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Papers by Michael Azarian

Research paper thumbnail of Identifying Key Factors in Turbofan Engine Health Degradation using Functional Analysis

Annual Conference of the PHM Society

A method is presented for predicting the health of turbofan engines using data and simulations fr... more A method is presented for predicting the health of turbofan engines using data and simulations from NASA. The method involves estimating engine health using k-nearest neighbors’ regression and fitting a remaining useful life model that considers engine usage. A matching pursuit algorithm identifies key parameters, while functional principal components provide insight into degradation precursors. Model performance is evaluated using root mean square error and future research and applications are discussed.

Research paper thumbnail of Assessment of organizational reliability capability

IEEE Transactions on Components and Packaging Technologies, Jun 1, 2006

Abstract A reliability capability assessment process can assist OEMs and system integrators in as... more Abstract A reliability capability assessment process can assist OEMs and system integrators in assessing prospective suppliers for their ability to design and manufacture reliable products before they are delivered for use, and on an ongoing basis, help a company in ...

Research paper thumbnail of Influence of Molding Compound on Leakage Current in MOS Transistors

IEEE Transactions on Components, Packaging and Manufacturing Technology, Jul 1, 2011

Research paper thumbnail of A Critique of the IPC-9591 Standard: Performance Parameters for Air Moving Devices

IEEE Transactions on Device and Materials Reliability, Mar 1, 2013

ABSTRACT This paper presents a critique of the IPC standard (IPC-9591) on air-moving devices for ... more ABSTRACT This paper presents a critique of the IPC standard (IPC-9591) on air-moving devices for the electronics industry, published in 2006. We investigate the applicability of the methods specified by IPC-9591. A fatigue life and a grease life of ball bearings in the fans were calculated using the stress-life method and grease life equation, respectively. The calculated life was compared to the experimental results of the fans. In addition, the mean time to failure of fan electronics was calculated using multiple methods specified by IPC-9591 and validated with experimental results of the fans. Through these exercises, the reliability prediction methods for air-moving devices were shown to be flawed. We make recommendations for IPC and the industry on appropriate methods of reliability assessment for air-moving devices.

Research paper thumbnail of Using a reliability capability maturity model to benchmark electronics companies

International Journal of Quality & Reliability Management, May 29, 2007

PurposeThis paper seeks to introduce a set of key practices that can be used to assess whether an... more PurposeThis paper seeks to introduce a set of key practices that can be used to assess whether an organization has the ability to design, develop and manufacture reliable electronic products.Design/methodology/approachThe ability to design, develop and manufacture reliable electronic products is defined in the paper in terms of a reliability capability maturity model, which is a measure of the practices within an organization that contribute to the reliability of the final product, and the effectiveness of these practices in meeting the reliability requirements of customers.FindingsThe paper presents a procedure for evaluating and benchmarking reliability capability. Criteria for assigning different capability maturity levels are presented. The paper also presents a case study corresponding to reliability capability benchmarking of an electronics company.Originality/valueThe paper provides a set of practices for evaluating and benchmarking reliability capability.

Research paper thumbnail of Improved electromagnetic coil insulation health monitoring using equivalent circuit model analysis

International Journal of Electrical Power & Energy Systems, Jul 1, 2020

Research paper thumbnail of Failure site isolation on passive RFID tags

Abstract Passive RFID tag typically consists of an inert carrier substrate, an antenna and a semi... more Abstract Passive RFID tag typically consists of an inert carrier substrate, an antenna and a semiconductor chip. Qualification process of the passive RFID tags includes temperature cycling in high humidity conditions and damp heat storage tests. In order to pass ...

