Jeff Punch - Academia.edu (original) (raw)
Papers by Jeff Punch
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012
Microelectronics Reliability
Surface mount chip resistors are amongst the simplest and most inexpensive of all components used... more Surface mount chip resistors are amongst the simplest and most inexpensive of all components used in electronic circuits and systems. Typically, resistor failure modes include open circuits, resistive shorts or variations in resistance indicating parametric drift or intermittent failure, which in some applications result in overall system failure. Corrosion is currently believed to be the number one failure mechanism for chip resistors deployed in developing markets such as Central and Latin America, Asia, India and Pacific regions where aggressive corrosive conditions are prevalent. The objective of this study is to develop a test to identify or screen out corrosion-susceptible parts. Ten precision chip resistors types representative of resistors in contemporary printed circuit board assemblies are subjected to a well-defined multi-stress screen which comprises thermal cycling and mixed flowing gas exposure. The combination of thermal cycling and corrosive gas exposure is shown to ...
Volume 10: Heat and Mass Transport Processes, Parts A and B, 2011
ABSTRACT Photonics Integrated Circuits (PICs), a feature of contemporary optical communications t... more ABSTRACT Photonics Integrated Circuits (PICs), a feature of contemporary optical communications technologies, can represent a stringent packaging challenge, particularly in terms of their requirements for thermal control. Devices such as laser arrays can ...
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004
Claire Ryan', Shane O'Neill', John... more Claire Ryan', Shane O'Neill', John Donovan*, Jeff Punch', Bryan Rodgersl, Eamonn Murphy' ... 1.Stokes Research Institute University of Limerick Limerick, Ireland Phone: (353) 61-234231 Fax: (353) 61-202393 Email: claire.rvan@ul.ie ... 2. Institute of Technology, Sligo, ...
Proceedings of the 15th International Heat Transfer Conference, 2014
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 2004
ABSTRACT There is considerable reported evidence that a large percentage of failures which afflic... more ABSTRACT There is considerable reported evidence that a large percentage of failures which afflict portable electronic products are due to impact or shock during use. Failures of the external housing, internal electronic components, package-to-board interconnects, and liquid ...
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2012
This study compares the creep behavior of joint-scale Sn1.0Ag0.5Cu (SAC105) and Sn3.0Ag0.5Cu (SAC... more This study compares the creep behavior of joint-scale Sn1.0Ag0.5Cu (SAC105) and Sn3.0Ag0.5Cu (SAC305) solder samples under shear loading. The basis of the comparison is experimentally derived Anand viscoplastic constitutive models for the alloys. A series of monotonic constant shear stress and constant shear strain rate tests was conducted at temperatures of 20°C, 50°C, 75°C and 100°C for SAC105 in order
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009
ABSTRACT This paper investigates the degradation behaviour of lead-free Sn96.5Ag3.0Cu0.5 solder. ... more ABSTRACT This paper investigates the degradation behaviour of lead-free Sn96.5Ag3.0Cu0.5 solder. A series of isothermal mechanical cycling tests under different conditions has been conducted. The tests were monitored in-situ with a high magnification camera system. Optical observations are presented from selected tests, showing the surface morphology during testing. In addition to the optical investigation, the load drop behaviour of the samples is analysed. The result is a deeper insight into the microscale failure behaviour of SAC305 during isothermal cycling.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013
ABSTRACT In this paper, the creep behavior of lead-free hypo-eutectic Sn96.5Ag3.0Cu0.5 (SAC305) s... more ABSTRACT In this paper, the creep behavior of lead-free hypo-eutectic Sn96.5Ag3.0Cu0.5 (SAC305) solder alloy is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs are conducted on joint-scale solder samples under shear. Stress-strain data is reported for constant stress (15-30 MPa) and constant shear strain rate (1E-6-1E-2 s-1) tests at temperatures of 20°C, 50 °C, 75°C, and 100°C. The quantitative data gained from the tests is used to fit an Anand viscoplastic constitutive model. The quality of the model fit and the intrinsic variability of the test specimens are also assessed.
ASME 2009 InterPACK Conference, Volume 1, 2009
ABSTRACT This paper presents the application of a new semi-empirical model for lifetime predictio... more ABSTRACT This paper presents the application of a new semi-empirical model for lifetime predictions. The model has been acquired by isothermal mechanical cycling testing using joint-scale solder samples on a novel testing apparatus. The calibrated model is here employed with an FEA model to predict the failure of a BGA device under thermal cycling. The modelling results show state-of-the-art agreement with the test data and superiority over Morrow model constants from literature that have been applied to this data set.
