Mustafa Kamal - Academia.edu (original) (raw)

Papers by Mustafa Kamal

Research paper thumbnail of Characterization of Indium addition on Sn-Bi-Sb Lead free Solder alloy

JOURNAL OF ADVANCES IN PHYSICS

The aim of these work is to measure the effect of the addition of In with different atomic percen... more The aim of these work is to measure the effect of the addition of In with different atomic percent weight on structure, melting, Electrical and mechanical properties of Sn70-X at.% -Bi15 at.% -Sb15 at.%- Inx at.%  rapidly solidified. X-ray diffraction analysis (XRD), differential scanning calorimetry (DSC), temperature dependence of resistivity (TDR), and mechanical resonance method are performed. It's found that electrical conductivity (σ) and thermal conductivity (K) increased gradually by increasing In at.%. Melting temperature reduced from 470.12 K for Sn70 at.%- Bi15 at.%- Sb15 at.% to 427.13 K in Sn61 at.%- Bi15 at.%- Sb15 at.%- In9 at.%. Also, elastic moduli, internal friction and thermal diffusivity measured from melt-quenched ribbons.Â

Research paper thumbnail of Optimum Step Stress Accelerated Life Testing For Rayleigh Distribution

International Journal of Statistics and Applications, 2012

Accelerated testing is needed when testing even large sample sizes at use stress would yield few ... more Accelerated testing is needed when testing even large sample sizes at use stress would yield few or no failures within a reasonable time. The step-stress accelerated life test is used to increase the stress levels at fixed times during the experiment. Th is paper deals with the problem of designing an optimu m step stress accelerated life test for Rayleigh distribution. The scale parameter of the distribution is assumed to be a log linear function of stress. The maximu m likelihood estimates of the parameters under consideration are obtained. Interval estimation that generates narrow intervals to the unknown parameters of the distribution with high probability is obtained. Optimizat ion criterion is also discussed and simu lation results are obtained to explain the techniques used in the paper.

Research paper thumbnail of Irradiation, mechanical and structural behaviour of Al-Zn-based alloys rapidly quenched from melt

Radiation Effects and Defects in Solids, 1996

ABSTRACT This paper provides a comprehensive review of the physical metallurgy and mechanical pro... more ABSTRACT This paper provides a comprehensive review of the physical metallurgy and mechanical properties of the melt-spun ordered alloys based on Al-Zn system containing 0 or 0.5% of antimony, tin or silicon. Properties, including the crystal structure, defects, elastic modulus, internal friction and irradiation resistance of the fast quenched ordered alloys are summarized and discussed with emphasis on their metallurgical variables in the alloys. The potential development of Al-Zn based melt-spun alloys as new antifractional materials for bearing applications is also discussed.

Research paper thumbnail of Effect of rapid solidification on mechanical properties of a lead free Sn–3.5Ag solder

Journal of Alloys and Compounds, 2010

The melt-spinning processes of Sn-3.5Ag, Sn-3.5Ag-2In, Sn-3.5Ag-2Bi and Sn-3.5Ag-2Zn lead free so... more The melt-spinning processes of Sn-3.5Ag, Sn-3.5Ag-2In, Sn-3.5Ag-2Bi and Sn-3.5Ag-2Zn lead free solders were investigated and analyzed. The results showed that formation of intermetallic compounds of-Ag 3 Sn, In 0.2 Sn 0.8 and AgZn embedded in Sn matrix phase, were produced during melt-spinning technique not found under equilibrium conditions. Addition of small amount (2 wt.%) In, Bi, or Zn refines the grain size, increases H v , delay the fracture strength and improves creep resistance. The ternary alloys exhibits mechanical properties superior to that of the binary alloy Sn-3.5Ag because it has a uniform fine dispersion of precipitates and small effective grain size. It is found that in the lead free solder has composition of Sn-3.5Ag-2In, Sn-3.5Ag-2Bi and Sn-3.5Ag-2Zn melt-spun alloys, have eutectic composition which could be attributed to the shift of eutectic point under rapid solidification. The addition of indium, bismuth and zinc to the SnAg binary system lowers the melting temperature.