Research paper thumbnail of Supplier Selection

Research paper thumbnail of Electromagnetic coil equivalent circuit model sensitivity analysis for impedance-based insulation health monitoring

Research paper thumbnail of Identification of interconnect failure mechanisms using RF impedance analysis

Research paper thumbnail of One-fault-shot learning for fault severity estimation of gears that addresses differences between simulation and experimental signals and transfer function effects

Advanced Engineering Informatics

Research paper thumbnail of Degradation Modes and Mechanisms Analysis of Lithium-Ion Batteries with Knee Points

Research paper thumbnail of Anomaly Detection Using Self-Organizing Maps-Based K-Nearest Neighbor Algorithm

PHM Society European Conference, 2014

Research paper thumbnail of Electronic Circuit Diagnosis with No Data

2019 IEEE International Conference on Prognostics and Health Management (ICPHM), 2019

Operational data from the target system is widely considered a pre-requisite for implementation o... more Operational data from the target system is widely considered a pre-requisite for implementation of PHM, as it used as training data. Often this data is not available to PHM practitioners because health monitoring capabilities may not be installed in legacy systems. This research presents an approach in which fault diagnosis can be implemented without any operational data and is generic enough to be applied to any electronic circuit provided a simulation model of the system with acceptable fidelity can be developed. The research also employs the Space-Filling Design, which can be used to generate the training data in a systematic, statistically valid framework, and is especially valuable for complex circuit with a large number of components. This design provides sufficient coverage of the parametric design space to be representative of the unavailable operational data, as well as incorporating the effects of parameter interaction on the simulated response of the system. Most PHM studies in the literature ignore the effect of the degradation of interacting components. We show, how such an assumption can lead to incorrect fault diagnosis/RUL estimation and propose methods to screen for two-way and higher order interactions. Finally, we use various deep learning approaches to diagnose circuit faults. This simulation-based fusion approach is a holistic framework for all types of analog electronic circuits.

Research paper thumbnail of The Use of "Canaries" for Adaptive Health Management of Electronic Systems

Reliability concerns in state-of-the-art electronic systems have led researchers and engineers to... more Reliability concerns in state-of-the-art electronic systems have led researchers and engineers to develop innovative real-time prognostics and adaptive health management methods to assure desired availability. Prognostics techniques described here use a novel concept of canaries, along with data analysis, failure mechanism models and integrated fusion techniques to determine the remaining useful life of a system. A canary is a device that provides data to generate early warning of functional degradation and impending functional failure. Three types of canaries are discussed. Expendable canaries experience accelerated degradation (compared to functional degradation) by design, so that early warning of impending failure can be generated. Sensory canaries provide early warning by observing nonfunctional manifestation of functional degradation. Conjugate-stress canaries provide measurement of life-cycle stress history so that failure models can be used to estimate consumed life and rema...

Research paper thumbnail of Degradation Mechanisms in Electric Double Layer Capacitors Subjected to Voltage and Temperature Stress Testing

Research paper thumbnail of Degradation Analysis of Thick Film Chip Resistors

Abstract Negative resistance drift in thick film chip resistors in high temperature and high humi... more Abstract Negative resistance drift in thick film chip resistors in high temperature and high humidity application conditions was investigated. This paper reports on the investigation of possible causes including formation of current leakage paths on the printed circuit board, ...

Research paper thumbnail of Impedance-Based Condition Monitoring for Insulation Systems Used in Low-Voltage Electromagnetic Coils

IEEE Transactions on Industrial Electronics, 2017

Research paper thumbnail of Correlation analysis for impedance-based health monitoring of electromagnetic coils

