Roland Tacken - Academia.edu (original) (raw)
Papers by Roland Tacken
Integration of functions in single components is pursued in order to manufacture smaller and smar... more Integration of functions in single components is pursued in order to manufacture smaller and smarter polymer micro devices at less cost, through e.g. less assembly steps. It requires integration on both product and production side. This paper addresses the use of molded interconnect device (MID) technology for the integration of electronic circuitry into polymer products. Shown will be new approaches of selective metallization for creating conductive tracks. The supply chain of MID parts is still seen as vulnerable, resulting in concerns on reliability of production and product. A solution is integration of processes in one production cell. Shown is the feasibility of integrating a surface patterning process into an injection molding tool.
Journal of Photopolymer Science and Technology, 2011
We propose a design to fabricate transistors on flexible substrates in a bottom-up fashion using ... more We propose a design to fabricate transistors on flexible substrates in a bottom-up fashion using R2R UVimprint lithography. The design consists of a template composed of multilevel as well as gray level features, the later used to facilitate device interconnection. A hard mold is fabricated by LBR and a flexible Ni replica is done using Ni electroplating. The flexible stamp is used in the R2R UV imprint machine with PET as flexible substrate. Imprints were performed at a speed of 0.35m/min and show a high level of replication of the multilevel as well as gray level features.
Journal of Applied Electrochemistry, 1996
Composite materials with unique properties can be produced by codepositing an inert phase during ... more Composite materials with unique properties can be produced by codepositing an inert phase during a cathodic metal deposition process. The feasibility of codeposition is mainly determined by the interaction of the inert phase and the cathodically deposited metal. When both the inert phase and the cathode or the cathodically deposited metal are ferromagnetic substances, codeposition can be promoted by magnetizing the inert phase prior to codeposition. Codeposition of Zn with Ni particles on a steel cathode from a weakly acidic zinc chloride based bath was investigated. The increased interaction between the magnetically remanent Ni particles and the steel cathode resulted in substantially higher percentages of Ni included in the deposit layer, especially at low concentrations of Ni particles in the bath. The model of Guglielmi, modified for conducting particles, proved to be valid; the value of adsorption parameter kad changed with magnetic remanency. Cathodic Zn deposition efficiency decreased with increasing concentration of Ni particles in solution and increasing Ni content in the deposit. The principle outlined can also be applied to systems with nonferromagnetic inert phases by coating these with ferromagnetic substances.
Journal of Applied Electrochemistry, 1995
A broad overview of research on the effects of imposed magnetic fields on electrolytic processes ... more A broad overview of research on the effects of imposed magnetic fields on electrolytic processes is given. As well as modelling of mass transfer in magnetoelectrolytic cells, the effect of magnetic fields on reaction kinetics is discussed. Interactions of an imposed magnetic field with cathodic crystallization and anodic dissolution behaviour of metals are also treated. These topics are described from a practical point of view. Nomenclature al, a2 B c Ccx~
Analytica Chimica Acta, 1993
For the design of a new glucose sensor, a knowledge of the diffusion of all partlclpatmg compound... more For the design of a new glucose sensor, a knowledge of the diffusion of all partlclpatmg compounds IS needed A rotating disc electrode covered unth hydrogel layer was used to determme the effectlve dlftislon coefficients (Den) of oxygen, hydrogen peronde and hydroqumone m a hydrogel, which IS used m the sensor Measurements were camed out under steady-state condltlons The three compounds appeared to be slowed by the gel to the same extent A comparison was made between the Den values of glucose and hydroqumone by simultaneous dlffuslon through a hydrogel membrane In this case glucose dlffuslon was slowed to a larger extent than hydroqumone diffusion The effect, however, was independent of the degree of cross-hnkmg of the hydrogel
Space Telescopes and Instrumentation 2022: Ultraviolet to Gamma Ray
La presente invention concerne un procede de preparation de motif pour circuit electrique ; il co... more La presente invention concerne un procede de preparation de motif pour circuit electrique ; il comprend les etapes suivantes : (a) apport d'un substrat ; (b) apport d'un motif de materiau d'inhibition pour un circuit electrique sur le substrat en i) appliquant une couche du materiau d'inhibition sur le substrat et en retirant mecaniquement localement la couche du materiau d'inhibition afin d'obtenir le motif ou ii) application d'une couche de materiau d'inhibition sur le substrat. La couche comporte un motif predetermine qui couvre de maniere incomplete le substrat ; (c) etablissement d'une distribution de particules d'un premier metal ou alliage sur la couche du materiau d'inhibition et le motif tel qu'il est obtenu dans l'etape. (b) et (d) depot au moyen d'un procede sans electrode d'une couche d'un second metal ou alliage sur la distribution des particules du premier metal ou alliage tel qu'il est obtenu dans l&#...
