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Papers by AIMI NOORLIYANA HASHIM

Materials

This paper presents an assessment of the effect of isothermal annealing of Sn whisker growth beha... more This paper presents an assessment of the effect of isothermal annealing of Sn whisker growth behavior on the surface of Sn0.7Cu0.05Ni solder joints using the hot-dip soldering technique. Sn0.7Cu and Sn0.7Cu0.05Ni solder joints with a similar solder coating thickness was aged up to 600 h in room temperature and annealed under 50 °C and 105 °C conditions. Through the observations, the significant outcome was the suppressing effect of Sn0.7Cu0.05Ni on Sn whisker growth in terms of density and length reduction. The fast atomic diffusion of isothermal annealing consequently reduced the stress gradient of Sn whisker growth on the Sn0.7Cu0.05Ni solder joint. It was also established that the smaller (Cu,Ni)6Sn5 grain size and stability characteristic of hexagonal η-Cu6Sn5 considerably contribute to the residual stress diminished in the (Cu,Ni)6Sn5 IMC interfacial layer and are able to suppress the growth of Sn whiskers on the Sn0.7Cu0.05Ni solder joint. The findings of this study provide en...

Key Engineering Materials, 2013

Since the metallic elements are covered with or encapsulated by various plastic or ceramic materi... more Since the metallic elements are covered with or encapsulated by various plastic or ceramic materials on printed circuit boards (PCBs), a pre-treatment process allowing their liberation and separation is first needed in order to facilitate proficient extraction. In this work, a fundamental study has been carried out to recover metallic concentrates from PCBs scraps. The most important step is to separate or release particles from the associated gangue minerals at the possible liberation particle size. The samples of printed circuit boards were separated into the magnetic and non-magnetic fractions by Rare-earth Roll Magnetic Separator. Then, the magnetic and non-magnetic fractions were separated to heavy fraction (metallic elements) and light fraction (plastic) by Mozley Laboratory Table Separator. Results show that the unliberated particles still remain in the comminution fines PCBs. The use of Rare-earth roll magnetic separation was clarified that the Fe, Ni and Zn element tend to ...

IOP Conference Series: Materials Science and Engineering

It has been widely confirmed that alloying significantly can mitigate the formation of tin (Sn) w... more It has been widely confirmed that alloying significantly can mitigate the formation of tin (Sn) whiskers and consequently became a possible candidate as a lead-free alloys coating material in the microelectronics industry. In this study, the effect of 0.05 wt.% Ni addition on the formation and growth of Sn whisker in Sn-0.7Cu solder coatings have been investigated under continuous mechanically stress induced at room temperature. It is clearly found that Ni addition have significantly enhanced stress relaxation by reducing the growth rate of formation Sn whiskers in Sn-0.7Cu solder coatings. The morphology of (Cu,Ni)6Sn5 interfacial IMC was more refine and thinner with a fine scallop-shaped interfacial intermetallic layer purposely to lower the compressive stress of Sn coating and extend the nucleation period, thus mitigating the formation and growth of Sn whiskers.

IOP Conference Series: Materials Science and Engineering

This study investigates the effects of Gallium addition to the thermal behaviour and whiskers gro... more This study investigates the effects of Gallium addition to the thermal behaviour and whiskers growth under electrical current stressing to the microstructure and intermetallic (IMCs) between solder and copper substrate. The samples were dipped using Sn-0.7Cu and Sn-0.7-0.05Ga solder and further continued with electromigration process for whiskers growth observation. The characterization were then analysed using Scanning Electron Microscopy (SEM) on the surface and intermetallic layer. From the observation, the addition of 0.05% Ga has lowered the melting point of Sn-0.7Cu-0.05Ga Copper and refined the microstructure. There is no indication of new phase form after 0.05%Ga addition. Furthermore, whiskers were observed to grow at both Sn-0.7Cu and Sn-0.7Cu-0.05Ga. However, the whiskers growth on both cathode and anode sides have been reduced with the Ga addition. It is also observed that the hardness increased with the addition of Ga element to the solder.

