Cher Ming Tan - Academia.edu (original) (raw)
Papers by Cher Ming Tan
Applied sciences, Jan 10, 2022
Materials Advances
Novel fracture/fatigue resistant nickel–niobium oxide (crystalline–amorphous) sandwich nanolayers... more Novel fracture/fatigue resistant nickel–niobium oxide (crystalline–amorphous) sandwich nanolayers on a polyimide (PI) substrate as a potential candidate for electrodes or interconnects for flexible electronic or energy devices.
YMER Digital
Electromigration in chip level interconnect is commonly described by atomic drift due to electron... more Electromigration in chip level interconnect is commonly described by atomic drift due to electron-wind force that arises from electron-ion momentum transfer. As an alternative to this model, in early 1980’s, Sah proposed a two dimensional analytical ‘void-surface bond-breaking’ model by dropping the atomic drift term that resulted from electron-wind force (in his book ‘Fundamentals of Solid-State Electronics’) and the rate of change of area of void is computed. Due to the continuous down scaling and evolution of interconnect patterning technologies, the void growth process in modern interconnect becomes more complex and electromigration failures are found to be catastrophic in nature instead of gradual type failures observed in early days. In this work, Sah’s model is revisited from the perspective of its applicability to modern submicron copper interconnects. The electromigration-induced resistance change behavior is analytically derived considering a three-dimensional atomic drift...
Applied Sciences, 2022
A printed circuit board (PCB) is an essential element for practical circuit applications and its ... more A printed circuit board (PCB) is an essential element for practical circuit applications and its failure can inflict large financial costs and even safety concerns, especially if the PCB failure occurs prematurely and unexpectedly. Understanding the failure modes and even the failure mechanisms of a PCB failure are not sufficient to ensure the same failure will not occur again in subsequent operations with different batches of PCBs. The identification of the root cause is crucial to prevent the reoccurrence of the same failure. In this work, a step-by-step approach from customer returned and inventory reproduced boards to the root cause identification is described for an actual industry case where the failure is a PCB burn-out. The failure mechanism is found to be a conductive anodic filament (CAF) even though the PCB is CAF-resistant. The root cause is due to PCB de-penalization. A reliability verification to assure the effectiveness of the corrective action according to the identi...
2017 Annual Reliability and Maintainability Symposium (RAMS), 2017
Automotive Electronics is growing ever since the technological advancement has brought about a re... more Automotive Electronics is growing ever since the technological advancement has brought about a revolution in the Automotive Semiconductor and Telematics industry, especially in the past decade. Utilization of microelectronics and hence circuits' complexity is increasing continuously in automotive industry. Advancement in electronic technology increases the dominance of electronics in automotive markets, and reliability requirements for Automobile Electronics have grown over the past many years. However, the faults and rate of defects is also increasing as indicated by proportion of number of recalls made by large automobile companies, and this poses a difficult ‘Paradox’ to understand and curb. One of the reasons is that the increase in technological advancements makes the vehicles' system more complex and difficult to test for reliability. Also, operating parameters such as temperature, humidity, etc. are increasingly stringent with the continuous development of the electronic systems in vehicles. Short time to market and ineffective design for reliability methodology employed, including various misconceptions on reliability testing, have rendered a lag in providing components and systems that match the increasing reliability requirements for vehicles. Therefore, a call for greater effort in reliability understanding and systematic design for reliability methodology is essential if continuous engagement of advanced electronic technologies is to be continued. The transition from Mechanical Automotive system to Electronics Automotive system and its effect on the Automotive industry is discussed in this work. The fact that technological benefits are not helping in improving reliability of the Automotive Electronics system is explained by studying the worldwide automotive recalls and the Paradox of Automotive Electronics Reliability is presented and explained.
