Chenghong Li - Academia.edu (original) (raw)

Papers by Chenghong Li

Research paper thumbnail of Structurally Diverse Nitric Oxide-Releasing Poly(propylene imine) Dendrimers

Carolina Digital Repository (University of North Carolina at Chapel Hill), 2011

Research paper thumbnail of Determination of Rate Constants of N-Alkylation of Primary Amines by 1H NMR Spectroscopy

Journal of Physical Chemistry A, Aug 20, 2013

Macromolecules containing N-diazeniumdiolates of secondary amines are proposed scaffolds for cont... more Macromolecules containing N-diazeniumdiolates of secondary amines are proposed scaffolds for controlled nitrogen oxide (NO) release medical applications. Preparation of these compounds often involves converting primary amine groups to secondary amine groups through N-alkylation. However, N-alkylation results in not only secondary amines but tertiary amines as well. Only N-diazeniumdiolates of secondary amines are suitable for controlled NO release; therefore, the yield of secondary amines is crucial to the total NO load of the carrier. In this paper, (1)H NMR spectroscopy was used to estimate the rate constants for formation of secondary amine (k1) and tertiary amine (k2) for alkylation reagents such as propylene oxide (PO), methyl acrylate (MA), and acrylonitrile (ACN). At room temperature, the ratio of k2/k1 for the three reactions was found to be around 0.50, 0.026, and 0.0072.

Research paper thumbnail of Preparation of Nitrile Containing Siloxane Triblock COpolymers and Their APplication As Stabilizers For Siloxane Magnetic Fluids

Research paper thumbnail of Silicone/Amine Resin Hybrid Materials as Abrasion Resistant Coatings

Chemistry of Materials, Sep 19, 2001

... Figure 6 Condensation reaction between a methoxylated melamine formaldehyde resin and a GP si... more ... Figure 6 Condensation reaction between a methoxylated melamine formaldehyde resin and a GP silicone resin. ... Crack-free coatings were generally obtained by following the aforementioned procedures. ... EC, 100:0, 100 °C/3 h, 8.6. 125 °C/2 h, 7.9. EC/MF-A, 86:14, 100 °C/3 h, 22.9 ...

Research paper thumbnail of Morphology of Inorganic-Organic Hybrid Materials Derived from Triethoxysilylated Diethylenetriamine and Tetramethoxysilane

Journal Of Macromolecular Science, Part A, May 15, 2000

Triethoxysilylated diethylenetriamine (f-DETA) and its mixtures with tetramethoxysilane (TMOS) ha... more Triethoxysilylated diethylenetriamine (f-DETA) and its mixtures with tetramethoxysilane (TMOS) have been hydrolyzed and condensed to form abrasion resistant coatings for optical plastics such as bisphenol-A polycarbonate and CR39. In this paper, the influences of the pH and water concentration on the morphology of gels derived from f-DETA alone (f-DETA100) or equal weights of f-DETA and TMOS (f-DETA50TMOS50) were studied. For the f-DETA50TMOS50 system, with an equivalent ratio (r) of water to alkoxysilane (OH/SiOR) of 4.4, sol-gel reactions at pH 0–2 often led to a particulate gel structure. However, if the reaction was carried out pH 4–5, the resulting gel often had a uniform compact structure although some particulate features were found on the surface. For the f-DETA100 system at pH 0–2, as r increased from zero, the resulting f-DETA gels exhibited a morphological transition from a monolithic uniform structure, to a porous particulate structure, and then to a compact fine particulate structure. A similar transition also existed in the binary system f-DETA50TMOS50, but the particle size was much smaller and no obvious porous stage was observed. The aging time and drying rate were also important factors influencing the structure of the f-DETA/TMOS coatings.

Research paper thumbnail of Inorganic-Organic Sol-Gel Derived Hybrid Materials as Abrasion Resistant Coatings

Research paper thumbnail of Polymeric protective coatings for MEMS wet-etch processes