IOP Conference Series: Materials Science and Engineering

The growth of Sn whiskers on Cu substrate Pb-free solder is considered as one of the emerging pro... more The growth of Sn whiskers on Cu substrate Pb-free solder is considered as one of the emerging problems in electric and electronic devices as well as in aerospace interconnects. Electrical current stressing have been identified as a major driving force for Sn whisker formation. In this paper, we investigate the mechanism of Sn whisker growth through the effect of electromigration of Sn on copper substrate. Test samples were prepared by dipping method before proceed with current testing, and the characterization of whisker growths were evaluated using the Scanning Electron Microscopy (SEM) on the deposits near the anode and cathode areas. Results demonstrate that the accumulation took place at the anode side forming whiskers and depletion occured at the cathode side leading to the formation of void with the effect of current stressing associated with different exposure of time.

IOP Conference Series: Materials Science and Engineering

Due to the transition of the electronics industry to lead-free solders, the issue of tin (Sn) whi... more Due to the transition of the electronics industry to lead-free solders, the issue of tin (Sn) whisker has become one of the most imperative issues that need to be resolved. Moreover, with the increasing demand for electronics miniaturization, Sn whisker growth is a severe threat to the reliability of microelectronic devices. Sn whisker is a conductive tin structure that grows spontaneously from tin finished surfaces, which can lead to well-documented system failures in electronics industries. Assessment of the Sn whisker growth is difficult because of the slow and unpredictable nature of the Sn whisker formation. This paper presents the results of morphology analysis of Sn whisker growth in terms of Sn whiskers shape, average density and maximum length of Sn whisker on Sn-Cu solder finished using scanning electron microscope (SEM). Micro-indentation test was used to accelerate the growth of Sn whisker at room temperature storage.

Solid State Phenomena

Since the environmental regulations of Reduction of Hazardous Substances (RoHS) directive came in... more Since the environmental regulations of Reduction of Hazardous Substances (RoHS) directive came into effect in Europe and Asia on July 1, 2006, requiring the removal of any lead (Pb) content from the electronics industry, the issue of tin (Sn) whisker growth from pure Sn and SnPb-free alloys has become one of the most imperative issues that need to be resolved. Moreover, with the increasing demand for electronics miniaturization, Sn whisker growth is a severe threat to the reliability of microelectronic devices. Sn whiskers grow spontaneously from an electrodeposited tin coating on a copper substrate at room temperature, which can lead to well-documented system failures in electronics industries. The Sn whisker phenomenon unavoidably gives rise to troubles. This paper briefly reviews to better understand the fundamental properties of Sn whisker growth and at the same time discover the effective mitigation practices for whisker growth in green electronic devices. It is generally accep...

The characteristics of mortars made from ordinary Portland cement with various composition of gro... more The characteristics of mortars made from ordinary Portland cement with various composition of ground granulated blast furnace slag (GGBS) were investigated in this research. Ground granulated blast furnace slag (GGBS) was chose as an alternative binder to partially replace high energy consuming Portland cement in concrete according to the composition of the slag itself. GGBS were blended with Portland cement from 20 to 80 weight percent. The samples were mechanically tested for water absorption and compressive strength after 7, 14 and 28 days. From research, the most suitable proportion is 60% OPC + 40% GGBS which gain the highest compressive strength and the lowest water absorption among OPC blended mortars. These mortars used water to hydrate and solidify with ratio water to binders 0.7 equally.

IOP Conference Series: Materials Science and Engineering

Electroplated tin (Sn)Limeited finishes are widely used in the electronics industry due to their ... more Electroplated tin (Sn)Limeited finishes are widely used in the electronics industry due to their excellent solderability, electrical conductivity and corrosion resistance. However, since prohibiting the use of lead (Pb) in electronics, the issue of tin (Sn) whisker has become one of the most imperative issues that need to be resolved. Moreover, with the increasing demand for electronics miniaturization, Sn whisker growth is a severe threat to the reliability of microelectronic device. This paper investigates the effect of electroplating current density (10, 30 and 50 mA/cm2) on whisker growth at room temperature. A simple micro- indentation test was used to accelerate continuously the growth of Sn whisker at room temperature storage for 24 h. Morphology analysis of Sn whisker growth was done using scanning electron microscope (SEM) and image-J Software. Axial length of the Sn whisker was calculated by using JEDEC Standards (JESD22-A121A).