2016 IEEE International Conference on Prognostics and Health Management (ICPHM), 2016

Electromagnetic coils are widely used components in a variety of industries and systems, includin... more Electromagnetic coils are widely used components in a variety of industries and systems, including electric motors and solenoids. The failure of electromagnetic coil insulation can lead to catastrophic failure of the coil and subsequently, the component and system in which the coil is used. In this paper, a method of locating frequencies in the impedance spectrum that are not only useful for health monitoring, but reveal the changing electrical behavior of coil due to degraded wire insulation is demonstrated. The Spearman rank correlation coefficient can be used to measure linear or non-linear monotonic relationships between two variables. Hence, the measure is more general than the Pearson correlation coefficient, which measures only the linear correlation between two variables. First, experiments were performed where electromagnetic coils were subjected to degrading environments while measuring the impedance spectra of the coils. These complex impedance spectrum measurements are split into real and imaginary parts, resistance and reactance, respectively. The values of resistance and reactance at each frequency constitute a set of features, each of which is a potential health indicator. Second, the impedance time series at each frequency is correlated with degradation time using Spearman correlation. Next, the Spearman correlation coefficient is plotted against frequency to construct an impedance frequency-correlation diagram, providing an understanding of the extent to which each frequency can be used to monitor the health of the coil, and whether the impedance at each frequency increases or decreases over the aging period. The results indicate that the Spearman correlation coefficient is a tool that can be utilized to identify the frequencies at which to monitor the coil for health monitoring purposes. Furthermore, comparisons between environmental aging tests show the impedance frequency-correlation diagrams can be applied in understanding the mechanisms of degradation.

Research paper thumbnail of Effects of Voiding on the Degradation of Microvias in High Density Interconnect Printed Circuit Boards Under Thermomechanical Stresses

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014

ABSTRACT Printed circuit boards (PCBs) are made of several dielectric layers stacked on top of ea... more ABSTRACT Printed circuit boards (PCBs) are made of several dielectric layers stacked on top of each other. These layers could be standard PCB core board or high density interconnect (HDI) layers. Microvias allow signal and power transmission between the HDI layers of the PCBs. The presence of voiding in filled microvias has raised concerns in industry about how they affect the degradation of microvias during the life cycle of the product. Voids can vary widely in shape and size and have been observed in both stacked and single-level microvias. This paper examines whether the presence of voids alone is responsible for the degradation of microvias, or if parameters such as void size and void shape have an influence as well. Both voided and nonvoided microvias were tested together using liquid-to-liquid thermal shock as the accelerated testing method to understand their different behaviors under thermomechanical stresses.

Research paper thumbnail of Identifying Key Factors in Turbofan Engine Health Degradation using Functional Analysis

Annual Conference of the PHM Society

A method is presented for predicting the health of turbofan engines using data and simulations fr... more A method is presented for predicting the health of turbofan engines using data and simulations from NASA. The method involves estimating engine health using k-nearest neighbors’ regression and fitting a remaining useful life model that considers engine usage. A matching pursuit algorithm identifies key parameters, while functional principal components provide insight into degradation precursors. Model performance is evaluated using root mean square error and future research and applications are discussed.

Research paper thumbnail of Assessment of organizational reliability capability

IEEE Transactions on Components and Packaging Technologies, Jun 1, 2006

Abstract A reliability capability assessment process can assist OEMs and system integrators in as... more Abstract A reliability capability assessment process can assist OEMs and system integrators in assessing prospective suppliers for their ability to design and manufacture reliable products before they are delivered for use, and on an ongoing basis, help a company in ...

Research paper thumbnail of Influence of Molding Compound on Leakage Current in MOS Transistors

IEEE Transactions on Components, Packaging and Manufacturing Technology, Jul 1, 2011

Research paper thumbnail of A Critique of the IPC-9591 Standard: Performance Parameters for Air Moving Devices

IEEE Transactions on Device and Materials Reliability, Mar 1, 2013

ABSTRACT This paper presents a critique of the IPC standard (IPC-9591) on air-moving devices for ... more ABSTRACT This paper presents a critique of the IPC standard (IPC-9591) on air-moving devices for the electronics industry, published in 2006. We investigate the applicability of the methods specified by IPC-9591. A fatigue life and a grease life of ball bearings in the fans were calculated using the stress-life method and grease life equation, respectively. The calculated life was compared to the experimental results of the fans. In addition, the mean time to failure of fan electronics was calculated using multiple methods specified by IPC-9591 and validated with experimental results of the fans. Through these exercises, the reliability prediction methods for air-moving devices were shown to be flawed. We make recommendations for IPC and the industry on appropriate methods of reliability assessment for air-moving devices.

