Pedro Vitoriano - Academia.edu (original) (raw)

Papers by Pedro Vitoriano

Research paper thumbnail of Improved Pattern Matching Applied to Surface Mounting Devices Components Localization on Automated Optical Inspection

Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manu... more Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manufacturing. The use of this technology has been proven as highly efficient for process improvements and quality achievements. The correct extraction of the component for posterior analysis is a critical step of the AOI process. Nowadays, the Pattern Matching Algorithm is commonly used, although this algorithm requires extensive calculations and is time consuming. This paper will present an improved algorithm for the component localization process, with the capability of implementation in a parallel execution system.

Research paper thumbnail of Simulation on Mathcad the SPICE Model of the Diode Dmbr2045mfs

Diode SPICE model simulations on Mathcad.

Research paper thumbnail of MC‐ICP‐MSによる天然水中のユウロピウム同位体比の決定【Powered by NICT】

Journal of Analytical Atomic Spectrometry, 2017

Research paper thumbnail of Automatic Optical Inspection for Surface Mounting Devices with IPC-A-610D compliance

International Conference on Power Engineering, Energy and Electrical Drives, 2011

Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manu... more Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manufacturing process. The use of this technology has been proved to be highly efficient on process improvements and quality achievements. The most difficult point on Surface Mounting Devices (SMD) inspection is the solder joint due to their specular reflections. Several studies have been made to improve this

Research paper thumbnail of NI Vision NI Vision Builder for Automated Inspection Tutorial NI Vision Builder for Automated Inspection Tutorial

Research paper thumbnail of 对 SMD 焊点的 2D 图像进行 3D 重构对 SMD 焊点的 2D 图像进行 3D 重构

自动光学检测（AOI）系统广 泛应用于印制电路板的生产领域，该 技术已被证明在改进组装工艺和质 量方面十分有效。对于表面贴装器 件（SMD）的检测来说，其最大的挑 战是来自与对元件焊接点的检测... more 自动光学检测（AOI）系统广
泛应用于印制电路板的生产领域，该
技术已被证明在改进组装工艺和质
量方面十分有效。对于表面贴装器
件（SMD）的检测来说，其最大的挑
战是来自与对元件焊接点的检测，因
为焊点会引光的镜面反射。针对这一
问题的解决方案已经进行了诸多的
研究。本篇文章将介绍一种 3D 焊点
的重构算法（3D-SJR）。本文中对焊
点的分类标准是采用了 IPC-A-610D
（《电子组装合适性》标准）。

Research paper thumbnail of Improved Pattern Matching Applied to Surface Mounting Devices Components Localization on Automated Optical Inspection

Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manu... more Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manufacturing. The use of this technology has been proven as highly efficient for process improvements and quality achievements. The correct extraction of the component for posterior analysis is a critical step of the AOI process. Nowadays, the Pattern Matching Algorithm is commonly used, although this algorithm requires extensive calculations and is time-consuming​. This paper will present an improved algorithm for the component localization process, with the capability of implementation in a parallel execution system.

Research paper thumbnail of 3D Solder Joint Reconstruction on SMD based on 2D Images

Automated optical inspection (AOI) systems are commonly used in PCB manufacturing. The use of thi... more Automated optical inspection (AOI) systems are commonly used in PCB manufacturing. The use of this technology has been proven as highly efficient for process improvements and quality achievements. The most challenging point in inspection of surface mounting devices (SMD) is the component solder joints, due to their specular reflects. Several studies have been made to improve this situation. This paper presents an algorithm for 3D solder joint reconstruction (3D-SJR). The criteria used in the classification of the solder joints was the IPC-A-610D (Acceptability of Electronics Assemblies).

Research paper thumbnail of Automatic Optical Inspection for Surface Mounting Devices with IPC-A-610D compliance

Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manu... more Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manufacturing process. The use of this technology has been proved to be highly efficient on process improvements and quality achievements.
The most difficult point on Surface Mounting Devices (SMD) inspection is the solder joint due to their specular reflections. Several studies have been made to improve this situation. In this paper, it is presented a solder joint classification system based on IPC-A-610D (Acceptability of Electronics Assemblies).

Teaching Documents by Pedro Vitoriano

Research paper thumbnail of Simulation on Mathcad the SPICE Model of the Diode Dmbr2045mfs SPICE MODEL OF Dmbr2045mfs

Diode SPICE model simulations on Mathcad.

Drafts by Pedro Vitoriano

Research paper thumbnail of Test Plan Template

This document is a template of a Test Plan document for a project. The template includes instruct... more This document is a template of a Test Plan document for a project. The template includes instructions to the author, boilerplate text, and fields that should be replaced with the values specific to the project.