The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth ... more The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisker under continuous mechanical stress induced. The Sn-0.7Cu-0.05Ni solder joint has a noticeable effect of suppression by diminishing the susceptibility of nucleation and growth of Sn whisker. By using a synchrotron micro X-ray fluorescence (µ-XRF) spectroscopy, it was found that a small amount of Ni alters the microstructure of Cu6Sn5 to form a (Cu,Ni)6Sn5 intermetallic layer. The morphology structure of the (Cu,Ni)6Sn5 interfacial intermetallic layer and Sn whisker growth were investigated by scanning electron microscope (SEM) in secondary and backscattered electron imaging mode, which showed that there is a strong correlation between the formation of Sn whisker and the composition of solde...

Applied Mechanics and Materials

An innovative and novel technology method of processing called Turbo-Mixing Reactive Precipitatio... more An innovative and novel technology method of processing called Turbo-Mixing Reactive Precipitation (TMRP) design proposed as an alternative to this current processing or conventional productions of fine precipitated calcium carbonate (Nano-PCC) in turbo-mixing conditions. In this paper, the effect of the stirring rate onto morphology, particle sizes and reaction time of the precipitated CaCO 3 particles was discussed. CaCO 3 nano-particles with an average particle size of approximately 15.75 nm were successfully obtained by stirring rotation speed at 900 rpm. The structural analysis was conducted using a Scanning Electron Microscope (SEM) and a Field Emission Scanning Electron Microscope (FESEM). The results showed that the increasing of the multiple's impeller stirring rotation speed is in favor of the formation of the spherical vaterite.

Applied Mechanics and Materials, 2015

Energy saving in building technology is among the most critical problems in the world. Thus it is... more Energy saving in building technology is among the most critical problems in the world. Thus it is a need to develop sustainable alternatives to conventional concrete utilizing more environmental friendly materials. One of the possibilities to work out is the massive usage of industrial wastes like ground granulated blast furnace slag (GGBS) to turn them to useful environmental friendly and technologically advantageous cementitious materials. In this study, ground granulated blast furnace slag (GGBS) is used to produce of alkali activated slag (AAS) mortar with the effect of alkaline activator concentration. Alkali activated slag (AAS) mortar is accelerated using alkaline solution of sodium silicate mixed with sodium hydroxide. The fixed ratio of sodium silicate to sodium hydroxide is 1.7 and the concentration of sodium hydroxide is varied from 6M to 12M. Concentration of 10M NaOH promotes the best properties of mortar by achieving the greatest compressive strength. Substitution of m...

Materials

This paper presents an assessment of the effect of isothermal annealing of Sn whisker growth beha... more This paper presents an assessment of the effect of isothermal annealing of Sn whisker growth behavior on the surface of Sn0.7Cu0.05Ni solder joints using the hot-dip soldering technique. Sn0.7Cu and Sn0.7Cu0.05Ni solder joints with a similar solder coating thickness was aged up to 600 h in room temperature and annealed under 50 °C and 105 °C conditions. Through the observations, the significant outcome was the suppressing effect of Sn0.7Cu0.05Ni on Sn whisker growth in terms of density and length reduction. The fast atomic diffusion of isothermal annealing consequently reduced the stress gradient of Sn whisker growth on the Sn0.7Cu0.05Ni solder joint. It was also established that the smaller (Cu,Ni)6Sn5 grain size and stability characteristic of hexagonal η-Cu6Sn5 considerably contribute to the residual stress diminished in the (Cu,Ni)6Sn5 IMC interfacial layer and are able to suppress the growth of Sn whiskers on the Sn0.7Cu0.05Ni solder joint. The findings of this study provide en...

Key Engineering Materials, 2013

Since the metallic elements are covered with or encapsulated by various plastic or ceramic materi... more Since the metallic elements are covered with or encapsulated by various plastic or ceramic materials on printed circuit boards (PCBs), a pre-treatment process allowing their liberation and separation is first needed in order to facilitate proficient extraction. In this work, a fundamental study has been carried out to recover metallic concentrates from PCBs scraps. The most important step is to separate or release particles from the associated gangue minerals at the possible liberation particle size. The samples of printed circuit boards were separated into the magnetic and non-magnetic fractions by Rare-earth Roll Magnetic Separator. Then, the magnetic and non-magnetic fractions were separated to heavy fraction (metallic elements) and light fraction (plastic) by Mozley Laboratory Table Separator. Results show that the unliberated particles still remain in the comminution fines PCBs. The use of Rare-earth roll magnetic separation was clarified that the Fe, Ni and Zn element tend to ...