2008 10th Electronics Packaging Technology Conference, 2008
or applying a defined displacement. Investigating the In this paper the creep behaviour of lead-f... more or applying a defined displacement. Investigating the In this paper the creep behaviour of lead-free hypo-eutectic responses of the solder surface under defined stresses and Sn96.5Ag3.OCuO.5 solder is evaluated. A series of creep tests strain rates will help understanding its creep and failure at different stress/temperature and strain rate/temperature pairs mechanisms.
Journal of Thermal Science and Engineering Applications, 2009
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Precision thick chip resistors are used in a variety of different industries, from telecommunicat... more Precision thick chip resistors are used in a variety of different industries, from telecommunications to automotive electronics, and as such can be exposed to mild and aggressive corrosive environments. This paper investigates the corrosion performance of two generic precision thick chip resistors in a controlled corrosive atmosphere consisting of 60 C, 4 ppm H 2 S and water vapor in purified air. The resistors were exposed in an environmental chamber for periods of 5, 10, 15, 30, and 60 days. Following exposure, the samples were cross sectioned and subjected to surface analysis using microscopy and microanalysis. After the initial stages of exposure, corrosion was observed on only one of the two types of resistors. The corrosion developed because H 2 S gas and water vapor diffuses through the thin protective organic layer on the resistor, and subsequently reacts with the silver conductor layer. Corrosion was facilitated by poor overlapping of the solder and nickel layer and, in particular the glass binder over the glass overcoat, which allowed silver and sulphur to diffuse along the interface. In addition, this poor overlapping allowed contact between the nickel layer and the silver layer resulting in the development of an electrochemical corrosion cell. The main corrosion products that developed were silver sulfide (Ag 2 S) and nickel sulphur residue.
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 2011
ABSTRACT
International Journal of Multiphase Flow, 2015
This paper investigates the pressure drop induced by both liquid-liquid and liquid-gas segmented ... more This paper investigates the pressure drop induced by both liquid-liquid and liquid-gas segmented Taylor flow regimes. A comprehensive experimental programme was completed using four different liquidliquid and three different liquid-gas combinations over dimensionless slug length, Reynolds and Capillary numbers that spanned several orders of magnitude. Comparisons between the liquid-liquid pressure drop data and the most referenced expressions in the literature highlighted their lack of robustness and demonstrated their inapplicability for use with most practical systems that incorporate liquid-liquid Taylor flow regimes. The experimental pressure drop values obtained for the liquid-gas flows agreed well with existing pressure drop correlations. Interpretation of the liquid-liquid data using liquid-gas models unearthed the existence of a threshold viscosity ratio. Above this threshold, experimental liquid-liquid data was found to agree well with existing liquid-gas models. Below this threshold, results showed that the dispersed slug velocity needed to be considered as the flows were subject to higher interfacial contributions and inertial effects. A modification is proposed to an existing liquid-gas pressure drop correlation. This proposed modification extends the applicability of the correlation to liquid-liquid flows, and furthermore extends the non-dimensional limits of the correlation.
International Journal of Heat and Mass Transfer, 2015
ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, 2013
ABSTRACT A liquid–liquid slug flow regime is generated when two immiscible liquids are pumped int... more ABSTRACT A liquid–liquid slug flow regime is generated when two immiscible liquids are pumped into a channel at varying flow rates. However, the addition of a second immiscible phase is accompanied by an increase in pressure drop relative to the single phase flow case. The focus of this work is to experimentally investigate the pressure drop associated with a liquid–liquid slug flow regime and in particular to examine the effects of slug length, slug numbers and continuous phase on the pressure drop in a hard walled FEP Teflon circular capillary of 1.59mm inner diameter. The flow was analysed over the dimensionless Reynolds and Capillary number ranges of 0.68–97.63 and 0.000045–0.06 respectively by employing four different carrier fluids; Pd5, Dodecane, FC40 and AR20 with water as the dispersed phase. Experiments involved varying the dimensionless water slug length between 1.05–11.01 and the dimensionless oil slug length between 0.71–14.14. Results show a large increase in pressure drop for such flows compared to single phase values. A comparison between the experimental data and correlations in the literature highlights the lack of flow physics in their composition. An alternative approach is presented that can be used for predictive purposes to estimate the interfacial contribution to the total pressure drop in a liquid–liquid slug flow regime.
Volume 10: Heat and Mass Transport Processes, Parts A and B, 2011
Page 1. 1 Copyright © 2011 by ASME Proceedings of the 2011 ASME International Mechanical Engineer... more Page 1. 1 Copyright © 2011 by ASME Proceedings of the 2011 ASME International Mechanical Engineering Congress and Exposition IMECE2 November 11-17, 2011, Denver, Colorado, USA IMECE2011-62692 ON THE THERMAL ...
