E. Manea - Academia.edu (original) (raw)
Papers by E. Manea
2023 International Semiconductor Conference (CAS)
2004 International Semiconductor Conference. CAS 2004 Proceedings (IEEE Cat. No.04TH8748)
Micromachining and micro patterning of biocompatible substrates encourage the arrangement of cell... more Micromachining and micro patterning of biocompatible substrates encourage the arrangement of cells in vitro following the same morphofunctional patterns as in vivo. Adherence, multiplication and differentiation in vitro of the dermal fibroblasts on surface and bulk micro fabricated substrates represent a modern method for biocompatibility testing in view of further therapeutic applications.
This paper presents the results of an experimental study re-garding the increase in the efficienc... more This paper presents the results of an experimental study re-garding the increase in the efficiency of the silicon solar cells, using various methods for texturing the front surface. Designing, patterning and surface etch-ing processes led to obtain reined structures with very low losses of the incident optical radiation. This paper aims to compare the fabrication method using the proposed textured surfaces with the standard method.
CAS 2011 Proceedings (2011 International Semiconductor Conference), 2011
A comparative study of computation models for predicting the vibration modes of some MEMS structu... more A comparative study of computation models for predicting the vibration modes of some MEMS structures of cantilever type — as suspension arms of the inertial mass of a bulk-micromachined silicon accelerometer, reported to the experimentally measured values of resonance (natural) frequencies, is presented in this paper. The most appropriate values of silicon Young's modulus depending on the crystal orientation of
CAS 2010 Proceedings (International Semiconductor Conference), 2010
The paper deals with studying the mechanical structure of a bulk-micromachined silicon piezoresis... more The paper deals with studying the mechanical structure of a bulk-micromachined silicon piezoresistive accelerometer by using FEM (Finite Element Method). The vibration modes (resonant frequencies) and sensitivity were predicted. The results of numerical simulation, validated experimentally have pointed out the influence of manufacturing process parameters on the accelerometer performance.
CAS 2010 Proceedings (International Semiconductor Conference), 2010
This paper presents the TCAD techniques used for the simulation, optimisation and design of the B... more This paper presents the TCAD techniques used for the simulation, optimisation and design of the BioFET device parameters, using a specialised software package, ATLAS. The values of these parameters will prescribe the process fabrication and device size. Using EDA tools like LEDIT, the layers that will constitute the fabrication masks for both active and reference devices will be established, as
IFMBE Proceedings, 2010
This paper presents the enhanced performances of a glucose biosensor constructed with a dielectri... more This paper presents the enhanced performances of a glucose biosensor constructed with a dielectric multi-layer Si/SiO2/Si3N4/Al2O3. If the Si/SiO2 system is present in all the silicon integrated sensors, the biosensors processing involves special attention to the intermediate layer responsible for the biological receptors entrapping. A first experience imposes to use the Si3N4 layer over the SiO2 layer mainly to stops the Na+ and K+ ions diffusion from bio-environment toward the silicon transducer. These results are reflected in the CV traced curve and a minimum leakage current. The nitride besides to a nanometric top Al2O3 layer grown by anodization, helps to a better enzyme entrapping, maintains the GOD active centers and are in agreement with the planar technology requirements. An original Al2O3 deposition technique is presented. The final multilayer structure was characterized as a capacitor by CV-metry, ellipsometry, impedancemetry.
CAS 2005 Proceedings. 2005 International Semiconductor Conference, 2005.
The use of microfluidic devices in biomedical research creates clinically useful technologies and... more The use of microfluidic devices in biomedical research creates clinically useful technologies and devices (for biochemical reaction chambers, and physical particle separation), or in IC chip cooling applications has significant advantages. In the first case, because the fluid volumes within these microchannels are very small, usually several nanoliters, the amount of reagents and analytes used is quite small. In the second case, they present a negligible thermal resistance, due to direct contact with the chip dissipation surface. This paper presents some new technological methods used to prepare by surface microfabrication microchannels and other microfluidic elements, like chambers onto different substrates.