IOP Conference Series: Materials Science and Engineering

It has been widely confirmed that alloying significantly can mitigate the formation of tin (Sn) w... more It has been widely confirmed that alloying significantly can mitigate the formation of tin (Sn) whiskers and consequently became a possible candidate as a lead-free alloys coating material in the microelectronics industry. In this study, the effect of 0.05 wt.% Ni addition on the formation and growth of Sn whisker in Sn-0.7Cu solder coatings have been investigated under continuous mechanically stress induced at room temperature. It is clearly found that Ni addition have significantly enhanced stress relaxation by reducing the growth rate of formation Sn whiskers in Sn-0.7Cu solder coatings. The morphology of (Cu,Ni)6Sn5 interfacial IMC was more refine and thinner with a fine scallop-shaped interfacial intermetallic layer purposely to lower the compressive stress of Sn coating and extend the nucleation period, thus mitigating the formation and growth of Sn whiskers.

IOP Conference Series: Materials Science and Engineering

This study investigates the effects of Gallium addition to the thermal behaviour and whiskers gro... more This study investigates the effects of Gallium addition to the thermal behaviour and whiskers growth under electrical current stressing to the microstructure and intermetallic (IMCs) between solder and copper substrate. The samples were dipped using Sn-0.7Cu and Sn-0.7-0.05Ga solder and further continued with electromigration process for whiskers growth observation. The characterization were then analysed using Scanning Electron Microscopy (SEM) on the surface and intermetallic layer. From the observation, the addition of 0.05% Ga has lowered the melting point of Sn-0.7Cu-0.05Ga Copper and refined the microstructure. There is no indication of new phase form after 0.05%Ga addition. Furthermore, whiskers were observed to grow at both Sn-0.7Cu and Sn-0.7Cu-0.05Ga. However, the whiskers growth on both cathode and anode sides have been reduced with the Ga addition. It is also observed that the hardness increased with the addition of Ga element to the solder.

IOP Conference Series: Materials Science and Engineering

The growth of Sn whiskers on Cu substrate Pb-free solder is considered as one of the emerging pro... more The growth of Sn whiskers on Cu substrate Pb-free solder is considered as one of the emerging problems in electric and electronic devices as well as in aerospace interconnects. Electrical current stressing have been identified as a major driving force for Sn whisker formation. In this paper, we investigate the mechanism of Sn whisker growth through the effect of electromigration of Sn on copper substrate. Test samples were prepared by dipping method before proceed with current testing, and the characterization of whisker growths were evaluated using the Scanning Electron Microscopy (SEM) on the deposits near the anode and cathode areas. Results demonstrate that the accumulation took place at the anode side forming whiskers and depletion occured at the cathode side leading to the formation of void with the effect of current stressing associated with different exposure of time.

IOP Conference Series: Materials Science and Engineering

Due to the transition of the electronics industry to lead-free solders, the issue of tin (Sn) whi... more Due to the transition of the electronics industry to lead-free solders, the issue of tin (Sn) whisker has become one of the most imperative issues that need to be resolved. Moreover, with the increasing demand for electronics miniaturization, Sn whisker growth is a severe threat to the reliability of microelectronic devices. Sn whisker is a conductive tin structure that grows spontaneously from tin finished surfaces, which can lead to well-documented system failures in electronics industries. Assessment of the Sn whisker growth is difficult because of the slow and unpredictable nature of the Sn whisker formation. This paper presents the results of morphology analysis of Sn whisker growth in terms of Sn whiskers shape, average density and maximum length of Sn whisker on Sn-Cu solder finished using scanning electron microscope (SEM). Micro-indentation test was used to accelerate the growth of Sn whisker at room temperature storage.

Solid State Phenomena

Since the environmental regulations of Reduction of Hazardous Substances (RoHS) directive came in... more Since the environmental regulations of Reduction of Hazardous Substances (RoHS) directive came into effect in Europe and Asia on July 1, 2006, requiring the removal of any lead (Pb) content from the electronics industry, the issue of tin (Sn) whisker growth from pure Sn and SnPb-free alloys has become one of the most imperative issues that need to be resolved. Moreover, with the increasing demand for electronics miniaturization, Sn whisker growth is a severe threat to the reliability of microelectronic devices. Sn whiskers grow spontaneously from an electrodeposited tin coating on a copper substrate at room temperature, which can lead to well-documented system failures in electronics industries. The Sn whisker phenomenon unavoidably gives rise to troubles. This paper briefly reviews to better understand the fundamental properties of Sn whisker growth and at the same time discover the effective mitigation practices for whisker growth in green electronic devices. It is generally accep...