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012
Microelectronics Reliability
Surface mount chip resistors are amongst the simplest and most inexpensive of all components used... more Surface mount chip resistors are amongst the simplest and most inexpensive of all components used in electronic circuits and systems. Typically, resistor failure modes include open circuits, resistive shorts or variations in resistance indicating parametric drift or intermittent failure, which in some applications result in overall system failure. Corrosion is currently believed to be the number one failure mechanism for chip resistors deployed in developing markets such as Central and Latin America, Asia, India and Pacific regions where aggressive corrosive conditions are prevalent. The objective of this study is to develop a test to identify or screen out corrosion-susceptible parts. Ten precision chip resistors types representative of resistors in contemporary printed circuit board assemblies are subjected to a well-defined multi-stress screen which comprises thermal cycling and mixed flowing gas exposure. The combination of thermal cycling and corrosive gas exposure is shown to ...
Volume 10: Heat and Mass Transport Processes, Parts A and B, 2011
ABSTRACT Photonics Integrated Circuits (PICs), a feature of contemporary optical communications t... more ABSTRACT Photonics Integrated Circuits (PICs), a feature of contemporary optical communications technologies, can represent a stringent packaging challenge, particularly in terms of their requirements for thermal control. Devices such as laser arrays can ...
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004
Claire Ryan', Shane O'Neill', John... more Claire Ryan', Shane O'Neill', John Donovan*, Jeff Punch', Bryan Rodgersl, Eamonn Murphy' ... 1.Stokes Research Institute University of Limerick Limerick, Ireland Phone: (353) 61-234231 Fax: (353) 61-202393 Email: claire.rvan@ul.ie ... 2. Institute of Technology, Sligo, ...
Proceedings of the 15th International Heat Transfer Conference, 2014
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 2004
ABSTRACT There is considerable reported evidence that a large percentage of failures which afflic... more ABSTRACT There is considerable reported evidence that a large percentage of failures which afflict portable electronic products are due to impact or shock during use. Failures of the external housing, internal electronic components, package-to-board interconnects, and liquid ...
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2012
This study compares the creep behavior of joint-scale Sn1.0Ag0.5Cu (SAC105) and Sn3.0Ag0.5Cu (SAC... more This study compares the creep behavior of joint-scale Sn1.0Ag0.5Cu (SAC105) and Sn3.0Ag0.5Cu (SAC305) solder samples under shear loading. The basis of the comparison is experimentally derived Anand viscoplastic constitutive models for the alloys. A series of monotonic constant shear stress and constant shear strain rate tests was conducted at temperatures of 20°C, 50°C, 75°C and 100°C for SAC105 in order
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009
ABSTRACT This paper investigates the degradation behaviour of lead-free Sn96.5Ag3.0Cu0.5 solder. ... more ABSTRACT This paper investigates the degradation behaviour of lead-free Sn96.5Ag3.0Cu0.5 solder. A series of isothermal mechanical cycling tests under different conditions has been conducted. The tests were monitored in-situ with a high magnification camera system. Optical observations are presented from selected tests, showing the surface morphology during testing. In addition to the optical investigation, the load drop behaviour of the samples is analysed. The result is a deeper insight into the microscale failure behaviour of SAC305 during isothermal cycling.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013
ABSTRACT In this paper, the creep behavior of lead-free hypo-eutectic Sn96.5Ag3.0Cu0.5 (SAC305) s... more ABSTRACT In this paper, the creep behavior of lead-free hypo-eutectic Sn96.5Ag3.0Cu0.5 (SAC305) solder alloy is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs are conducted on joint-scale solder samples under shear. Stress-strain data is reported for constant stress (15-30 MPa) and constant shear strain rate (1E-6-1E-2 s-1) tests at temperatures of 20°C, 50 °C, 75°C, and 100°C. The quantitative data gained from the tests is used to fit an Anand viscoplastic constitutive model. The quality of the model fit and the intrinsic variability of the test specimens are also assessed.
ASME 2009 InterPACK Conference, Volume 1, 2009
ABSTRACT This paper presents the application of a new semi-empirical model for lifetime predictio... more ABSTRACT This paper presents the application of a new semi-empirical model for lifetime predictions. The model has been acquired by isothermal mechanical cycling testing using joint-scale solder samples on a novel testing apparatus. The calibrated model is here employed with an FEA model to predict the failure of a BGA device under thermal cycling. The modelling results show state-of-the-art agreement with the test data and superiority over Morrow model constants from literature that have been applied to this data set.