1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351)
Presented study was focus on optimization of planarization and metal conformity on steps in MOS t... more Presented study was focus on optimization of planarization and metal conformity on steps in MOS technology. The experiment regards a three fold problem: the structure of the planarization silicon dioxide thin film in order to optimized the slope of the contact windows, the metal used and the conformity of metal interconnections. We studied the profiles of contact windows configured in
2000 International Semiconductor Conference. 23rd Edition. CAS 2000 Proceedings (Cat. No.00TH8486), 2000
A frequent failure mechanism in I.C.'s CMOS polysilicon gate technology is the punch-through... more A frequent failure mechanism in I.C.'s CMOS polysilicon gate technology is the punch-through of NMOS transistor junction. The high doped drain-source N+ zone is obtained by high dose arsenic ion implantation. During the ion implantation an important amount of damage is induced in the silicon substrate and in the following thermal processes there appears a migration of the dislocations. We suppose that the migrating damage is in charge of the failure mechanism. The purpose of this paper is to identify the zone with maximum damage and to prove the migration of the defects during the thermal annealing. Finally is advanced a simple empirical model that allows predicting the final position/dimension of the silicon substrate damage zone
2006 International Semiconductor Conference, 2006
This paper presents a new silicon solar cell structure obtained by texturisation of the front sur... more This paper presents a new silicon solar cell structure obtained by texturisation of the front surface using silicon micromachining technologies. The textured surface of the solar cell reduces frontal reflectivity, in order to consequently obtain the lowest possible reflectance. Heterojunction SnO2:In/n silicon substrate (''honeycomb" textured) solar cells were manufactured by the sol gel method over textured p and n-type single
Recent Advances in Mechatronics
This is a part of a study concerning influence of surface material and topography on tribological... more This is a part of a study concerning influence of surface material and topography on tribological behaviour. The determinations were developed using an experimental setup, which mainly consists in a safety clutch. The clutch, basically, consists of a steel disk and a special frictional disk manufactured from a ferodo disk. The steel disk was changed with another friction material manufactured
2009 International Semiconductor Conference, 2009
ABSTRACT A method to etch cantilever beams oriented in the <100> direction on (100)... more ABSTRACT A method to etch cantilever beams oriented in the <100> direction on (100) silicon wafers is presented. Backetching of the wafer, heavily doped boron etch stop, or anodic oxidation etch stop are not necessary. The method requires only two levels of masking and uses silicon dioxide as passivation material. Two techniques that offer information about the surface topography, SEM (scanning electron microscopy) and WLI (white light interferometry), were used.
2007 International Semiconductor Conference, 2007
In this paper we have investigated the molding and release parameters required for three- dimensi... more In this paper we have investigated the molding and release parameters required for three- dimensional micro/nanofabrication in order to optimize the process and to apply it in the fabrication of micro/nano photonic structures. The replicas for various patterns (dots, lines, prism and lens) were obtained in polymethylmethacrylate (PMMA), epoxy resin and polydimethylsiloxane (PDMS) in different conditions for polymer coating and curing.
Materials Science and Engineering: C, 2003
Inorganic-organic hybrid materials can offer multifunctionality and allow properties tailoring fr... more Inorganic-organic hybrid materials can offer multifunctionality and allow properties tailoring from subnanometer (atomic) to submillimeter (mesoscopic) length scales. That is why these films could play a significant role in the field of micro-and nano-photonic devices (waveguids, emitting devices, quantum dot devices, photonic band gaps and holographic materials). The organic groups can modify the inorganic backbone by reducing the connectivity of the gel network allowing thick film deposition and lessening the processing temperature. In order to follow the sol-gel chemistry in the case of the substituted alkoxides that influence the molecular species presented in solution at the moment of deposition, model systems based on tetraethoxysilane (TEOS), methyltriethoxysilane (MTEOS) and vinyltriethoxysilane (VTEOS) were investigated. The hybrid organic-inorganic sol-gel-based photonic components were realized with phenyltriethoxysilane (PTEOS). The composition and the process were optimized to allow a better control of the optical parameters (losses, refractive index, transmission), to reduce the processing temperature and to improve photosensitivity.