Process for manufacturing a product endowed coating (5), comprising the steps of: - providing a d... more Process for manufacturing a product endowed coating (5), comprising the steps of: - providing a digital representation of the product; - sequentially supplying energy and / or material specific spatial points under digital control larepresentacion product; - coating the product; wherein the product is a partially coated having at least one coated (6) area and at least one uncovered area (7), - including the product represented by said digital representation, for each area provided uncoated one removable coating layer (8) arranged to temporarily cover said area - sequentially supplying energy and / or material for release liner layer (8) forthe product; - including the said coating (10) the coating layer for each intended non-coated area, the method comprising - extracting the product the covering layer (8) for each intended non-coated area, including recubrimientode the coating layer.
Journal of Microelectronics and Electronic Packaging, 2017
There is a strong market need for further miniaturization of microelectronic ceramic-based produc... more There is a strong market need for further miniaturization of microelectronic ceramic-based products; electronic components require an increasingly finer pitch interconnect. Screen-printing resolution is a limiting factor in further miniaturization of classical thick film. Photo imageable thick film technology (PITF) was proposed decades ago as a successor technology to thick film, to achieve finer pitch patterns. However, where classical multilayer thick film provides good routing and interconnect capabilities, but insufficient fine line resolution, PITF does the reverse: no multilayer routing but advanced fine line performance. A combination of PITF for fine pitch mounting with advanced MLTF for efficient routing has been developed, targeting a linewidth of 50 μm line/spaces and below. Test and demo panels were made, using combinations of PITF pastes and conventional screen-print materials. Results, process performance, and limiting factors are discussed.
Integration of functions in single components is pursued in order to manufacture smaller and smar... more Integration of functions in single components is pursued in order to manufacture smaller and smarter polymer micro devices at less cost, through e.g. less assembly steps. It requires integration on both product and production side. This paper addresses the use of molded interconnect device (MID) technology for the integration of electronic circuitry into polymer products. Shown will be new approaches of selective metallization for creating conductive tracks. The supply chain of MID parts is still seen as vulnerable, resulting in concerns on reliability of production and product. A solution is integration of processes in one production cell. Shown is the feasibility of integrating a surface patterning process into an injection molding tool.
Journal of Photopolymer Science and Technology, 2011
We propose a design to fabricate transistors on flexible substrates in a bottom-up fashion using ... more We propose a design to fabricate transistors on flexible substrates in a bottom-up fashion using R2R UVimprint lithography. The design consists of a template composed of multilevel as well as gray level features, the later used to facilitate device interconnection. A hard mold is fabricated by LBR and a flexible Ni replica is done using Ni electroplating. The flexible stamp is used in the R2R UV imprint machine with PET as flexible substrate. Imprints were performed at a speed of 0.35m/min and show a high level of replication of the multilevel as well as gray level features.