Light-Emitting Diodes - New Perspectives [Working Title]
Applications of LEDs have increased significantly, and increasing outdoor applications are observ... more Applications of LEDs have increased significantly, and increasing outdoor applications are observed. Some outdoor applications require high reliability as their failure can lead to hazardous consequences. Examples are their applications in automotive, street lamp lighting etc. To ensure the reliability of LEDs in outdoor applications, reliability test that include humidity on the LEDs must be done. However, it is found that accelerated life test of LEDs at high humidity level cannot be extrapolated to standard condition of lower humidity as the mechanism of degradation depends critically on humidity level. In fact, the degradation of LEDs in outdoor applications is mainly due to the degradation of their encapsulation and housing materials (or called packaging material as a whole) instead of the semiconductor chip itself. The decrease in lumen is the results of crack and discoloration of the LED packaging material. Detail understanding of the failure physics of the packaging material...
Applied Sciences, 2021
Prompt gamma imaging is one of the emerging techniques used in proton therapy for in-vivo range v... more Prompt gamma imaging is one of the emerging techniques used in proton therapy for in-vivo range verification. Prompt gamma signals are generated during therapy due to the nuclear interaction between beam particles and nuclei of the tissue that is detected and processed in order to obtain the position and energy of the event so that the benefits of Bragg’s peak can be fully utilized. This work aims to develop a gallium nitride (GaN)-based readout system for position-sensitive detectors. An operational amplifier is the module most used in such a system to process the detector signal, and a GaN-based operational amplifier (OPA) is designed and simulated in LTSpice. The designed circuit had an open-loop gain of 70 dB and a unity gain frequency of 34 MHz. The slew rate of OPA was 20 V/μs and common mode rejection ratio was 84.2 dB. A simulation model of the readout circuit system using the GaN-based operational amplifier was also designed, and the result showed that the system can succes...
Sensors and Materials, 2021
2007 IEEE International Conference on Communications, 2007
10th Electronics Packaging Technology Conference, EPTC 2008, 2008
Archives of Physics Research, 2018
Moisture is found to be a major cause of LED lumen degradation along with various other factors. ... more Moisture is found to be a major cause of LED lumen degradation along with various other factors. In this work, a method is proposed to prevent moisture from penetrating into the LED’s internal structure by having diamond like carbon (DLC) films coated on the LED’s encapsulant as a moisture barrier sheet via RF sputtering system at room temperature. However, we found that the DLC coating is not suitable for this role as it underwent structural changes with time that lower its moisture resistance ability. The LED encapsulant expansion is found be the reason for the DLC’s structural changes. Consequently, higher lumen degradation is observed for LEDs coated with DLC coating as compared to its non- DLC counterpart.
International Series on Advances in Solid State Electronics and Technology, 2010
Page 1. ASSET rnlematiotial S*riea on Advances in Solid Stale Electronics and Technology Founding... more Page 1. ASSET rnlematiotial S*riea on Advances in Solid Stale Electronics and Technology Founding Eclilcr: Chili-Tartg fi.ih ELECTROMIGRATION IN ULSI INTERCONNECTIONS etc iim ii IHt in Cher Ming Tan World Scientific Page 2. ...
Progress In Electromagnetics Research Letters, 2019
Applied Sciences, 2021
Single event upset, or Single Event Effect (SEE) is increasingly important as semiconductor devic... more Single event upset, or Single Event Effect (SEE) is increasingly important as semiconductor devices are entering into nano-meter scale. The Linear Energy Transfer (LET) concept is commonly used to estimate the rate of SEE. The SEE, however, should be related to energy deposition of each stochastic event, but not LET which is a non-stochastic quantity. Instead, microdosimetry, which uses a lineal calculation of energy lost per step for each specific track, should be used to replace LET to predict microelectronic failure from SEEs. Monte Carlo simulation is used for the demonstration, and there are several parameters needed to optimise for SEE simulation, such as the target size, physical models and scoring techniques. We also show the thickness of the sensitive volume, which also correspond to the size of a device, will change the spectra of lineal energy. With a more comprehensive Monte Carlo simulation performed in this work, we also show and explain the differences in our results ...
