Bill Shu - Academia.edu (original) (raw)

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Papers by Bill Shu

Research paper thumbnail of Wire bond development for high-pincount surface-mount

Research paper thumbnail of Fine pitch wire bonding development using a new multipurpose, multipad pitch test die

To develop fine pitch assembly especially for pad limited microelectronic dice, VLSI has designed... more To develop fine pitch assembly especially for pad limited microelectronic dice, VLSI has designed and manufactured a multipurpose, multipad pitch test die with pad pitches ranging from 5 mil down to 3 mil, suitable for evaluating gold-ball bonding, aluminum wedge bonding, tape automated bonding (TAB), array bonding, wafer probes, and molding operations. This paper reviews the design features of this test die, and presents the statistical design of experiment strategy taken in developing a wire bond process for very fine pitch assembly based on this test die.'The effect of major bonding parameters on bond ball size and ball shear force are discussed. A statistical method for predicting the ball shorting rate is compared with actual assembly yield data.

Research paper thumbnail of Wire bond development for high-pincount surface-mount

Research paper thumbnail of Fine pitch wire bonding development using a new multipurpose, multipad pitch test die

To develop fine pitch assembly especially for pad limited microelectronic dice, VLSI has designed... more To develop fine pitch assembly especially for pad limited microelectronic dice, VLSI has designed and manufactured a multipurpose, multipad pitch test die with pad pitches ranging from 5 mil down to 3 mil, suitable for evaluating gold-ball bonding, aluminum wedge bonding, tape automated bonding (TAB), array bonding, wafer probes, and molding operations. This paper reviews the design features of this test die, and presents the statistical design of experiment strategy taken in developing a wire bond process for very fine pitch assembly based on this test die.'The effect of major bonding parameters on bond ball size and ball shear force are discussed. A statistical method for predicting the ball shorting rate is compared with actual assembly yield data.

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