Journal of Luminescence, 2006
ABSTRACT This paper presents the design, simulation and experimental results of an integrated pro... more ABSTRACT This paper presents the design, simulation and experimental results of an integrated proximity sensor manufactured on silicon substrate. The sensor was designed for microrobotic applications like integration into a microgripper arm or detection of the position of gripper arms relative to an object. The structure is based on an SU8 polymeric optical waveguide splitted into three arms, integrated with a multielement photodetector on silicon substrate. Each element of the photodetector is a metal–semiconductor–metal (MSM) photodiode with Ti/Al Schottky interdigitated electrodes.The operation principle of this sensor consists in the light coupling in the central arm of the optical waveguide, interaction with the object (reflection) of the radiation which exits from this principal arm, the coupling of the “affected” radiation which comes back through the end of the waveguide and its splitting into three arms of the optical waveguide. From the optical waveguide, the light is coupled in photodiode and the photogenerated carriers are collected to the electrodes giving the electrical signal which is read and processed in real time.The optimal parameters of the waveguide (width, thicknesses of the core and the claddings) of the photodetector and the coupling between them were defined by simulation, using FDTD and BeamProp method (Opti FDTD software). Our microsensor can detect the position of an object in the range of 0–300 μm, as position sensor and with high precision in the range of zero to twice the wavelength, as proximity sensor.
Solar Energy Materials and Solar Cells, 2005
This paper presents the results of an experimental study regarding the increase in the efficiency... more This paper presents the results of an experimental study regarding the increase in the efficiency of the silicon solar cells by texturing the front surface. Designing, patterning and surface etching processes led to refined structures with very low losses of the incident optical radiation. ...
1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351)
The surface contamination was known to affect the roughening during anisotropic e<tching. We stud... more The surface contamination was known to affect the roughening during anisotropic e<tching. We studied the role of the initial surface states of silicon after different cleaning treatments (hydrogen-saturated, fluorine-saturated) over the way the ekhing proceeds. We investigated three types of ultimate-cleaning solutions after the standard RCA treatment: HF:H20 1:lO (followed by DI water rinsing and drying), HF:C2H,OH 1:lO (dried without any further rinsing), and 10% HCI in HF:H20 1: I (also dried without rinsing). Since atomic scale roughness variations, as well as contamination affect the gate oxide integrity, we have correlated these results with electrical parameters extracted from C-V characteristics.
Materials Science and Engineering: B, 2009
This paper presents a new solar-cell structure obtained by the front-surface texturization of mul... more This paper presents a new solar-cell structure obtained by the front-surface texturization of multicrystalline silicon substrate by laboratory technology and main equipments used in characterization of such devices. The structure consists of an antireflection coating, a silicon active layer, front and back wafer contacts. The main objective was the minimizing the production cost maintaining the device performances. For these reasons
2023 International Semiconductor Conference (CAS)
2004 International Semiconductor Conference. CAS 2004 Proceedings (IEEE Cat. No.04TH8748)
Micromachining and micro patterning of biocompatible substrates encourage the arrangement of cell... more Micromachining and micro patterning of biocompatible substrates encourage the arrangement of cells in vitro following the same morphofunctional patterns as in vivo. Adherence, multiplication and differentiation in vitro of the dermal fibroblasts on surface and bulk micro fabricated substrates represent a modern method for biocompatibility testing in view of further therapeutic applications.
This paper presents the results of an experimental study re-garding the increase in the efficienc... more This paper presents the results of an experimental study re-garding the increase in the efficiency of the silicon solar cells, using various methods for texturing the front surface. Designing, patterning and surface etch-ing processes led to obtain reined structures with very low losses of the incident optical radiation. This paper aims to compare the fabrication method using the proposed textured surfaces with the standard method.
CAS 2011 Proceedings (2011 International Semiconductor Conference), 2011
A comparative study of computation models for predicting the vibration modes of some MEMS structu... more A comparative study of computation models for predicting the vibration modes of some MEMS structures of cantilever type — as suspension arms of the inertial mass of a bulk-micromachined silicon accelerometer, reported to the experimentally measured values of resonance (natural) frequencies, is presented in this paper. The most appropriate values of silicon Young&amp;amp;amp;amp;amp;amp;#39;s modulus depending on the crystal orientation of
CAS 2010 Proceedings (International Semiconductor Conference), 2010
The paper deals with studying the mechanical structure of a bulk-micromachined silicon piezoresis... more The paper deals with studying the mechanical structure of a bulk-micromachined silicon piezoresistive accelerometer by using FEM (Finite Element Method). The vibration modes (resonant frequencies) and sensitivity were predicted. The results of numerical simulation, validated experimentally have pointed out the influence of manufacturing process parameters on the accelerometer performance.