Ekspolatacja i Niezawodnosc - Maintenance and Reliability, 2019
Applied sciences, Jan 10, 2022
Materials Advances
Novel fracture/fatigue resistant nickel–niobium oxide (crystalline–amorphous) sandwich nanolayers... more Novel fracture/fatigue resistant nickel–niobium oxide (crystalline–amorphous) sandwich nanolayers on a polyimide (PI) substrate as a potential candidate for electrodes or interconnects for flexible electronic or energy devices.
YMER Digital
Electromigration in chip level interconnect is commonly described by atomic drift due to electron... more Electromigration in chip level interconnect is commonly described by atomic drift due to electron-wind force that arises from electron-ion momentum transfer. As an alternative to this model, in early 1980’s, Sah proposed a two dimensional analytical ‘void-surface bond-breaking’ model by dropping the atomic drift term that resulted from electron-wind force (in his book ‘Fundamentals of Solid-State Electronics’) and the rate of change of area of void is computed. Due to the continuous down scaling and evolution of interconnect patterning technologies, the void growth process in modern interconnect becomes more complex and electromigration failures are found to be catastrophic in nature instead of gradual type failures observed in early days. In this work, Sah’s model is revisited from the perspective of its applicability to modern submicron copper interconnects. The electromigration-induced resistance change behavior is analytically derived considering a three-dimensional atomic drift...
Applied Sciences, 2022
A printed circuit board (PCB) is an essential element for practical circuit applications and its ... more A printed circuit board (PCB) is an essential element for practical circuit applications and its failure can inflict large financial costs and even safety concerns, especially if the PCB failure occurs prematurely and unexpectedly. Understanding the failure modes and even the failure mechanisms of a PCB failure are not sufficient to ensure the same failure will not occur again in subsequent operations with different batches of PCBs. The identification of the root cause is crucial to prevent the reoccurrence of the same failure. In this work, a step-by-step approach from customer returned and inventory reproduced boards to the root cause identification is described for an actual industry case where the failure is a PCB burn-out. The failure mechanism is found to be a conductive anodic filament (CAF) even though the PCB is CAF-resistant. The root cause is due to PCB de-penalization. A reliability verification to assure the effectiveness of the corrective action according to the identi...
2017 Annual Reliability and Maintainability Symposium (RAMS), 2017
Automotive Electronics is growing ever since the technological advancement has brought about a re... more Automotive Electronics is growing ever since the technological advancement has brought about a revolution in the Automotive Semiconductor and Telematics industry, especially in the past decade. Utilization of microelectronics and hence circuits' complexity is increasing continuously in automotive industry. Advancement in electronic technology increases the dominance of electronics in automotive markets, and reliability requirements for Automobile Electronics have grown over the past many years. However, the faults and rate of defects is also increasing as indicated by proportion of number of recalls made by large automobile companies, and this poses a difficult ‘Paradox’ to understand and curb. One of the reasons is that the increase in technological advancements makes the vehicles' system more complex and difficult to test for reliability. Also, operating parameters such as temperature, humidity, etc. are increasingly stringent with the continuous development of the electronic systems in vehicles. Short time to market and ineffective design for reliability methodology employed, including various misconceptions on reliability testing, have rendered a lag in providing components and systems that match the increasing reliability requirements for vehicles. Therefore, a call for greater effort in reliability understanding and systematic design for reliability methodology is essential if continuous engagement of advanced electronic technologies is to be continued. The transition from Mechanical Automotive system to Electronics Automotive system and its effect on the Automotive industry is discussed in this work. The fact that technological benefits are not helping in improving reliability of the Automotive Electronics system is explained by studying the worldwide automotive recalls and the Paradox of Automotive Electronics Reliability is presented and explained.