Proceedings of SPIE, Jan 24, 2004

ABSTRACT Microelectromechanical systems (MEMS) device manufacturers today are faced with the chal... more ABSTRACT Microelectromechanical systems (MEMS) device manufacturers today are faced with the challenge of protecting electronic circuitry and other sensitive device structures during deep silicon wet-etch processes. Etch processes of this nature require prolonged exposure of the device to harsh corrosive mixtures of aqueous acids and bases at higher than ambient temperatures. A need exists for a spin-applied polymeric coating to prevent the exposure of such circuitry against the corrosive etchants. The challenge exists in developing protective coatings that will not decompose or dissolve in the etchants during the etch process. Such coatings require superior adhesion to the substrate without destroying the sensitive features below. Brewer Science, Inc., has developed a multilayer coating system for basic etchants which is compatible with a variety of semiconductor materials and offers protection against concentrated potassium hydroxide (KOH) etchants at prolonged exposure times of more than 8 hours. In addition, a second multilayer coating system is being developed for use with strong hydrofluoric and other various mixed acid etchants (MAEs) for exposures of 30 minutes or longer. These materials are specifically designed to protect circuitry subjected to concentrated MAEs during the wafer thinning processes used by MEMS device manufacturers.

Research paper thumbnail of Negative photoresist for silicon KOH etch without silicon nitride

Research paper thumbnail of High-Temperature, Spin-On, Bonding Compositions for Temporary Wafer Bonding Using Sliding Approach

Research paper thumbnail of Metal-Clad Laminates Having Improved Peel Strength and Compositions Useful for the Preparation Thereof

Research paper thumbnail of Silicone Coating Compositions

Research paper thumbnail of Wet developable hard mask in conjunction with thin photoresist for micro photolithography

Research paper thumbnail of Polymer protective coating for wet deep silicon etching processes

SPIE Proceedings, 2003

ABSTRACT A need exists for spin-applied polymeric coatings to protect electronic circuitry and ot... more ABSTRACT A need exists for spin-applied polymeric coatings to protect electronic circuitry and other sensitive structures on MEMS devices during deep silicon wet etching processes involving corrosive mixtures of aqueous acids and bases. The challenge exists in developing protective coatings that do not decompose or dissolve in the harsh etchants and, more importantly, that maintain good adhesion to the substrate during the sometimes long etching processes. We have developed a multilayer coating system that is stable and adheres well to silicon nitride and other semiconductor materials and affords chemical protection for at least eight hours in hot potassium hydroxide etchant. The same coating system is also compatible with concentrated hydrofluoric acid etchants, which can diffuse rapidly through many polymeric materials to attack the device substrate.

Research paper thumbnail of Abrasion-resistant coatings for plastic and soft metallic substrates by sol–gel reactions of a triethoxysilylated diethylenetriamine and tetramethoxysilane

Wear, 2000

Inorganic-organic hybrid materials have been prepared by sol-gel reactions of a metal or semi-met... more Inorganic-organic hybrid materials have been prepared by sol-gel reactions of a metal or semi-metal alkoxide along with a Ž. silane-modified organic compound or polymer. Mixtures of a triethoxysilylated diethylenetriamine f-DETA and tetramethoxysilane Ž. TMOS were hydrolyzed in an acidic medium, and the resulting hydrolysates were spin-or dip-coated onto polymeric substrates or metallic substrates and then thermally cured into transparent abrasion-resistant coatings. The influences of the pH, concentrations of water and TMOS, pre-hydrolysis time and curing temperature on the abrasion resistance and hardness of the resulting coatings were studied. Ž. w These hybrid coatings were applied on substrates of bisphenol-A polycarbonate bis-A PC , APEC HT9353 , copper, brass and stainless steel, and the coated substrates exhibited much lower wear rates than the corresponding uncoated ones in standard abrasion tests.

Research paper thumbnail of Determination of Rate Constants of N-Alkylation of Primary Amines by 1H NMR Spectroscopy

The Journal of Physical Chemistry A, 2013

Macromolecules containing N-diazeniumdiolates of secondary amines are proposed scaffolds for cont... more Macromolecules containing N-diazeniumdiolates of secondary amines are proposed scaffolds for controlled nitrogen oxide (NO) release medical applications. Preparation of these compounds often involves converting primary amine groups to secondary amine groups through N-alkylation. However, N-alkylation results in not only secondary amines but tertiary amines as well. Only N-diazeniumdiolates of secondary amines are suitable for controlled NO release; therefore, the yield of secondary amines is crucial to the total NO load of the carrier. In this paper, (1)H NMR spectroscopy was used to estimate the rate constants for formation of secondary amine (k1) and tertiary amine (k2) for alkylation reagents such as propylene oxide (PO), methyl acrylate (MA), and acrylonitrile (ACN). At room temperature, the ratio of k2/k1 for the three reactions was found to be around 0.50, 0.026, and 0.0072.