CAS 2010 Proceedings (International Semiconductor Conference), 2010
This paper presents the TCAD techniques used for the simulation, optimisation and design of the B... more This paper presents the TCAD techniques used for the simulation, optimisation and design of the BioFET device parameters, using a specialised software package, ATLAS. The values of these parameters will prescribe the process fabrication and device size. Using EDA tools like LEDIT, the layers that will constitute the fabrication masks for both active and reference devices will be established, as
IFMBE Proceedings, 2010
This paper presents the enhanced performances of a glucose biosensor constructed with a dielectri... more This paper presents the enhanced performances of a glucose biosensor constructed with a dielectric multi-layer Si/SiO2/Si3N4/Al2O3. If the Si/SiO2 system is present in all the silicon integrated sensors, the biosensors processing involves special attention to the intermediate layer responsible for the biological receptors entrapping. A first experience imposes to use the Si3N4 layer over the SiO2 layer mainly to stops the Na+ and K+ ions diffusion from bio-environment toward the silicon transducer. These results are reflected in the CV traced curve and a minimum leakage current. The nitride besides to a nanometric top Al2O3 layer grown by anodization, helps to a better enzyme entrapping, maintains the GOD active centers and are in agreement with the planar technology requirements. An original Al2O3 deposition technique is presented. The final multilayer structure was characterized as a capacitor by CV-metry, ellipsometry, impedancemetry.
CAS 2005 Proceedings. 2005 International Semiconductor Conference, 2005.
The use of microfluidic devices in biomedical research creates clinically useful technologies and... more The use of microfluidic devices in biomedical research creates clinically useful technologies and devices (for biochemical reaction chambers, and physical particle separation), or in IC chip cooling applications has significant advantages. In the first case, because the fluid volumes within these microchannels are very small, usually several nanoliters, the amount of reagents and analytes used is quite small. In the second case, they present a negligible thermal resistance, due to direct contact with the chip dissipation surface. This paper presents some new technological methods used to prepare by surface microfabrication microchannels and other microfluidic elements, like chambers onto different substrates.
1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351)
Presented study was focus on optimization of planarization and metal conformity on steps in MOS t... more Presented study was focus on optimization of planarization and metal conformity on steps in MOS technology. The experiment regards a three fold problem: the structure of the planarization silicon dioxide thin film in order to optimized the slope of the contact windows, the metal used and the conformity of metal interconnections. We studied the profiles of contact windows configured in
2000 International Semiconductor Conference. 23rd Edition. CAS 2000 Proceedings (Cat. No.00TH8486), 2000
A frequent failure mechanism in I.C.'s CMOS polysilicon gate technology is the punch-through... more A frequent failure mechanism in I.C.'s CMOS polysilicon gate technology is the punch-through of NMOS transistor junction. The high doped drain-source N+ zone is obtained by high dose arsenic ion implantation. During the ion implantation an important amount of damage is induced in the silicon substrate and in the following thermal processes there appears a migration of the dislocations. We suppose that the migrating damage is in charge of the failure mechanism. The purpose of this paper is to identify the zone with maximum damage and to prove the migration of the defects during the thermal annealing. Finally is advanced a simple empirical model that allows predicting the final position/dimension of the silicon substrate damage zone
2006 International Semiconductor Conference, 2006
This paper presents a new silicon solar cell structure obtained by texturisation of the front sur... more This paper presents a new silicon solar cell structure obtained by texturisation of the front surface using silicon micromachining technologies. The textured surface of the solar cell reduces frontal reflectivity, in order to consequently obtain the lowest possible reflectance. Heterojunction SnO2:In/n silicon substrate (&#39;&#39;honeycomb&quot; textured) solar cells were manufactured by the sol gel method over textured p and n-type single
Recent Advances in Mechatronics
This is a part of a study concerning influence of surface material and topography on tribological... more This is a part of a study concerning influence of surface material and topography on tribological behaviour. The determinations were developed using an experimental setup, which mainly consists in a safety clutch. The clutch, basically, consists of a steel disk and a special frictional disk manufactured from a ferodo disk. The steel disk was changed with another friction material manufactured
2009 International Semiconductor Conference, 2009
ABSTRACT A method to etch cantilever beams oriented in the <100> direction on (100)... more ABSTRACT A method to etch cantilever beams oriented in the <100> direction on (100) silicon wafers is presented. Backetching of the wafer, heavily doped boron etch stop, or anodic oxidation etch stop are not necessary. The method requires only two levels of masking and uses silicon dioxide as passivation material. Two techniques that offer information about the surface topography, SEM (scanning electron microscopy) and WLI (white light interferometry), were used.