Research paper thumbnail of A study of Bi–Pb–Sn–Cd–Sb penta-alloys rapidly quenched from melt

Radiation Effects and Defects in Solids, 2004

Optical microscopy, X-ray diffractometry, the double bridge method, the Vickers microhardness tes... more Optical microscopy, X-ray diffractometry, the double bridge method, the Vickers microhardness testing and dynamic resonance techniques have been used to investigate structure, electrical resistivity, hardness, internal friction and elastic modulus of quenched ...

Research paper thumbnail of Correlation between microstructure, mechanical properties, and brazing temperature of steel to titanium joint

Journal of Alloys and Compounds, 2009

A series of indium-bismuth-tin-silver alloys containing up to 5 wt. % silver were quenched from m... more A series of indium-bismuth-tin-silver alloys containing up to 5 wt. % silver were quenched from melt by chill-block melt-spin technique. The resultant ribbons were studied by X-ray diffraction (XRD), scanning electron microscope (SEM), energy dispersive X-ray (EDX), and deferential scanning calorimetry (DSC) techniques. Structural, mechanical and thermal correlations were discussed and reviewed for In-Bi-SnAg Field"s metal alloy systems. The results are interpreted in terms of the phase changes occurring in the alloy system. It is found that melting point, solidus and liquidus temperatures of the solder alloys are lowered as the Ag content is increased. With the addition of Ag, the In rich phase is finer in size, and the intermetallic compounds are more uniformly distributed. As a result, Young"s modulus and microhardness of In-Bi-Sn are increased when Ag is added into the solder alloy. It is also, concluded that from our results, the present work relates to a melting temperature adjustable metal thermal interface material (TIM) applicable to an interface between a microelectronic packaging component and a heat dissipation device, so as to facilitate the heat dissipation of the microelectronic component.

Research paper thumbnail of Characterization of Indium addition on Sn-Bi-Sb Lead free Solder alloy

JOURNAL OF ADVANCES IN PHYSICS

The aim of these work is to measure the effect of the addition of In with different atomic percen... more The aim of these work is to measure the effect of the addition of In with different atomic percent weight on structure, melting, Electrical and mechanical properties of Sn70-X at.% -Bi15 at.% -Sb15 at.%- Inx at.%  rapidly solidified. X-ray diffraction analysis (XRD), differential scanning calorimetry (DSC), temperature dependence of resistivity (TDR), and mechanical resonance method are performed. It's found that electrical conductivity (σ) and thermal conductivity (K) increased gradually by increasing In at.%. Melting temperature reduced from 470.12 K for Sn70 at.%- Bi15 at.%- Sb15 at.% to 427.13 K in Sn61 at.%- Bi15 at.%- Sb15 at.%- In9 at.%. Also, elastic moduli, internal friction and thermal diffusivity measured from melt-quenched ribbons.Â

Research paper thumbnail of Optimum Step Stress Accelerated Life Testing For Rayleigh Distribution

International Journal of Statistics and Applications, 2012

Accelerated testing is needed when testing even large sample sizes at use stress would yield few ... more Accelerated testing is needed when testing even large sample sizes at use stress would yield few or no failures within a reasonable time. The step-stress accelerated life test is used to increase the stress levels at fixed times during the experiment. Th is paper deals with the problem of designing an optimu m step stress accelerated life test for Rayleigh distribution. The scale parameter of the distribution is assumed to be a log linear function of stress. The maximu m likelihood estimates of the parameters under consideration are obtained. Interval estimation that generates narrow intervals to the unknown parameters of the distribution with high probability is obtained. Optimizat ion criterion is also discussed and simu lation results are obtained to explain the techniques used in the paper.