Research paper thumbnail of Structurally Diverse Nitric Oxide-Releasing Poly(propylene imine) Dendrimers

Chemistry of Materials, 2011

Structurally diverse secondary amine-functionalized poly(propylene imine) (PPI) dendrimers capabl... more Structurally diverse secondary amine-functionalized poly(propylene imine) (PPI) dendrimers capable of tunable nitric oxide (NO) release were synthesized in a straightforward, one-step manner using ring-opening or conjugate-addition reactions with propylene oxide (PO), styrene oxide (SO), acrylonitrile (ACN), poly(ethylene glycol) methyl ether acrylate (average Mn = 480) (PEG) or 1,2-epoxy-9-decene (ED). N-Diazeniumdiolate nitric oxide donors were formed on the resulting secondary amine-functionalized G2-G5 PPI dendrimers by reaction with NO gas in basic solution. The NO storage and release kinetics for the resulting dendritic scaffolds were diverse (0.9-3.8 μmol NO/mg totals and 0.3 to 4.9 h half lives), illustrating the importance of the exterior chemical modification (e.g., steric environments, hydrophobicity, etc.) on diazeniumdiolate stability/decomposition. Tunable NO release was demonstrated by combining two donor systems on the exterior of one macromolecular scaffold. Additionally, a mathematical model was developed that allows for the simulation of dual NO release kinetics using the NO release data from the two single NO donor systems. The approaches described herein extend the range and scope of NO-releasing macromolecular scaffolds by unlocking a series of materials for use as dopants in biomedical polymers or stand-alone therapeutics depending on the exterior modification.

Research paper thumbnail of Spin-On Protective Coatings for Wet-Etch Processing of Microelectronic Substrates

Research paper thumbnail of NMR Studies of Sol-Gel Derived Hybrid Materials Based on Triethoxysilylated Diethylenetriamine and Tetramethoxysilane

Inorganic-organic hybrid materials were prepared by hydrolysis and condensation of triethoxysilyl... more Inorganic-organic hybrid materials were prepared by hydrolysis and condensation of triethoxysilylated diethylenetriamine (f-DETA) and tetramethoxysilane (TMOS). The prehydrolysis stage of this f-DETA/TMOS system was monitored by 29Si NMR spectroscopy. The NMR experiments indicated that f-DETA hydrolyzes and condenses nearly as fast as TMOS at pH 0–1, but lags far behind the latter at pH~4.2. Gels derived from f-DETA and TMOS

Research paper thumbnail of <title>Polymeric protective coatings for MEMS wet-etch processes</title>

Micromachining and Microfabrication Process Technology IX, 2004

ABSTRACT Microelectromechanical systems (MEMS) device manufacturers today are faced with the chal... more ABSTRACT Microelectromechanical systems (MEMS) device manufacturers today are faced with the challenge of protecting electronic circuitry and other sensitive device structures during deep silicon wet-etch processes. Etch processes of this nature require prolonged exposure of the device to harsh corrosive mixtures of aqueous acids and bases at higher than ambient temperatures. A need exists for a spin-applied polymeric coating to prevent the exposure of such circuitry against the corrosive etchants. The challenge exists in developing protective coatings that will not decompose or dissolve in the etchants during the etch process. Such coatings require superior adhesion to the substrate without destroying the sensitive features below. Brewer Science, Inc., has developed a multilayer coating system for basic etchants which is compatible with a variety of semiconductor materials and offers protection against concentrated potassium hydroxide (KOH) etchants at prolonged exposure times of more than 8 hours. In addition, a second multilayer coating system is being developed for use with strong hydrofluoric and other various mixed acid etchants (MAEs) for exposures of 30 minutes or longer. These materials are specifically designed to protect circuitry subjected to concentrated MAEs during the wafer thinning processes used by MEMS device manufacturers.

Research paper thumbnail of Preparation of Nitrile Containing Siloxane Triblock COpolymers and Their APplication As Stabilizers For Siloxane Magnetic Fluids

Xie, etc. for their friendship, suggestions and help. Special gratitude to my wife Yan Yang for h... more Xie, etc. for their friendship, suggestions and help. Special gratitude to my wife Yan Yang for her sacrifice and all-out support during my three years graduate study. Thanks are also given to mother, father, my mother-in-law and fatherin-law, and to my sisters for emotional and financial support. Special thanks should be given to my mother, because without her considerate care of my little baby Roy, it is hard to believe that I could have completed my research.

