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Papers by MOHD SYAKIRIN RUSDI

Research paper thumbnail of Computational Analysis of Polymer Melt Filling in a Medical Mold Cavity During the Injection Molding Process

Pertanika Journal of Science and Technology

This study describes the results of a mold filling simulation analysis of a medical syringe perfo... more This study describes the results of a mold filling simulation analysis of a medical syringe performed during the thermoplastic injection molding process, which was performed using a computational Fluid Dynamic Simulation (CFD) with the Volume of Fluid Method (VOF). ANSYS Fluent was used for analysis and data collection. Medical grade polypropylene (PP) is considered in this study. The studies consider physical parameters (such as inlet position and syringe thickness) of the injection molding process. The outlet vent must be placed as far away from the inlet as possible to root out entrapped air and allow the molten PP to occupy the mold cavity. The findings revealed that syringe thicknesses ranging from 0.75 mm to 1.00 mm resulted in increased flow velocity, shorter filling time, and faster flow front advancement.

Research paper thumbnail of Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging

Advanced Structured Materials, 2022

Research paper thumbnail of Stencil Printing Process using Cross Viscosity Model

1 School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong T... more 1 School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia 2 School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia 3 School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia 4 Celestica Malaysia Sdn. Bhd., Plot 15, Jalan Hi-Tech 2/3 Phase I, Kulim Hi-Tech Park, 09000 Kulim, Malaysia 5 Indium Corporation of America, 29 Kian Teck Avenue, 628908 Singapore

Research paper thumbnail of Effects of Different Viscometer Test on Stencil Printing Process for CFD Simulation

This study discusses the use of different spindle type for the testing of lead-free solder paste ... more This study discusses the use of different spindle type for the testing of lead-free solder paste by using Computational Fluid Dynamics (CFD) simulation. The study focuses on measuring the volume of solder paste deposition on the solder pad. Parallel-plate (PP) and Cone-plate (CP) spindle were used with five different tests consist of different spindle type and setting. The Volume of Fluid (VOF) method was used for the simulation while Cross model was applied as viscosity model for the solder paste. SAC305 type 3 lead-free solder paste was used in this study as it is mostly popular used by the industries nowadays. The solder paste filled the volume under different squeegee speeds and aperture size was compared between experiments and simulations. For different squeegee speed, PP 0.5 mm gap obtained the lowest average discrepancy value between simulation and experimental results. At different aperture size, all test show similar trend line and about the same value of average discrepan...

Research paper thumbnail of Investigation of Nano-Reinforced Lead-Free Solder During Reflow Soldering-A Molecular Dynamic Approach

CFD Letters, 2020

The reinforcement of nanoparticles into the lead-free solder is proved to give good increment in ... more The reinforcement of nanoparticles into the lead-free solder is proved to give good increment in the result of the importance solder properties which includes wetting properties and mechanical properties. This study proposed the new simulation method for the nano-reinforced solder to investigate the complexity and atomic behaviour briefly. The objective of this study is to clearly show the movement of the reinforced nanoparticles in the solder during the reflow soldering process via molecular dynamics (MD) simulation. In this work, Nickel (Ni) nanoparticles will be added into the pure Tin (Sn) lead-free solder. The MD simulation of Ni-reinforced solder at the temperature of 250 OC (reflow phase) was conducted via Large-scale Atomic/Molecular Massively Parallel Simulator (LAMMPS) software. This simulation model able to track the nanoparticles movement in the solder during the reflow soldering process. The experimental procedure of 0.01 wt.% Ni nanoparticle reinforcement in Sn100C was...

Research paper thumbnail of Stencil printing process performance on various aperture size and optimization for lead-free solder paste

The International Journal of Advanced Manufacturing Technology, 2019

The present study examines the effect of squeegee load, squeegee speed, and separation speed on t... more The present study examines the effect of squeegee load, squeegee speed, and separation speed on the printing performance of lead-free solder paste, and solder printing was carried out to evaluate the effect of the filled volume of the solder paste during stencil printing. Application of pressure on the squeegee affects the filled volume of the solder paste in the stencil aperture, and the incorrect pressure setting could cause incomplete filling. Herein, an experiment was conducted on a printing machine employing surface mount technology. The solder paste used in the study was Sn/Ag/Cu (SAC305), and four components, namely, 0603, small outline transistor (SOT), 1210, and tantalum-D, were tested. The filled volume and height of the solder paste under different squeegee loads, squeegee speeds, and separation speeds were determined, and the solder volume was found to vary with the squeegee load and component type. Response surface method (RSM) optimization is conducted to obtain optimum filled volume and solder paste height and area during the printing process. The method showed squeegee load, squeegee speed, and separation speed have considerable effects on filled volume, solder paste height, and solder paste area.

