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Papers by Daniel Bien
Silicon micromachining techniques have enabled the fabrication of a wide range of microfluidic co... more Silicon micromachining techniques have enabled the fabrication of a wide range of microfluidic components and systems. Given the small volumes of liquid and low flow rates involved, the accurate characterisation of such systems presents a challenge. To date many of the measurements have been performed manually; this is both time consuming and prone to inaccuracies. This paper describes an automated measurement technique and presents results for a surface micromachined valve.
ECS Transactions, 2009
This paper describes a serpentine flexure spring design and fabrication process development for r... more This paper describes a serpentine flexure spring design and fabrication process development for radio frequency microelectromechanical (RF MEMS) capacitive switches with coplanar waveguide (CPW) lines. Sputtered tungsten is employed as the CPW line conductor instead of Au, a non-Si compatible material. The bridge membrane is fabricated from Al. The materials and fabrication process can be integrated with CMOS and SOI technology to reduce cost. Results show the MEMS switch has excellent performance with insertion loss 0.3dB, return loss -27dB at 30GHz and high isolation -30dB at 40GHz. The process developed promises to simplify the design and fabrication of RF MEMS on silicon.
Journal of Micromechanics and Microengineering, 2003
... PII: S0960-1317(03)58636-3 Characterization of masking materials for deep glass micromachinin... more ... PII: S0960-1317(03)58636-3 Characterization of masking materials for deep glass micromachining DCS Bien, PV Rainey, SJN Mitchell and HS Gamble ... Etching the glass substrate in concentrated HF solution for longer than 5 min causes the photoresist to peel off due to ...
Electrochemical and Solid-State Letters, 2006
ABSTRACT We have demonstrated the ability to fabricate and self-align sub-100 nm iron wires using... more ABSTRACT We have demonstrated the ability to fabricate and self-align sub-100 nm iron wires using a combination of silicon nitride spacer technology and selective deposition of iron and tungsten by chemical vapor deposition (CVD). The discovery of selective deposition of CVD iron, from pentacarbonyl [Fe(CO)(5)] precursor, on silicon nitride surfaces over tungsten surfaces is the key factor that allows the self-alignment of iron wires. The density and conductivity of the CVD iron layers improved as the deposition temperature increased. Deposition time of 1 min was sufficient to deposit a perfectly aligned, continuous iron wire. The deposited iron layer shows 100% selectivity. (c) 2006 The Electrochemical Society.
Silicon micromachining techniques have enabled the fabrication of a wide range of microfluidic co... more Silicon micromachining techniques have enabled the fabrication of a wide range of microfluidic components and systems. Given the small volumes of liquid and low flow rates involved, the accurate characterisation of such systems presents a challenge. To date many of the measurements have been performed manually; this is both time consuming and prone to inaccuracies. This paper describes an automated measurement technique and presents results for a surface micromachined valve.
ECS Transactions, 2009
This paper describes a serpentine flexure spring design and fabrication process development for r... more This paper describes a serpentine flexure spring design and fabrication process development for radio frequency microelectromechanical (RF MEMS) capacitive switches with coplanar waveguide (CPW) lines. Sputtered tungsten is employed as the CPW line conductor instead of Au, a non-Si compatible material. The bridge membrane is fabricated from Al. The materials and fabrication process can be integrated with CMOS and SOI technology to reduce cost. Results show the MEMS switch has excellent performance with insertion loss 0.3dB, return loss -27dB at 30GHz and high isolation -30dB at 40GHz. The process developed promises to simplify the design and fabrication of RF MEMS on silicon.
Journal of Micromechanics and Microengineering, 2003
... PII: S0960-1317(03)58636-3 Characterization of masking materials for deep glass micromachinin... more ... PII: S0960-1317(03)58636-3 Characterization of masking materials for deep glass micromachining DCS Bien, PV Rainey, SJN Mitchell and HS Gamble ... Etching the glass substrate in concentrated HF solution for longer than 5 min causes the photoresist to peel off due to ...
Electrochemical and Solid-State Letters, 2006
ABSTRACT We have demonstrated the ability to fabricate and self-align sub-100 nm iron wires using... more ABSTRACT We have demonstrated the ability to fabricate and self-align sub-100 nm iron wires using a combination of silicon nitride spacer technology and selective deposition of iron and tungsten by chemical vapor deposition (CVD). The discovery of selective deposition of CVD iron, from pentacarbonyl [Fe(CO)(5)] precursor, on silicon nitride surfaces over tungsten surfaces is the key factor that allows the self-alignment of iron wires. The density and conductivity of the CVD iron layers improved as the deposition temperature increased. Deposition time of 1 min was sufficient to deposit a perfectly aligned, continuous iron wire. The deposited iron layer shows 100% selectivity. (c) 2006 The Electrochemical Society.