Research paper thumbnail of Structurally Diverse Nitric Oxide-Releasing Poly(propylene imine) Dendrimers

Carolina Digital Repository (University of North Carolina at Chapel Hill), 2011

Research paper thumbnail of Determination of Rate Constants of N-Alkylation of Primary Amines by 1H NMR Spectroscopy

Journal of Physical Chemistry A, Aug 20, 2013

Macromolecules containing N-diazeniumdiolates of secondary amines are proposed scaffolds for cont... more Macromolecules containing N-diazeniumdiolates of secondary amines are proposed scaffolds for controlled nitrogen oxide (NO) release medical applications. Preparation of these compounds often involves converting primary amine groups to secondary amine groups through N-alkylation. However, N-alkylation results in not only secondary amines but tertiary amines as well. Only N-diazeniumdiolates of secondary amines are suitable for controlled NO release; therefore, the yield of secondary amines is crucial to the total NO load of the carrier. In this paper, (1)H NMR spectroscopy was used to estimate the rate constants for formation of secondary amine (k1) and tertiary amine (k2) for alkylation reagents such as propylene oxide (PO), methyl acrylate (MA), and acrylonitrile (ACN). At room temperature, the ratio of k2/k1 for the three reactions was found to be around 0.50, 0.026, and 0.0072.

Research paper thumbnail of Preparation of Nitrile Containing Siloxane Triblock COpolymers and Their APplication As Stabilizers For Siloxane Magnetic Fluids

Research paper thumbnail of Silicone/Amine Resin Hybrid Materials as Abrasion Resistant Coatings

Chemistry of Materials, Sep 19, 2001

... Figure 6 Condensation reaction between a methoxylated melamine formaldehyde resin and a GP si... more ... Figure 6 Condensation reaction between a methoxylated melamine formaldehyde resin and a GP silicone resin. ... Crack-free coatings were generally obtained by following the aforementioned procedures. ... EC, 100:0, 100 °C/3 h, 8.6. 125 °C/2 h, 7.9. EC/MF-A, 86:14, 100 °C/3 h, 22.9 ...

Research paper thumbnail of Morphology of Inorganic-Organic Hybrid Materials Derived from Triethoxysilylated Diethylenetriamine and Tetramethoxysilane

Journal Of Macromolecular Science, Part A, May 15, 2000

Triethoxysilylated diethylenetriamine (f-DETA) and its mixtures with tetramethoxysilane (TMOS) ha... more Triethoxysilylated diethylenetriamine (f-DETA) and its mixtures with tetramethoxysilane (TMOS) have been hydrolyzed and condensed to form abrasion resistant coatings for optical plastics such as bisphenol-A polycarbonate and CR39. In this paper, the influences of the pH and water concentration on the morphology of gels derived from f-DETA alone (f-DETA100) or equal weights of f-DETA and TMOS (f-DETA50TMOS50) were studied. For the f-DETA50TMOS50 system, with an equivalent ratio (r) of water to alkoxysilane (OH/SiOR) of 4.4, sol-gel reactions at pH 0–2 often led to a particulate gel structure. However, if the reaction was carried out pH 4–5, the resulting gel often had a uniform compact structure although some particulate features were found on the surface. For the f-DETA100 system at pH 0–2, as r increased from zero, the resulting f-DETA gels exhibited a morphological transition from a monolithic uniform structure, to a porous particulate structure, and then to a compact fine particulate structure. A similar transition also existed in the binary system f-DETA50TMOS50, but the particle size was much smaller and no obvious porous stage was observed. The aging time and drying rate were also important factors influencing the structure of the f-DETA/TMOS coatings.

Research paper thumbnail of Inorganic-Organic Sol-Gel Derived Hybrid Materials as Abrasion Resistant Coatings

Research paper thumbnail of Polymeric protective coatings for MEMS wet-etch processes