Research paper thumbnail of Using a reliability capability maturity model to benchmark electronics companies

International Journal of Quality & Reliability Management, May 29, 2007

PurposeThis paper seeks to introduce a set of key practices that can be used to assess whether an... more PurposeThis paper seeks to introduce a set of key practices that can be used to assess whether an organization has the ability to design, develop and manufacture reliable electronic products.Design/methodology/approachThe ability to design, develop and manufacture reliable electronic products is defined in the paper in terms of a reliability capability maturity model, which is a measure of the practices within an organization that contribute to the reliability of the final product, and the effectiveness of these practices in meeting the reliability requirements of customers.FindingsThe paper presents a procedure for evaluating and benchmarking reliability capability. Criteria for assigning different capability maturity levels are presented. The paper also presents a case study corresponding to reliability capability benchmarking of an electronics company.Originality/valueThe paper provides a set of practices for evaluating and benchmarking reliability capability.

Research paper thumbnail of Improved electromagnetic coil insulation health monitoring using equivalent circuit model analysis

International Journal of Electrical Power & Energy Systems, Jul 1, 2020

Research paper thumbnail of Failure site isolation on passive RFID tags

Abstract Passive RFID tag typically consists of an inert carrier substrate, an antenna and a semi... more Abstract Passive RFID tag typically consists of an inert carrier substrate, an antenna and a semiconductor chip. Qualification process of the passive RFID tags includes temperature cycling in high humidity conditions and damp heat storage tests. In order to pass ...

Research paper thumbnail of Supplier Selection

Research paper thumbnail of Electromagnetic coil equivalent circuit model sensitivity analysis for impedance-based insulation health monitoring

Research paper thumbnail of Identification of interconnect failure mechanisms using RF impedance analysis

Research paper thumbnail of One-fault-shot learning for fault severity estimation of gears that addresses differences between simulation and experimental signals and transfer function effects

Advanced Engineering Informatics

Research paper thumbnail of Degradation Modes and Mechanisms Analysis of Lithium-Ion Batteries with Knee Points

Research paper thumbnail of Anomaly Detection Using Self-Organizing Maps-Based K-Nearest Neighbor Algorithm

PHM Society European Conference, 2014

Research paper thumbnail of Electronic Circuit Diagnosis with No Data

2019 IEEE International Conference on Prognostics and Health Management (ICPHM), 2019

Operational data from the target system is widely considered a pre-requisite for implementation o... more Operational data from the target system is widely considered a pre-requisite for implementation of PHM, as it used as training data. Often this data is not available to PHM practitioners because health monitoring capabilities may not be installed in legacy systems. This research presents an approach in which fault diagnosis can be implemented without any operational data and is generic enough to be applied to any electronic circuit provided a simulation model of the system with acceptable fidelity can be developed. The research also employs the Space-Filling Design, which can be used to generate the training data in a systematic, statistically valid framework, and is especially valuable for complex circuit with a large number of components. This design provides sufficient coverage of the parametric design space to be representative of the unavailable operational data, as well as incorporating the effects of parameter interaction on the simulated response of the system. Most PHM studies in the literature ignore the effect of the degradation of interacting components. We show, how such an assumption can lead to incorrect fault diagnosis/RUL estimation and propose methods to screen for two-way and higher order interactions. Finally, we use various deep learning approaches to diagnose circuit faults. This simulation-based fusion approach is a holistic framework for all types of analog electronic circuits.

