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Papers by Guillermo Villanueva
Journal of Vacuum Science & Technology B, 2010
Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporati... more Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporation. This technique provides good electrical contact resistance by having the nanowire structure and the contact pads deposited at the same time. It has also the advantage of ...
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Microelectronic Engineering, 2008
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Nano Letters, 2008
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Journal of Vacuum Science & Technology B, 2010
Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporati... more Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporation. This technique provides good electrical contact resistance by having the nanowire structure and the contact pads deposited at the same time. It has also the advantage of ...
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Microelectronic Engineering, 2008
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Nano Letters, 2008
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Radiation Research, 2009
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Physical Review E, 2009
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Nanotechnology, 2008
The hydrogen sensing characteristics of a single nanotrench fabricated by focused ion beam millin... more The hydrogen sensing characteristics of a single nanotrench fabricated by focused ion beam milling (FIB) in an evaporated palladium microwire are presented. In situ atomic force microscopy (AFM) measurements proved that, in the presence of H(2), the trench closes and electrically connects the initially separated parts of the wire due to the increase in volume of the material. Therewith, an electrical current can be switched through the wire. With experiments under various H(2) concentrations and a mathematical model, we describe the closing mechanism of the trench with respect to various parameters, including the substrate material, film thickness, trench size and wire dimensions. Results have been compared with those from equivalent continuous wires. Thin SiO(2) and polyimide (PI) layers on silicon were used to study the effect of substrate elasticity. Sufficient lateral expansion of Pd to close trenches of up to 70 nm in width has only been observed on PI, which we attribute to its advantageous elastic properties. The scale of the response times allowed the observation of two superposing effects: the chemical conversion of Pd to PdH(x) and the mechanical closing of the trench.
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Microelectronic Engineering, 2004
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Journal of Vacuum Science & Technology B, 2010
Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporati... more Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporation. This technique provides good electrical contact resistance by having the nanowire structure and the contact pads deposited at the same time. It has also the advantage of ...
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Microelectronic Engineering, 2008
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Nano Letters, 2008
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Radiation Research, 2009
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Journal of Vacuum Science & Technology B, 2010
Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporati... more Stencil lithography is used here for the fabrication of bismuth nanowires using thermal evaporation. This technique provides good electrical contact resistance by having the nanowire structure and the contact pads deposited at the same time. It has also the advantage of ...
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Microelectronic Engineering, 2008
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Physical Review E, 2009
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Nanotechnology, 2008
The hydrogen sensing characteristics of a single nanotrench fabricated by focused ion beam millin... more The hydrogen sensing characteristics of a single nanotrench fabricated by focused ion beam milling (FIB) in an evaporated palladium microwire are presented. In situ atomic force microscopy (AFM) measurements proved that, in the presence of H(2), the trench closes and electrically connects the initially separated parts of the wire due to the increase in volume of the material. Therewith, an electrical current can be switched through the wire. With experiments under various H(2) concentrations and a mathematical model, we describe the closing mechanism of the trench with respect to various parameters, including the substrate material, film thickness, trench size and wire dimensions. Results have been compared with those from equivalent continuous wires. Thin SiO(2) and polyimide (PI) layers on silicon were used to study the effect of substrate elasticity. Sufficient lateral expansion of Pd to close trenches of up to 70 nm in width has only been observed on PI, which we attribute to its advantageous elastic properties. The scale of the response times allowed the observation of two superposing effects: the chemical conversion of Pd to PdH(x) and the mechanical closing of the trench.
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Microelectronic Engineering, 2004
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