2008 10th Electronics Packaging Technology Conference, 2008
or applying a defined displacement. Investigating the In this paper the creep behaviour of lead-f... more or applying a defined displacement. Investigating the In this paper the creep behaviour of lead-free hypo-eutectic responses of the solder surface under defined stresses and Sn96.5Ag3.OCuO.5 solder is evaluated. A series of creep tests strain rates will help understanding its creep and failure at different stress/temperature and strain rate/temperature pairs mechanisms.
Journal of Thermal Science and Engineering Applications, 2009
RefDoc Bienvenue - Welcome. Refdoc est un service / is powered by. ...
Precision thick chip resistors are used in a variety of different industries, from telecommunicat... more Precision thick chip resistors are used in a variety of different industries, from telecommunications to automotive electronics, and as such can be exposed to mild and aggressive corrosive environments. This paper investigates the corrosion performance of two generic precision thick chip resistors in a controlled corrosive atmosphere consisting of 60 C, 4 ppm H 2 S and water vapor in purified air. The resistors were exposed in an environmental chamber for periods of 5, 10, 15, 30, and 60 days. Following exposure, the samples were cross sectioned and subjected to surface analysis using microscopy and microanalysis. After the initial stages of exposure, corrosion was observed on only one of the two types of resistors. The corrosion developed because H 2 S gas and water vapor diffuses through the thin protective organic layer on the resistor, and subsequently reacts with the silver conductor layer. Corrosion was facilitated by poor overlapping of the solder and nickel layer and, in particular the glass binder over the glass overcoat, which allowed silver and sulphur to diffuse along the interface. In addition, this poor overlapping allowed contact between the nickel layer and the silver layer resulting in the development of an electrochemical corrosion cell. The main corrosion products that developed were silver sulfide (Ag 2 S) and nickel sulphur residue.
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 2011
ABSTRACT
International Journal of Multiphase Flow, 2015
This paper investigates the pressure drop induced by both liquid-liquid and liquid-gas segmented ... more This paper investigates the pressure drop induced by both liquid-liquid and liquid-gas segmented Taylor flow regimes. A comprehensive experimental programme was completed using four different liquidliquid and three different liquid-gas combinations over dimensionless slug length, Reynolds and Capillary numbers that spanned several orders of magnitude. Comparisons between the liquid-liquid pressure drop data and the most referenced expressions in the literature highlighted their lack of robustness and demonstrated their inapplicability for use with most practical systems that incorporate liquid-liquid Taylor flow regimes. The experimental pressure drop values obtained for the liquid-gas flows agreed well with existing pressure drop correlations. Interpretation of the liquid-liquid data using liquid-gas models unearthed the existence of a threshold viscosity ratio. Above this threshold, experimental liquid-liquid data was found to agree well with existing liquid-gas models. Below this threshold, results showed that the dispersed slug velocity needed to be considered as the flows were subject to higher interfacial contributions and inertial effects. A modification is proposed to an existing liquid-gas pressure drop correlation. This proposed modification extends the applicability of the correlation to liquid-liquid flows, and furthermore extends the non-dimensional limits of the correlation.
International Journal of Heat and Mass Transfer, 2015
ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, 2013
ABSTRACT A liquid–liquid slug flow regime is generated when two immiscible liquids are pumped int... more ABSTRACT A liquid–liquid slug flow regime is generated when two immiscible liquids are pumped into a channel at varying flow rates. However, the addition of a second immiscible phase is accompanied by an increase in pressure drop relative to the single phase flow case. The focus of this work is to experimentally investigate the pressure drop associated with a liquid–liquid slug flow regime and in particular to examine the effects of slug length, slug numbers and continuous phase on the pressure drop in a hard walled FEP Teflon circular capillary of 1.59mm inner diameter. The flow was analysed over the dimensionless Reynolds and Capillary number ranges of 0.68–97.63 and 0.000045–0.06 respectively by employing four different carrier fluids; Pd5, Dodecane, FC40 and AR20 with water as the dispersed phase. Experiments involved varying the dimensionless water slug length between 1.05–11.01 and the dimensionless oil slug length between 0.71–14.14. Results show a large increase in pressure drop for such flows compared to single phase values. A comparison between the experimental data and correlations in the literature highlights the lack of flow physics in their composition. An alternative approach is presented that can be used for predictive purposes to estimate the interfacial contribution to the total pressure drop in a liquid–liquid slug flow regime.
Volume 10: Heat and Mass Transport Processes, Parts A and B, 2011
Page 1. 1 Copyright © 2011 by ASME Proceedings of the 2011 ASME International Mechanical Engineer... more Page 1. 1 Copyright © 2011 by ASME Proceedings of the 2011 ASME International Mechanical Engineering Congress and Exposition IMECE2 November 11-17, 2011, Denver, Colorado, USA IMECE2011-62692 ON THE THERMAL ...