Proceedings of SPIE, Jan 24, 2004

ABSTRACT Microelectromechanical systems (MEMS) device manufacturers today are faced with the chal... more ABSTRACT Microelectromechanical systems (MEMS) device manufacturers today are faced with the challenge of protecting electronic circuitry and other sensitive device structures during deep silicon wet-etch processes. Etch processes of this nature require prolonged exposure of the device to harsh corrosive mixtures of aqueous acids and bases at higher than ambient temperatures. A need exists for a spin-applied polymeric coating to prevent the exposure of such circuitry against the corrosive etchants. The challenge exists in developing protective coatings that will not decompose or dissolve in the etchants during the etch process. Such coatings require superior adhesion to the substrate without destroying the sensitive features below. Brewer Science, Inc., has developed a multilayer coating system for basic etchants which is compatible with a variety of semiconductor materials and offers protection against concentrated potassium hydroxide (KOH) etchants at prolonged exposure times of more than 8 hours. In addition, a second multilayer coating system is being developed for use with strong hydrofluoric and other various mixed acid etchants (MAEs) for exposures of 30 minutes or longer. These materials are specifically designed to protect circuitry subjected to concentrated MAEs during the wafer thinning processes used by MEMS device manufacturers.

Research paper thumbnail of Negative photoresist for silicon KOH etch without silicon nitride

Research paper thumbnail of High-Temperature, Spin-On, Bonding Compositions for Temporary Wafer Bonding Using Sliding Approach

Research paper thumbnail of Metal-Clad Laminates Having Improved Peel Strength and Compositions Useful for the Preparation Thereof

Research paper thumbnail of Silicone Coating Compositions

Research paper thumbnail of Wet developable hard mask in conjunction with thin photoresist for micro photolithography

Research paper thumbnail of Polymer protective coating for wet deep silicon etching processes

SPIE Proceedings, 2003

ABSTRACT A need exists for spin-applied polymeric coatings to protect electronic circuitry and ot... more ABSTRACT A need exists for spin-applied polymeric coatings to protect electronic circuitry and other sensitive structures on MEMS devices during deep silicon wet etching processes involving corrosive mixtures of aqueous acids and bases. The challenge exists in developing protective coatings that do not decompose or dissolve in the harsh etchants and, more importantly, that maintain good adhesion to the substrate during the sometimes long etching processes. We have developed a multilayer coating system that is stable and adheres well to silicon nitride and other semiconductor materials and affords chemical protection for at least eight hours in hot potassium hydroxide etchant. The same coating system is also compatible with concentrated hydrofluoric acid etchants, which can diffuse rapidly through many polymeric materials to attack the device substrate.

Research paper thumbnail of Abrasion-resistant coatings for plastic and soft metallic substrates by sol–gel reactions of a triethoxysilylated diethylenetriamine and tetramethoxysilane

Wear, 2000

Inorganic-organic hybrid materials have been prepared by sol-gel reactions of a metal or semi-met... more Inorganic-organic hybrid materials have been prepared by sol-gel reactions of a metal or semi-metal alkoxide along with a Ž. silane-modified organic compound or polymer. Mixtures of a triethoxysilylated diethylenetriamine f-DETA and tetramethoxysilane Ž. TMOS were hydrolyzed in an acidic medium, and the resulting hydrolysates were spin-or dip-coated onto polymeric substrates or metallic substrates and then thermally cured into transparent abrasion-resistant coatings. The influences of the pH, concentrations of water and TMOS, pre-hydrolysis time and curing temperature on the abrasion resistance and hardness of the resulting coatings were studied. Ž. w These hybrid coatings were applied on substrates of bisphenol-A polycarbonate bis-A PC , APEC HT9353 , copper, brass and stainless steel, and the coated substrates exhibited much lower wear rates than the corresponding uncoated ones in standard abrasion tests.

Research paper thumbnail of Determination of Rate Constants of N-Alkylation of Primary Amines by 1H NMR Spectroscopy

The Journal of Physical Chemistry A, 2013

Macromolecules containing N-diazeniumdiolates of secondary amines are proposed scaffolds for cont... more Macromolecules containing N-diazeniumdiolates of secondary amines are proposed scaffolds for controlled nitrogen oxide (NO) release medical applications. Preparation of these compounds often involves converting primary amine groups to secondary amine groups through N-alkylation. However, N-alkylation results in not only secondary amines but tertiary amines as well. Only N-diazeniumdiolates of secondary amines are suitable for controlled NO release; therefore, the yield of secondary amines is crucial to the total NO load of the carrier. In this paper, (1)H NMR spectroscopy was used to estimate the rate constants for formation of secondary amine (k1) and tertiary amine (k2) for alkylation reagents such as propylene oxide (PO), methyl acrylate (MA), and acrylonitrile (ACN). At room temperature, the ratio of k2/k1 for the three reactions was found to be around 0.50, 0.026, and 0.0072.