Research paper thumbnail of WCCA Worst Case Circuit Analysis

From the Design Analysis Handbook by Ed Walker “Worst case analysis (WCA) is the mathematical det... more From the Design Analysis Handbook by Ed Walker
“Worst case analysis (WCA) is the mathematical determination of the limits of possible performance of a system to ensure that the desired system responses will not exceed specification limits and that none of the system components will be damaged or degraded”

Conference Presentations by Pedro Vitoriano

Research paper thumbnail of IMPROVED PATTERN MATCHING APPLIED TO SURFACE MOUNTING DEVICES COMPONENTS LOCALIZATION ON AUTOMATED OPTICAL INSPECTION

Research paper thumbnail of Improved Pattern Matching Applied to Surface Mounting Devices Components Localization on Automated Optical Inspection

Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manu... more Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manufacturing. The use of this technology has been proven as highly efficient for process improvements and quality achievements. The correct extraction of the component for posterior analysis is a critical step of the AOI process. Nowadays, the Pattern Matching Algorithm is commonly used, although this algorithm requires extensive calculations and is time consuming. This paper will present an improved algorithm for the component localization process, with the capability of implementation in a parallel execution system.

Research paper thumbnail of Simulation on Mathcad the SPICE Model of the Diode Dmbr2045mfs

Diode SPICE model simulations on Mathcad.

Research paper thumbnail of MC‐ICP‐MSによる天然水中のユウロピウム同位体比の決定【Powered by NICT】

Journal of Analytical Atomic Spectrometry, 2017

Research paper thumbnail of Automatic Optical Inspection for Surface Mounting Devices with IPC-A-610D compliance

International Conference on Power Engineering, Energy and Electrical Drives, 2011

Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manu... more Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manufacturing process. The use of this technology has been proved to be highly efficient on process improvements and quality achievements. The most difficult point on Surface Mounting Devices (SMD) inspection is the solder joint due to their specular reflections. Several studies have been made to improve this

Research paper thumbnail of NI Vision NI Vision Builder for Automated Inspection Tutorial NI Vision Builder for Automated Inspection Tutorial

Research paper thumbnail of 对 SMD 焊点的 2D 图像进行 3D 重构对 SMD 焊点的 2D 图像进行 3D 重构

自动光学检测（AOI）系统广 泛应用于印制电路板的生产领域，该 技术已被证明在改进组装工艺和质 量方面十分有效。对于表面贴装器 件（SMD）的检测来说，其最大的挑 战是来自与对元件焊接点的检测... more 自动光学检测（AOI）系统广
泛应用于印制电路板的生产领域，该
技术已被证明在改进组装工艺和质
量方面十分有效。对于表面贴装器
件（SMD）的检测来说，其最大的挑
战是来自与对元件焊接点的检测，因
为焊点会引光的镜面反射。针对这一
问题的解决方案已经进行了诸多的
研究。本篇文章将介绍一种 3D 焊点
的重构算法（3D-SJR）。本文中对焊
点的分类标准是采用了 IPC-A-610D
（《电子组装合适性》标准）。

Research paper thumbnail of Improved Pattern Matching Applied to Surface Mounting Devices Components Localization on Automated Optical Inspection

Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manu... more Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manufacturing. The use of this technology has been proven as highly efficient for process improvements and quality achievements. The correct extraction of the component for posterior analysis is a critical step of the AOI process. Nowadays, the Pattern Matching Algorithm is commonly used, although this algorithm requires extensive calculations and is time-consuming​. This paper will present an improved algorithm for the component localization process, with the capability of implementation in a parallel execution system.

Research paper thumbnail of 3D Solder Joint Reconstruction on SMD based on 2D Images

Automated optical inspection (AOI) systems are commonly used in PCB manufacturing. The use of thi... more Automated optical inspection (AOI) systems are commonly used in PCB manufacturing. The use of this technology has been proven as highly efficient for process improvements and quality achievements. The most challenging point in inspection of surface mounting devices (SMD) is the component solder joints, due to their specular reflects. Several studies have been made to improve this situation. This paper presents an algorithm for 3D solder joint reconstruction (3D-SJR). The criteria used in the classification of the solder joints was the IPC-A-610D (Acceptability of Electronics Assemblies).

Research paper thumbnail of Automatic Optical Inspection for Surface Mounting Devices with IPC-A-610D compliance

Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manu... more Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manufacturing process. The use of this technology has been proved to be highly efficient on process improvements and quality achievements.
The most difficult point on Surface Mounting Devices (SMD) inspection is the solder joint due to their specular reflections. Several studies have been made to improve this situation. In this paper, it is presented a solder joint classification system based on IPC-A-610D (Acceptability of Electronics Assemblies).

Research paper thumbnail of Test Plan Template

This document is a template of a Test Plan document for a project. The template includes instruct... more This document is a template of a Test Plan document for a project. The template includes instructions to the author, boilerplate text, and fields that should be replaced with the values specific to the project.

Research paper thumbnail of WCCA Worst Case Circuit Analysis

From the Design Analysis Handbook by Ed Walker “Worst case analysis (WCA) is the mathematical det... more From the Design Analysis Handbook by Ed Walker
“Worst case analysis (WCA) is the mathematical determination of the limits of possible performance of a system to ensure that the desired system responses will not exceed specification limits and that none of the system components will be damaged or degraded”