2007 International Semiconductor Conference, 2007
In this paper we have investigated the molding and release parameters required for three- dimensi... more In this paper we have investigated the molding and release parameters required for three- dimensional micro/nanofabrication in order to optimize the process and to apply it in the fabrication of micro/nano photonic structures. The replicas for various patterns (dots, lines, prism and lens) were obtained in polymethylmethacrylate (PMMA), epoxy resin and polydimethylsiloxane (PDMS) in different conditions for polymer coating and curing.
Materials Science and Engineering: C, 2003
Inorganic-organic hybrid materials can offer multifunctionality and allow properties tailoring fr... more Inorganic-organic hybrid materials can offer multifunctionality and allow properties tailoring from subnanometer (atomic) to submillimeter (mesoscopic) length scales. That is why these films could play a significant role in the field of micro-and nano-photonic devices (waveguids, emitting devices, quantum dot devices, photonic band gaps and holographic materials). The organic groups can modify the inorganic backbone by reducing the connectivity of the gel network allowing thick film deposition and lessening the processing temperature. In order to follow the sol-gel chemistry in the case of the substituted alkoxides that influence the molecular species presented in solution at the moment of deposition, model systems based on tetraethoxysilane (TEOS), methyltriethoxysilane (MTEOS) and vinyltriethoxysilane (VTEOS) were investigated. The hybrid organic-inorganic sol-gel-based photonic components were realized with phenyltriethoxysilane (PTEOS). The composition and the process were optimized to allow a better control of the optical parameters (losses, refractive index, transmission), to reduce the processing temperature and to improve photosensitivity.
Journal of Luminescence, 2006
ABSTRACT This paper presents the design, simulation and experimental results of an integrated pro... more ABSTRACT This paper presents the design, simulation and experimental results of an integrated proximity sensor manufactured on silicon substrate. The sensor was designed for microrobotic applications like integration into a microgripper arm or detection of the position of gripper arms relative to an object. The structure is based on an SU8 polymeric optical waveguide splitted into three arms, integrated with a multielement photodetector on silicon substrate. Each element of the photodetector is a metal–semiconductor–metal (MSM) photodiode with Ti/Al Schottky interdigitated electrodes.The operation principle of this sensor consists in the light coupling in the central arm of the optical waveguide, interaction with the object (reflection) of the radiation which exits from this principal arm, the coupling of the “affected” radiation which comes back through the end of the waveguide and its splitting into three arms of the optical waveguide. From the optical waveguide, the light is coupled in photodiode and the photogenerated carriers are collected to the electrodes giving the electrical signal which is read and processed in real time.The optimal parameters of the waveguide (width, thicknesses of the core and the claddings) of the photodetector and the coupling between them were defined by simulation, using FDTD and BeamProp method (Opti FDTD software). Our microsensor can detect the position of an object in the range of 0–300 μm, as position sensor and with high precision in the range of zero to twice the wavelength, as proximity sensor.
Solar Energy Materials and Solar Cells, 2005
This paper presents the results of an experimental study regarding the increase in the efficiency... more This paper presents the results of an experimental study regarding the increase in the efficiency of the silicon solar cells by texturing the front surface. Designing, patterning and surface etching processes led to refined structures with very low losses of the incident optical radiation. ...
1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351)
The surface contamination was known to affect the roughening during anisotropic e<tching. We stud... more The surface contamination was known to affect the roughening during anisotropic e<tching. We studied the role of the initial surface states of silicon after different cleaning treatments (hydrogen-saturated, fluorine-saturated) over the way the ekhing proceeds. We investigated three types of ultimate-cleaning solutions after the standard RCA treatment: HF:H20 1:lO (followed by DI water rinsing and drying), HF:C2H,OH 1:lO (dried without any further rinsing), and 10% HCI in HF:H20 1: I (also dried without rinsing). Since atomic scale roughness variations, as well as contamination affect the gate oxide integrity, we have correlated these results with electrical parameters extracted from C-V characteristics.
Materials Science and Engineering: B, 2009
This paper presents a new solar-cell structure obtained by the front-surface texturization of mul... more This paper presents a new solar-cell structure obtained by the front-surface texturization of multicrystalline silicon substrate by laboratory technology and main equipments used in characterization of such devices. The structure consists of an antireflection coating, a silicon active layer, front and back wafer contacts. The main objective was the minimizing the production cost maintaining the device performances. For these reasons