Research paper thumbnail of Structurally Diverse Nitric Oxide-Releasing Poly(propylene imine) Dendrimers

Chemistry of Materials, 2011

Structurally diverse secondary amine-functionalized poly(propylene imine) (PPI) dendrimers capabl... more Structurally diverse secondary amine-functionalized poly(propylene imine) (PPI) dendrimers capable of tunable nitric oxide (NO) release were synthesized in a straightforward, one-step manner using ring-opening or conjugate-addition reactions with propylene oxide (PO), styrene oxide (SO), acrylonitrile (ACN), poly(ethylene glycol) methyl ether acrylate (average Mn = 480) (PEG) or 1,2-epoxy-9-decene (ED). N-Diazeniumdiolate nitric oxide donors were formed on the resulting secondary amine-functionalized G2-G5 PPI dendrimers by reaction with NO gas in basic solution. The NO storage and release kinetics for the resulting dendritic scaffolds were diverse (0.9-3.8 μmol NO/mg totals and 0.3 to 4.9 h half lives), illustrating the importance of the exterior chemical modification (e.g., steric environments, hydrophobicity, etc.) on diazeniumdiolate stability/decomposition. Tunable NO release was demonstrated by combining two donor systems on the exterior of one macromolecular scaffold. Additionally, a mathematical model was developed that allows for the simulation of dual NO release kinetics using the NO release data from the two single NO donor systems. The approaches described herein extend the range and scope of NO-releasing macromolecular scaffolds by unlocking a series of materials for use as dopants in biomedical polymers or stand-alone therapeutics depending on the exterior modification.

Research paper thumbnail of Spin-On Protective Coatings for Wet-Etch Processing of Microelectronic Substrates

Research paper thumbnail of NMR Studies of Sol-Gel Derived Hybrid Materials Based on Triethoxysilylated Diethylenetriamine and Tetramethoxysilane

Inorganic-organic hybrid materials were prepared by hydrolysis and condensation of triethoxysilyl... more Inorganic-organic hybrid materials were prepared by hydrolysis and condensation of triethoxysilylated diethylenetriamine (f-DETA) and tetramethoxysilane (TMOS). The prehydrolysis stage of this f-DETA/TMOS system was monitored by 29Si NMR spectroscopy. The NMR experiments indicated that f-DETA hydrolyzes and condenses nearly as fast as TMOS at pH 0–1, but lags far behind the latter at pH~4.2. Gels derived from f-DETA and TMOS

Research paper thumbnail of <title>Polymeric protective coatings for MEMS wet-etch processes</title>

Micromachining and Microfabrication Process Technology IX, 2004

ABSTRACT Microelectromechanical systems (MEMS) device manufacturers today are faced with the chal... more ABSTRACT Microelectromechanical systems (MEMS) device manufacturers today are faced with the challenge of protecting electronic circuitry and other sensitive device structures during deep silicon wet-etch processes. Etch processes of this nature require prolonged exposure of the device to harsh corrosive mixtures of aqueous acids and bases at higher than ambient temperatures. A need exists for a spin-applied polymeric coating to prevent the exposure of such circuitry against the corrosive etchants. The challenge exists in developing protective coatings that will not decompose or dissolve in the etchants during the etch process. Such coatings require superior adhesion to the substrate without destroying the sensitive features below. Brewer Science, Inc., has developed a multilayer coating system for basic etchants which is compatible with a variety of semiconductor materials and offers protection against concentrated potassium hydroxide (KOH) etchants at prolonged exposure times of more than 8 hours. In addition, a second multilayer coating system is being developed for use with strong hydrofluoric and other various mixed acid etchants (MAEs) for exposures of 30 minutes or longer. These materials are specifically designed to protect circuitry subjected to concentrated MAEs during the wafer thinning processes used by MEMS device manufacturers.

Research paper thumbnail of Preparation of Nitrile Containing Siloxane Triblock COpolymers and Their APplication As Stabilizers For Siloxane Magnetic Fluids

Xie, etc. for their friendship, suggestions and help. Special gratitude to my wife Yan Yang for h... more Xie, etc. for their friendship, suggestions and help. Special gratitude to my wife Yan Yang for her sacrifice and all-out support during my three years graduate study. Thanks are also given to mother, father, my mother-in-law and fatherin-law, and to my sisters for emotional and financial support. Special thanks should be given to my mother, because without her considerate care of my little baby Roy, it is hard to believe that I could have completed my research.