Research paper thumbnail of Irradiation, mechanical and structural behaviour of Al-Zn-based alloys rapidly quenched from melt

Radiation Effects and Defects in Solids, 1996

ABSTRACT This paper provides a comprehensive review of the physical metallurgy and mechanical pro... more ABSTRACT This paper provides a comprehensive review of the physical metallurgy and mechanical properties of the melt-spun ordered alloys based on Al-Zn system containing 0 or 0.5% of antimony, tin or silicon. Properties, including the crystal structure, defects, elastic modulus, internal friction and irradiation resistance of the fast quenched ordered alloys are summarized and discussed with emphasis on their metallurgical variables in the alloys. The potential development of Al-Zn based melt-spun alloys as new antifractional materials for bearing applications is also discussed.

Research paper thumbnail of Effect of rapid solidification on mechanical properties of a lead free Sn–3.5Ag solder

Journal of Alloys and Compounds, 2010

The melt-spinning processes of Sn-3.5Ag, Sn-3.5Ag-2In, Sn-3.5Ag-2Bi and Sn-3.5Ag-2Zn lead free so... more The melt-spinning processes of Sn-3.5Ag, Sn-3.5Ag-2In, Sn-3.5Ag-2Bi and Sn-3.5Ag-2Zn lead free solders were investigated and analyzed. The results showed that formation of intermetallic compounds of-Ag 3 Sn, In 0.2 Sn 0.8 and AgZn embedded in Sn matrix phase, were produced during melt-spinning technique not found under equilibrium conditions. Addition of small amount (2 wt.%) In, Bi, or Zn refines the grain size, increases H v , delay the fracture strength and improves creep resistance. The ternary alloys exhibits mechanical properties superior to that of the binary alloy Sn-3.5Ag because it has a uniform fine dispersion of precipitates and small effective grain size. It is found that in the lead free solder has composition of Sn-3.5Ag-2In, Sn-3.5Ag-2Bi and Sn-3.5Ag-2Zn melt-spun alloys, have eutectic composition which could be attributed to the shift of eutectic point under rapid solidification. The addition of indium, bismuth and zinc to the SnAg binary system lowers the melting temperature.

Research paper thumbnail of A study of Bi–Pb–Sn–Cd–Sb penta-alloys rapidly quenched from melt

Radiation Effects and Defects in Solids, 2004

Optical microscopy, X-ray diffractometry, the double bridge method, the Vickers microhardness tes... more Optical microscopy, X-ray diffractometry, the double bridge method, the Vickers microhardness testing and dynamic resonance techniques have been used to investigate structure, electrical resistivity, hardness, internal friction and elastic modulus of quenched ...

Research paper thumbnail of Correlation between microstructure, mechanical properties, and brazing temperature of steel to titanium joint

Journal of Alloys and Compounds, 2009

A series of indium-bismuth-tin-silver alloys containing up to 5 wt. % silver were quenched from m... more A series of indium-bismuth-tin-silver alloys containing up to 5 wt. % silver were quenched from melt by chill-block melt-spin technique. The resultant ribbons were studied by X-ray diffraction (XRD), scanning electron microscope (SEM), energy dispersive X-ray (EDX), and deferential scanning calorimetry (DSC) techniques. Structural, mechanical and thermal correlations were discussed and reviewed for In-Bi-SnAg Field"s metal alloy systems. The results are interpreted in terms of the phase changes occurring in the alloy system. It is found that melting point, solidus and liquidus temperatures of the solder alloys are lowered as the Ag content is increased. With the addition of Ag, the In rich phase is finer in size, and the intermetallic compounds are more uniformly distributed. As a result, Young"s modulus and microhardness of In-Bi-Sn are increased when Ag is added into the solder alloy. It is also, concluded that from our results, the present work relates to a melting temperature adjustable metal thermal interface material (TIM) applicable to an interface between a microelectronic packaging component and a heat dissipation device, so as to facilitate the heat dissipation of the microelectronic component.