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circuitmart.com
Two different temperature cycling profiles were used to compare the thermal fatigue reliability o... more Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different, high strain surface mount (SMT) packages. In some applications, high strain Pb free (SnAgCu) components are expected ...
2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2012
Significant innovations in Pb-free solder alloy compositions are being driven by volume manufactu... more Significant innovations in Pb-free solder alloy compositions are being driven by volume manufacturing and field experiences. As a result, the industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu (SAC) alloys. The increasing number of Pb-free alloys provides opportunities to address shortcomings of near-eutectic SAC, such as the poor mechanical shock performance, alloy cost, copper dissolution, and poor mechanical behavior of joints in bending. At the same time, the increase in alloy choice presents challenges in managing the supply chain and introduces a variety of technical and logistical risks, such as a potential decrease in thermal fatigue resistance and the complexity of managing process parameters given the variability of alloy compositions. This paper summarizes the results of an iNEMI project to address the opportunities and risks of new Pb-free alloy alternatives. The results of our analysis of the state of industry knowledge on Sn-Ag-Cu alloy alternatives are provided, and focus areas for closing key gaps are identified. Progress in updating or creating industry standards to manage the introduction and use of new alloys is also presented. Finally, our plans to investigate thermal fatigue reliability of new alloys are described.
Materials Science and Technology, 2005
To investigate the minimum superheat necessary to solder components on printed circuit boards suc... more To investigate the minimum superheat necessary to solder components on printed circuit boards successfully using 95 . 5 wt-%Sn, 3 . 8 wt-%Ag, 0 . 7 wt-%Cu solder, experiments were carried out using separate solder balls of the type used in ball grid arrays. Significant differences in microstructure were observed depending on the peak temperature reached in the liquid on melting. On cooling, substantial undercooling was often observed, with values up to 18 K. Under some freezing conditions, the primary phase formed was Ag 3 Sn, while under other conditions the primary phase was Sn. The amount and type of eutectic microstructure formed was observed to vary with freezing conditions. The types of microstructure formed are illustrated. Nucleation phenomena and their effect on subsequent growth are discussed.
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2008
... Gregory HenshalL Ph.D. Hewlett-Packard Co. Palo Alto. CA. USA greg. henshall@hp.com Robert He... more ... Gregory HenshalL Ph.D. Hewlett-Packard Co. Palo Alto. CA. USA greg. henshall@hp.com Robert Healey and Ranjit S. Pandher. Ph.D. Cookson Electronics South Plainfield. NJ. USA Keith Sweatman and Keith Howell Nihon Superior Co .. Ltd. Osaka Japan Richard Coyle. ...
Significant innovations in Pb-free solder alloy compositions are being driven by volume manufactu... more Significant innovations in Pb-free solder alloy compositions are being driven by volume manufacturing and field experiences. As a result, the industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu (SAC) alloys. The increasing number of Pb-free alloys provides opportunities to address shortcomings of near-eutectic SAC, such as the poor mechanical shock
circuitmart.com
Two different temperature cycling profiles were used to compare the thermal fatigue reliability o... more Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different, high strain surface mount (SMT) packages. In some applications, high strain Pb free (SnAgCu) components are expected ...
2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2012
Significant innovations in Pb-free solder alloy compositions are being driven by volume manufactu... more Significant innovations in Pb-free solder alloy compositions are being driven by volume manufacturing and field experiences. As a result, the industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu (SAC) alloys. The increasing number of Pb-free alloys provides opportunities to address shortcomings of near-eutectic SAC, such as the poor mechanical shock performance, alloy cost, copper dissolution, and poor mechanical behavior of joints in bending. At the same time, the increase in alloy choice presents challenges in managing the supply chain and introduces a variety of technical and logistical risks, such as a potential decrease in thermal fatigue resistance and the complexity of managing process parameters given the variability of alloy compositions. This paper summarizes the results of an iNEMI project to address the opportunities and risks of new Pb-free alloy alternatives. The results of our analysis of the state of industry knowledge on Sn-Ag-Cu alloy alternatives are provided, and focus areas for closing key gaps are identified. Progress in updating or creating industry standards to manage the introduction and use of new alloys is also presented. Finally, our plans to investigate thermal fatigue reliability of new alloys are described.
Materials Science and Technology, 2005
To investigate the minimum superheat necessary to solder components on printed circuit boards suc... more To investigate the minimum superheat necessary to solder components on printed circuit boards successfully using 95 . 5 wt-%Sn, 3 . 8 wt-%Ag, 0 . 7 wt-%Cu solder, experiments were carried out using separate solder balls of the type used in ball grid arrays. Significant differences in microstructure were observed depending on the peak temperature reached in the liquid on melting. On cooling, substantial undercooling was often observed, with values up to 18 K. Under some freezing conditions, the primary phase formed was Ag 3 Sn, while under other conditions the primary phase was Sn. The amount and type of eutectic microstructure formed was observed to vary with freezing conditions. The types of microstructure formed are illustrated. Nucleation phenomena and their effect on subsequent growth are discussed.
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2008
... Gregory HenshalL Ph.D. Hewlett-Packard Co. Palo Alto. CA. USA greg. henshall@hp.com Robert He... more ... Gregory HenshalL Ph.D. Hewlett-Packard Co. Palo Alto. CA. USA greg. henshall@hp.com Robert Healey and Ranjit S. Pandher. Ph.D. Cookson Electronics South Plainfield. NJ. USA Keith Sweatman and Keith Howell Nihon Superior Co .. Ltd. Osaka Japan Richard Coyle. ...
Significant innovations in Pb-free solder alloy compositions are being driven by volume manufactu... more Significant innovations in Pb-free solder alloy compositions are being driven by volume manufacturing and field experiences. As a result, the industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu (SAC) alloys. The increasing number of Pb-free alloys provides opportunities to address shortcomings of near-eutectic SAC, such as the poor mechanical shock