Research paper thumbnail of Multiphase Flow in Solder Paste Stencil Printing Process using CFD approach

1 School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong T... more 1 School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia 2 School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia 3 School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia 4 Faculty of Mechanical Engineering, Universiti Teknologi MARA Pulau Pinang, 13500 Permatang Pauh, Penang, Malaysia 5 Celestica Malaysia Sdn. Bhd., Plot 15, Jalan Hi-Tech 2/3 Phase I, Kulim Hi-Tech Park, 09000 Kulim, Malaysia

Research paper thumbnail of Computational Analysis of Polymer Melt Filling in a Medical Mold Cavity During the Injection Molding Process

Pertanika Journal of Science and Technology

This study describes the results of a mold filling simulation analysis of a medical syringe perfo... more This study describes the results of a mold filling simulation analysis of a medical syringe performed during the thermoplastic injection molding process, which was performed using a computational Fluid Dynamic Simulation (CFD) with the Volume of Fluid Method (VOF). ANSYS Fluent was used for analysis and data collection. Medical grade polypropylene (PP) is considered in this study. The studies consider physical parameters (such as inlet position and syringe thickness) of the injection molding process. The outlet vent must be placed as far away from the inlet as possible to root out entrapped air and allow the molten PP to occupy the mold cavity. The findings revealed that syringe thicknesses ranging from 0.75 mm to 1.00 mm resulted in increased flow velocity, shorter filling time, and faster flow front advancement.

Research paper thumbnail of Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging

Advanced Structured Materials, 2022

Research paper thumbnail of Stencil Printing Process using Cross Viscosity Model

1 School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong T... more 1 School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia 2 School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia 3 School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia 4 Celestica Malaysia Sdn. Bhd., Plot 15, Jalan Hi-Tech 2/3 Phase I, Kulim Hi-Tech Park, 09000 Kulim, Malaysia 5 Indium Corporation of America, 29 Kian Teck Avenue, 628908 Singapore

Research paper thumbnail of Effects of Different Viscometer Test on Stencil Printing Process for CFD Simulation

This study discusses the use of different spindle type for the testing of lead-free solder paste ... more This study discusses the use of different spindle type for the testing of lead-free solder paste by using Computational Fluid Dynamics (CFD) simulation. The study focuses on measuring the volume of solder paste deposition on the solder pad. Parallel-plate (PP) and Cone-plate (CP) spindle were used with five different tests consist of different spindle type and setting. The Volume of Fluid (VOF) method was used for the simulation while Cross model was applied as viscosity model for the solder paste. SAC305 type 3 lead-free solder paste was used in this study as it is mostly popular used by the industries nowadays. The solder paste filled the volume under different squeegee speeds and aperture size was compared between experiments and simulations. For different squeegee speed, PP 0.5 mm gap obtained the lowest average discrepancy value between simulation and experimental results. At different aperture size, all test show similar trend line and about the same value of average discrepan...

Research paper thumbnail of Investigation of Nano-Reinforced Lead-Free Solder During Reflow Soldering-A Molecular Dynamic Approach

CFD Letters, 2020

The reinforcement of nanoparticles into the lead-free solder is proved to give good increment in ... more The reinforcement of nanoparticles into the lead-free solder is proved to give good increment in the result of the importance solder properties which includes wetting properties and mechanical properties. This study proposed the new simulation method for the nano-reinforced solder to investigate the complexity and atomic behaviour briefly. The objective of this study is to clearly show the movement of the reinforced nanoparticles in the solder during the reflow soldering process via molecular dynamics (MD) simulation. In this work, Nickel (Ni) nanoparticles will be added into the pure Tin (Sn) lead-free solder. The MD simulation of Ni-reinforced solder at the temperature of 250 OC (reflow phase) was conducted via Large-scale Atomic/Molecular Massively Parallel Simulator (LAMMPS) software. This simulation model able to track the nanoparticles movement in the solder during the reflow soldering process. The experimental procedure of 0.01 wt.% Ni nanoparticle reinforcement in Sn100C was...

Research paper thumbnail of Stencil printing process performance on various aperture size and optimization for lead-free solder paste

The International Journal of Advanced Manufacturing Technology, 2019

The present study examines the effect of squeegee load, squeegee speed, and separation speed on t... more The present study examines the effect of squeegee load, squeegee speed, and separation speed on the printing performance of lead-free solder paste, and solder printing was carried out to evaluate the effect of the filled volume of the solder paste during stencil printing. Application of pressure on the squeegee affects the filled volume of the solder paste in the stencil aperture, and the incorrect pressure setting could cause incomplete filling. Herein, an experiment was conducted on a printing machine employing surface mount technology. The solder paste used in the study was Sn/Ag/Cu (SAC305), and four components, namely, 0603, small outline transistor (SOT), 1210, and tantalum-D, were tested. The filled volume and height of the solder paste under different squeegee loads, squeegee speeds, and separation speeds were determined, and the solder volume was found to vary with the squeegee load and component type. Response surface method (RSM) optimization is conducted to obtain optimum filled volume and solder paste height and area during the printing process. The method showed squeegee load, squeegee speed, and separation speed have considerable effects on filled volume, solder paste height, and solder paste area.

Research paper thumbnail of Multiphase Flow in Solder Paste Stencil Printing Process using CFD approach

1 School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong T... more 1 School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia 2 School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia 3 School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia 4 Faculty of Mechanical Engineering, Universiti Teknologi MARA Pulau Pinang, 13500 Permatang Pauh, Penang, Malaysia 5 Celestica Malaysia Sdn. Bhd., Plot 15, Jalan Hi-Tech 2/3 Phase I, Kulim Hi-Tech Park, 09000 Kulim, Malaysia