Light-Emitting Diodes - New Perspectives [Working Title]
Applications of LEDs have increased significantly, and increasing outdoor applications are observ... more Applications of LEDs have increased significantly, and increasing outdoor applications are observed. Some outdoor applications require high reliability as their failure can lead to hazardous consequences. Examples are their applications in automotive, street lamp lighting etc. To ensure the reliability of LEDs in outdoor applications, reliability test that include humidity on the LEDs must be done. However, it is found that accelerated life test of LEDs at high humidity level cannot be extrapolated to standard condition of lower humidity as the mechanism of degradation depends critically on humidity level. In fact, the degradation of LEDs in outdoor applications is mainly due to the degradation of their encapsulation and housing materials (or called packaging material as a whole) instead of the semiconductor chip itself. The decrease in lumen is the results of crack and discoloration of the LED packaging material. Detail understanding of the failure physics of the packaging material...
Applied Sciences, 2021
Prompt gamma imaging is one of the emerging techniques used in proton therapy for in-vivo range v... more Prompt gamma imaging is one of the emerging techniques used in proton therapy for in-vivo range verification. Prompt gamma signals are generated during therapy due to the nuclear interaction between beam particles and nuclei of the tissue that is detected and processed in order to obtain the position and energy of the event so that the benefits of Bragg’s peak can be fully utilized. This work aims to develop a gallium nitride (GaN)-based readout system for position-sensitive detectors. An operational amplifier is the module most used in such a system to process the detector signal, and a GaN-based operational amplifier (OPA) is designed and simulated in LTSpice. The designed circuit had an open-loop gain of 70 dB and a unity gain frequency of 34 MHz. The slew rate of OPA was 20 V/μs and common mode rejection ratio was 84.2 dB. A simulation model of the readout circuit system using the GaN-based operational amplifier was also designed, and the result showed that the system can succes...
Sensors and Materials, 2021
2007 IEEE International Conference on Communications, 2007
10th Electronics Packaging Technology Conference, EPTC 2008, 2008
Archives of Physics Research, 2018
Moisture is found to be a major cause of LED lumen degradation along with various other factors. ... more Moisture is found to be a major cause of LED lumen degradation along with various other factors. In this work, a method is proposed to prevent moisture from penetrating into the LED’s internal structure by having diamond like carbon (DLC) films coated on the LED’s encapsulant as a moisture barrier sheet via RF sputtering system at room temperature. However, we found that the DLC coating is not suitable for this role as it underwent structural changes with time that lower its moisture resistance ability. The LED encapsulant expansion is found be the reason for the DLC’s structural changes. Consequently, higher lumen degradation is observed for LEDs coated with DLC coating as compared to its non- DLC counterpart.
International Series on Advances in Solid State Electronics and Technology, 2010
Page 1. ASSET rnlematiotial S*riea on Advances in Solid Stale Electronics and Technology Founding... more Page 1. ASSET rnlematiotial S*riea on Advances in Solid Stale Electronics and Technology Founding Eclilcr: Chili-Tartg fi.ih ELECTROMIGRATION IN ULSI INTERCONNECTIONS etc iim ii IHt in Cher Ming Tan World Scientific Page 2. ...
Progress In Electromagnetics Research Letters, 2019
Applied Sciences, 2021
Single event upset, or Single Event Effect (SEE) is increasingly important as semiconductor devic... more Single event upset, or Single Event Effect (SEE) is increasingly important as semiconductor devices are entering into nano-meter scale. The Linear Energy Transfer (LET) concept is commonly used to estimate the rate of SEE. The SEE, however, should be related to energy deposition of each stochastic event, but not LET which is a non-stochastic quantity. Instead, microdosimetry, which uses a lineal calculation of energy lost per step for each specific track, should be used to replace LET to predict microelectronic failure from SEEs. Monte Carlo simulation is used for the demonstration, and there are several parameters needed to optimise for SEE simulation, such as the target size, physical models and scoring techniques. We also show the thickness of the sensitive volume, which also correspond to the size of a device, will change the spectra of lineal energy. With a more comprehensive Monte Carlo simulation performed in this work, we also show and explain the differences in our results ...
Ekspolatacja i Niezawodnosc - Maintenance and Reliability, 2019