Research paper thumbnail of The Use of "Canaries" for Adaptive Health Management of Electronic Systems

Reliability concerns in state-of-the-art electronic systems have led researchers and engineers to... more Reliability concerns in state-of-the-art electronic systems have led researchers and engineers to develop innovative real-time prognostics and adaptive health management methods to assure desired availability. Prognostics techniques described here use a novel concept of canaries, along with data analysis, failure mechanism models and integrated fusion techniques to determine the remaining useful life of a system. A canary is a device that provides data to generate early warning of functional degradation and impending functional failure. Three types of canaries are discussed. Expendable canaries experience accelerated degradation (compared to functional degradation) by design, so that early warning of impending failure can be generated. Sensory canaries provide early warning by observing nonfunctional manifestation of functional degradation. Conjugate-stress canaries provide measurement of life-cycle stress history so that failure models can be used to estimate consumed life and rema...

Research paper thumbnail of Degradation Mechanisms in Electric Double Layer Capacitors Subjected to Voltage and Temperature Stress Testing

Research paper thumbnail of Degradation Analysis of Thick Film Chip Resistors

Abstract Negative resistance drift in thick film chip resistors in high temperature and high humi... more Abstract Negative resistance drift in thick film chip resistors in high temperature and high humidity application conditions was investigated. This paper reports on the investigation of possible causes including formation of current leakage paths on the printed circuit board, ...

Research paper thumbnail of Impedance-Based Condition Monitoring for Insulation Systems Used in Low-Voltage Electromagnetic Coils

IEEE Transactions on Industrial Electronics, 2017

Research paper thumbnail of Correlation analysis for impedance-based health monitoring of electromagnetic coils

2016 IEEE International Conference on Prognostics and Health Management (ICPHM), 2016

Electromagnetic coils are widely used components in a variety of industries and systems, includin... more Electromagnetic coils are widely used components in a variety of industries and systems, including electric motors and solenoids. The failure of electromagnetic coil insulation can lead to catastrophic failure of the coil and subsequently, the component and system in which the coil is used. In this paper, a method of locating frequencies in the impedance spectrum that are not only useful for health monitoring, but reveal the changing electrical behavior of coil due to degraded wire insulation is demonstrated. The Spearman rank correlation coefficient can be used to measure linear or non-linear monotonic relationships between two variables. Hence, the measure is more general than the Pearson correlation coefficient, which measures only the linear correlation between two variables. First, experiments were performed where electromagnetic coils were subjected to degrading environments while measuring the impedance spectra of the coils. These complex impedance spectrum measurements are split into real and imaginary parts, resistance and reactance, respectively. The values of resistance and reactance at each frequency constitute a set of features, each of which is a potential health indicator. Second, the impedance time series at each frequency is correlated with degradation time using Spearman correlation. Next, the Spearman correlation coefficient is plotted against frequency to construct an impedance frequency-correlation diagram, providing an understanding of the extent to which each frequency can be used to monitor the health of the coil, and whether the impedance at each frequency increases or decreases over the aging period. The results indicate that the Spearman correlation coefficient is a tool that can be utilized to identify the frequencies at which to monitor the coil for health monitoring purposes. Furthermore, comparisons between environmental aging tests show the impedance frequency-correlation diagrams can be applied in understanding the mechanisms of degradation.

Research paper thumbnail of Effects of Voiding on the Degradation of Microvias in High Density Interconnect Printed Circuit Boards Under Thermomechanical Stresses

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014

ABSTRACT Printed circuit boards (PCBs) are made of several dielectric layers stacked on top of ea... more ABSTRACT Printed circuit boards (PCBs) are made of several dielectric layers stacked on top of each other. These layers could be standard PCB core board or high density interconnect (HDI) layers. Microvias allow signal and power transmission between the HDI layers of the PCBs. The presence of voiding in filled microvias has raised concerns in industry about how they affect the degradation of microvias during the life cycle of the product. Voids can vary widely in shape and size and have been observed in both stacked and single-level microvias. This paper examines whether the presence of voids alone is responsible for the degradation of microvias, or if parameters such as void size and void shape have an influence as well. Both voided and nonvoided microvias were tested together using liquid-to-liquid thermal shock as the accelerated testing method to understand their different behaviors under thermomechanical stresses.