The characteristics of mortars made from ordinary Portland cement with various composition of gro... more The characteristics of mortars made from ordinary Portland cement with various composition of ground granulated blast furnace slag (GGBS) were investigated in this research. Ground granulated blast furnace slag (GGBS) was chose as an alternative binder to partially replace high energy consuming Portland cement in concrete according to the composition of the slag itself. GGBS were blended with Portland cement from 20 to 80 weight percent. The samples were mechanically tested for water absorption and compressive strength after 7, 14 and 28 days. From research, the most suitable proportion is 60% OPC + 40% GGBS which gain the highest compressive strength and the lowest water absorption among OPC blended mortars. These mortars used water to hydrate and solidify with ratio water to binders 0.7 equally.

IOP Conference Series: Materials Science and Engineering

Electroplated tin (Sn)Limeited finishes are widely used in the electronics industry due to their ... more Electroplated tin (Sn)Limeited finishes are widely used in the electronics industry due to their excellent solderability, electrical conductivity and corrosion resistance. However, since prohibiting the use of lead (Pb) in electronics, the issue of tin (Sn) whisker has become one of the most imperative issues that need to be resolved. Moreover, with the increasing demand for electronics miniaturization, Sn whisker growth is a severe threat to the reliability of microelectronic device. This paper investigates the effect of electroplating current density (10, 30 and 50 mA/cm2) on whisker growth at room temperature. A simple micro- indentation test was used to accelerate continuously the growth of Sn whisker at room temperature storage for 24 h. Morphology analysis of Sn whisker growth was done using scanning electron microscope (SEM) and image-J Software. Axial length of the Sn whisker was calculated by using JEDEC Standards (JESD22-A121A).

The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth ... more The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisker under continuous mechanical stress induced. The Sn-0.7Cu-0.05Ni solder joint has a noticeable effect of suppression by diminishing the susceptibility of nucleation and growth of Sn whisker. By using a synchrotron micro X-ray fluorescence (µ-XRF) spectroscopy, it was found that a small amount of Ni alters the microstructure of Cu6Sn5 to form a (Cu,Ni)6Sn5 intermetallic layer. The morphology structure of the (Cu,Ni)6Sn5 interfacial intermetallic layer and Sn whisker growth were investigated by scanning electron microscope (SEM) in secondary and backscattered electron imaging mode, which showed that there is a strong correlation between the formation of Sn whisker and the composition of solde...

Applied Mechanics and Materials

An innovative and novel technology method of processing called Turbo-Mixing Reactive Precipitatio... more An innovative and novel technology method of processing called Turbo-Mixing Reactive Precipitation (TMRP) design proposed as an alternative to this current processing or conventional productions of fine precipitated calcium carbonate (Nano-PCC) in turbo-mixing conditions. In this paper, the effect of the stirring rate onto morphology, particle sizes and reaction time of the precipitated CaCO 3 particles was discussed. CaCO 3 nano-particles with an average particle size of approximately 15.75 nm were successfully obtained by stirring rotation speed at 900 rpm. The structural analysis was conducted using a Scanning Electron Microscope (SEM) and a Field Emission Scanning Electron Microscope (FESEM). The results showed that the increasing of the multiple's impeller stirring rotation speed is in favor of the formation of the spherical vaterite.

Applied Mechanics and Materials, 2015

Energy saving in building technology is among the most critical problems in the world. Thus it is... more Energy saving in building technology is among the most critical problems in the world. Thus it is a need to develop sustainable alternatives to conventional concrete utilizing more environmental friendly materials. One of the possibilities to work out is the massive usage of industrial wastes like ground granulated blast furnace slag (GGBS) to turn them to useful environmental friendly and technologically advantageous cementitious materials. In this study, ground granulated blast furnace slag (GGBS) is used to produce of alkali activated slag (AAS) mortar with the effect of alkaline activator concentration. Alkali activated slag (AAS) mortar is accelerated using alkaline solution of sodium silicate mixed with sodium hydroxide. The fixed ratio of sodium silicate to sodium hydroxide is 1.7 and the concentration of sodium hydroxide is varied from 6M to 12M. Concentration of 10M NaOH promotes the best properties of mortar by achieving the greatest compressive strength. Substitution of m...