Rajen Sidhu - Academia.edu (original) (raw)
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Papers by Rajen Sidhu
During device operation thermal fatigue damage occurs in solder joints due to the coefficient of ... more During device operation thermal fatigue damage occurs in solder joints due to the coefficient of thermal expansion mismatch between the different materials in the package. This damage accumulates and eventually leads to failure. In order to fully characterize the reliability of these lead-free solder alternatives, a fundamental understanding of the relationship between microstructure and fatigue behavior must be developed.
Journal of Electronic Materials, 2007
We report on the nature of the orientation of Ag 3 Sn and the Ag 3 Sn/Sn interface in Sn-3.5Ag so... more We report on the nature of the orientation of Ag 3 Sn and the Ag 3 Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that Sn-3.5Ag containing spherical Ag 3 Sn particles does not have a preferred orientation with respect to the Sn matrix. However, needle-like Ag 3 Sn formed during slower cooling appeared to have a preferred orientation within individual Sn colonies. The interface between Sn and Ag 3 Sn appeared to be incoherent, as confirmed by high-resolution TEM analysis.
During device operation thermal fatigue damage occurs in solder joints due to the coefficient of ... more During device operation thermal fatigue damage occurs in solder joints due to the coefficient of thermal expansion mismatch between the different materials in the package. This damage accumulates and eventually leads to failure. In order to fully characterize the reliability of these lead-free solder alternatives, a fundamental understanding of the relationship between microstructure and fatigue behavior must be developed.
Journal of Electronic Materials, 2007
We report on the nature of the orientation of Ag 3 Sn and the Ag 3 Sn/Sn interface in Sn-3.5Ag so... more We report on the nature of the orientation of Ag 3 Sn and the Ag 3 Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that Sn-3.5Ag containing spherical Ag 3 Sn particles does not have a preferred orientation with respect to the Sn matrix. However, needle-like Ag 3 Sn formed during slower cooling appeared to have a preferred orientation within individual Sn colonies. The interface between Sn and Ag 3 Sn appeared to be incoherent, as confirmed by high-resolution TEM analysis.