Guillermo Villanueva - Academia.edu (original) (raw)

Uploads

Papers by Guillermo Villanueva

Research paper thumbnail of Stenciled conducting bismuth nanowires

Journal of Vacuum Science & Technology B, 2010

Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporati... more Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporation. This technique provides good electrical contact resistance by having the nanowire structure and the contact pads deposited at the same time. It has also the advantage of ...

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Resistivity measurements of gold wires fabricated by stencil lithography on flexible polymer substrates

Microelectronic Engineering, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Etching of sub-micrometer structures through Stencil

Microelectronic Engineering, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Metallic Nanowires by Full Wafer Stencil Lithography

Nano Letters, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Reusability of nanostencils for the patterning of Aluminum nanostructures by selective wet etching

Microelectronic Engineering, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Microcollimator for Micrometer-Wide Stripe Irradiation of Cells Using 20–30 keV X Rays

Radiation Research, 2009

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Stenciled conducting bismuth nanowires

Journal of Vacuum Science & Technology B, 2010

Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporati... more Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporation. This technique provides good electrical contact resistance by having the nanowire structure and the contact pads deposited at the same time. It has also the advantage of ...

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Resistivity measurements of gold wires fabricated by stencil lithography on flexible polymer substrates

Microelectronic Engineering, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Etching of sub-micrometer structures through Stencil

Microelectronic Engineering, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Metallic Nanowires by Full Wafer Stencil Lithography

Nano Letters, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Reusability of nanostencils for the patterning of Aluminum nanostructures by selective wet etching

Microelectronic Engineering, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Microcollimator for Micrometer-Wide Stripe Irradiation of Cells Using 20–30 keV X Rays

Radiation Research, 2009

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Direct Etching of High Aspect Ratio Structures Through a Stencil

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Silicon microcantilevers with MOSFET detection

Microelectronic Engineering, 2010

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Production of structures for microfluidics using polymer imprint techniques

Microelectronic Engineering, 2005

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Conduction in rectangular quasi-one-dimensional and two-dimensional random resistor networks away from the percolation threshold

Physical Review E, 2009

Bookmarks Related papers MentionsView impact

Research paper thumbnail of A single nanotrench in a palladium microwire for hydrogen detection

Nanotechnology, 2008

The hydrogen sensing characteristics of a single nanotrench fabricated by focused ion beam millin... more The hydrogen sensing characteristics of a single nanotrench fabricated by focused ion beam milling (FIB) in an evaporated palladium microwire are presented. In situ atomic force microscopy (AFM) measurements proved that, in the presence of H(2), the trench closes and electrically connects the initially separated parts of the wire due to the increase in volume of the material. Therewith, an electrical current can be switched through the wire. With experiments under various H(2) concentrations and a mathematical model, we describe the closing mechanism of the trench with respect to various parameters, including the substrate material, film thickness, trench size and wire dimensions. Results have been compared with those from equivalent continuous wires. Thin SiO(2) and polyimide (PI) layers on silicon were used to study the effect of substrate elasticity. Sufficient lateral expansion of Pd to close trenches of up to 70 nm in width has only been observed on PI, which we attribute to its advantageous elastic properties. The scale of the response times allowed the observation of two superposing effects: the chemical conversion of Pd to PdH(x) and the mechanical closing of the trench.

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Submicron piezoresistive cantilevers in a CMOS-compatible technology for intermolecular force detection

Microelectronic Engineering, 2004

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Piezoresistive cantilevers in a commercial CMOS technology for intermolecular force detection

Microelectronic Engineering, 2006

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Stress and aging minimization in photoplastic AFM probes

Microelectronic Engineering, 2009

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Stenciled conducting bismuth nanowires

Journal of Vacuum Science & Technology B, 2010

Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporati... more Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporation. This technique provides good electrical contact resistance by having the nanowire structure and the contact pads deposited at the same time. It has also the advantage of ...

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Resistivity measurements of gold wires fabricated by stencil lithography on flexible polymer substrates

Microelectronic Engineering, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Etching of sub-micrometer structures through Stencil

Microelectronic Engineering, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Metallic Nanowires by Full Wafer Stencil Lithography

Nano Letters, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Reusability of nanostencils for the patterning of Aluminum nanostructures by selective wet etching

Microelectronic Engineering, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Microcollimator for Micrometer-Wide Stripe Irradiation of Cells Using 20–30 keV X Rays

Radiation Research, 2009

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Stenciled conducting bismuth nanowires

Journal of Vacuum Science & Technology B, 2010

Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporati... more Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporation. This technique provides good electrical contact resistance by having the nanowire structure and the contact pads deposited at the same time. It has also the advantage of ...

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Resistivity measurements of gold wires fabricated by stencil lithography on flexible polymer substrates

Microelectronic Engineering, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Etching of sub-micrometer structures through Stencil

Microelectronic Engineering, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Metallic Nanowires by Full Wafer Stencil Lithography

Nano Letters, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Reusability of nanostencils for the patterning of Aluminum nanostructures by selective wet etching

Microelectronic Engineering, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Microcollimator for Micrometer-Wide Stripe Irradiation of Cells Using 20–30 keV X Rays

Radiation Research, 2009

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Direct Etching of High Aspect Ratio Structures Through a Stencil

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Silicon microcantilevers with MOSFET detection

Microelectronic Engineering, 2010

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Production of structures for microfluidics using polymer imprint techniques

Microelectronic Engineering, 2005

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Conduction in rectangular quasi-one-dimensional and two-dimensional random resistor networks away from the percolation threshold

Physical Review E, 2009

Bookmarks Related papers MentionsView impact

Research paper thumbnail of A single nanotrench in a palladium microwire for hydrogen detection

Nanotechnology, 2008

The hydrogen sensing characteristics of a single nanotrench fabricated by focused ion beam millin... more The hydrogen sensing characteristics of a single nanotrench fabricated by focused ion beam milling (FIB) in an evaporated palladium microwire are presented. In situ atomic force microscopy (AFM) measurements proved that, in the presence of H(2), the trench closes and electrically connects the initially separated parts of the wire due to the increase in volume of the material. Therewith, an electrical current can be switched through the wire. With experiments under various H(2) concentrations and a mathematical model, we describe the closing mechanism of the trench with respect to various parameters, including the substrate material, film thickness, trench size and wire dimensions. Results have been compared with those from equivalent continuous wires. Thin SiO(2) and polyimide (PI) layers on silicon were used to study the effect of substrate elasticity. Sufficient lateral expansion of Pd to close trenches of up to 70 nm in width has only been observed on PI, which we attribute to its advantageous elastic properties. The scale of the response times allowed the observation of two superposing effects: the chemical conversion of Pd to PdH(x) and the mechanical closing of the trench.

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Submicron piezoresistive cantilevers in a CMOS-compatible technology for intermolecular force detection

Microelectronic Engineering, 2004

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Piezoresistive cantilevers in a commercial CMOS technology for intermolecular force detection

Microelectronic Engineering, 2006

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Stress and aging minimization in photoplastic AFM probes

Microelectronic Engineering, 2009

Bookmarks Related papers MentionsView impact