optimization

Surface roughness (Ra) after the laser micro-cutting process plays an important role in the quali... more Surface roughness (Ra) after the laser micro-cutting process plays an important role in the quality of the final product. On the other hand, this surface roughness depends on complex laser process parameters such as laser power, laser repetition rate, and laser scanning speed. Therefore, it is important to propose a reliable model to predict the surface roughness as well as to correlate it with important process parameters. This helps to achieve the highest required quality, reduce the effort, and save material wastage and cost for the required experimental tests. In this paper, mathematical models have been developed using Artificial Neural Network (ANN) and theoretical calculations to predicate the surface roughness for the substrate surface after laser micro-cutting. Moreover, these models can be used to find the importance of each process parameter and finally to propose the optimum process parameters. Experimental tests have been carried out to find out the relationship between...

Research paper thumbnail of Simulation and experimental investigation for the 2D and 3D laser direct structuring process

The molded interconnected devices (MID) technology is vastly growing as an important innovative t... more The molded interconnected devices (MID) technology is vastly growing as an important innovative technology in the field of electronics production. The laser direct structuring (LDS) method is one of the most common available technologies for building up MID’s products. The current existing knowledge in industry and in research about the standards in the respective manufacturing processes and process parameters is up to now not fully comprehensive in terms of mutual influencing and dependencies on each other. This is particularly the case for the three-dimensional applications and micro products. In the present contribution, a new simulation procedures based on a three-dimensional finite element model (FEM) has been developed. The effect of each of latent heat of fusion and temperature on the material properties as well as the 3D Gaussian heat source for the laser beam has been considered in this work. The used material was a polymer plate poly ether ether ketone (PEEK). The effect o...

Research paper thumbnail of Simulation, Optimization and Experimental Verification of the Over–Pressure Reflow Soldering Process

Procedia CIRP, 2017

Abstract The advanced technologies for electronics production and convection based soldering tech... more Abstract The advanced technologies for electronics production and convection based soldering technologies are growing steadily. The enhanced reflow soldering oven with an integrated hyper pneumatic module ensures a void-free solder connection, but it requires design and installation of the process parameters in the oven in order to ensure optimized heat transfer and derive the best energy efficiency performance. This paper presents a simulation model of the thermal soldering process in the over-pressure convection oven by finite element model. This model considers the effect of the complex boundary conditions during the soldering process. A set of experimental tasks were designed to investigate the variations in the temperature profiles at selected points on the surface of the demonstrator. Moreover, the heat transfer coefficient for each thermal profile has been calculated. The simulation model can be used to predict the temperature distribution for the solder materials together with the demonstrator board. The void content in the solder material was investigated by the X-Ray analysis and correlated with the thermal process in the simulation. Hence, the optimized relation between the process set-up parameters in the oven, simulated thermal behavior, and the voids fraction in solder material are studied in detail.

Research paper thumbnail of Laser-assisted Selective Activation of Injection Molded Chip Packaging Devices with Thermoset Substrate Materials for Intelligent Connectivity Systems in Automobiles

Procedia CIRP, 2017

Abstract The development of sensors, such as in the automotive sector is characterized by increas... more Abstract The development of sensors, such as in the automotive sector is characterized by increasing miniaturization and variety. Higher integration of functions in electrical and mechanical applications is therefore a logical consequence for further development. In this connection especially technologies can persuade, enabling high design flexibility, combination of electrical and mechanical functions and embedding of further applications. Mechatronic integrated devices are a considerable solution combining mechanical and various electrical functions in an entire component together. Specifically, the ability for insert moulding of MEMS sensor chips and the ability to create circuit carrier in nearly any shape with selective traces and laser drilled vias suite for this production method. A particular focus is on the durability of very fine conductor tracks. With increasing miniaturization especially in high temperature and high voltage applications the typical thermoplastic based substrate materials with their thin chemical plated circuits, reach boundaries in the thermal and mechanical properties. The use of thermoset materials provides a new suitable alternative in this field. The cross-linked, molecular structured thermosets obtain high temperature resistance, combined with high dimensional stability. The thermal expansion is comparative low. With appropriate selection of compound fillers, aligned laser activation parameters and suitable circuit plating system a reliable CTE composition of all materials can be achieved. Thermosetting plastic compounds with laser-activatable additives are indeed in focus of current researches. However, laser-based method for the selective activation of thermosets is currently not available on the market. As a result, it is investigated into alternative laser assisted activation methods which do not require special additives in the substrate compound for electro chemical potential. Instead an assimilated chemical palladium activation is utilized subsequently. Of particular importance is distinct and selective activation with suitable laser parameters, as well as the following electroless chemical copper and additionally galvanic copper plating with appropriate surface quality for electronic surface mount and assembly technologies. Within the article, the research results will be presented, describing the method and giving an insight into the qualified process parameters for the laser and palladium activation, their correlations among themselves as well as the implications onto the following chemical and galvanic plating.

Research paper thumbnail of Novel Ceramic-Based Material for the Applications of Molded Interconnect Devices (3D-MID) Based on Laser Direct Structuring

Advanced Engineering Materials