Journal of Applied Electrochemistry, 1996
Composite materials with unique properties can be produced by codepositing an inert phase during ... more Composite materials with unique properties can be produced by codepositing an inert phase during a cathodic metal deposition process. The feasibility of codeposition is mainly determined by the interaction of the inert phase and the cathodically deposited metal. When both the inert phase and the cathode or the cathodically deposited metal are ferromagnetic substances, codeposition can be promoted by magnetizing the inert phase prior to codeposition. Codeposition of Zn with Ni particles on a steel cathode from a weakly acidic zinc chloride based bath was investigated. The increased interaction between the magnetically remanent Ni particles and the steel cathode resulted in substantially higher percentages of Ni included in the deposit layer, especially at low concentrations of Ni particles in the bath. The model of Guglielmi, modified for conducting particles, proved to be valid; the value of adsorption parameter kad changed with magnetic remanency. Cathodic Zn deposition efficiency decreased with increasing concentration of Ni particles in solution and increasing Ni content in the deposit. The principle outlined can also be applied to systems with nonferromagnetic inert phases by coating these with ferromagnetic substances.
Journal of Applied Electrochemistry, 1995
A broad overview of research on the effects of imposed magnetic fields on electrolytic processes ... more A broad overview of research on the effects of imposed magnetic fields on electrolytic processes is given. As well as modelling of mass transfer in magnetoelectrolytic cells, the effect of magnetic fields on reaction kinetics is discussed. Interactions of an imposed magnetic field with cathodic crystallization and anodic dissolution behaviour of metals are also treated. These topics are described from a practical point of view. Nomenclature al, a2 B c Ccx~
Analytica Chimica Acta, 1993
For the design of a new glucose sensor, a knowledge of the diffusion of all partlclpatmg compound... more For the design of a new glucose sensor, a knowledge of the diffusion of all partlclpatmg compounds IS needed A rotating disc electrode covered unth hydrogel layer was used to determme the effectlve dlftislon coefficients (Den) of oxygen, hydrogen peronde and hydroqumone m a hydrogel, which IS used m the sensor Measurements were camed out under steady-state condltlons The three compounds appeared to be slowed by the gel to the same extent A comparison was made between the Den values of glucose and hydroqumone by simultaneous dlffuslon through a hydrogel membrane In this case glucose dlffuslon was slowed to a larger extent than hydroqumone diffusion The effect, however, was independent of the degree of cross-hnkmg of the hydrogel
Space Telescopes and Instrumentation 2022: Ultraviolet to Gamma Ray
La presente invention concerne un procede de preparation de motif pour circuit electrique ; il co... more La presente invention concerne un procede de preparation de motif pour circuit electrique ; il comprend les etapes suivantes : (a) apport d'un substrat ; (b) apport d'un motif de materiau d'inhibition pour un circuit electrique sur le substrat en i) appliquant une couche du materiau d'inhibition sur le substrat et en retirant mecaniquement localement la couche du materiau d'inhibition afin d'obtenir le motif ou ii) application d'une couche de materiau d'inhibition sur le substrat. La couche comporte un motif predetermine qui couvre de maniere incomplete le substrat ; (c) etablissement d'une distribution de particules d'un premier metal ou alliage sur la couche du materiau d'inhibition et le motif tel qu'il est obtenu dans l'etape. (b) et (d) depot au moyen d'un procede sans electrode d'une couche d'un second metal ou alliage sur la distribution des particules du premier metal ou alliage tel qu'il est obtenu dans l&#...
Process for manufacturing a product endowed coating (5), comprising the steps of: - providing a d... more Process for manufacturing a product endowed coating (5), comprising the steps of: - providing a digital representation of the product; - sequentially supplying energy and / or material specific spatial points under digital control larepresentacion product; - coating the product; wherein the product is a partially coated having at least one coated (6) area and at least one uncovered area (7), - including the product represented by said digital representation, for each area provided uncoated one removable coating layer (8) arranged to temporarily cover said area - sequentially supplying energy and / or material for release liner layer (8) forthe product; - including the said coating (10) the coating layer for each intended non-coated area, the method comprising - extracting the product the covering layer (8) for each intended non-coated area, including recubrimientode the coating layer.
Journal of Microelectronics and Electronic Packaging, 2017
There is a strong market need for further miniaturization of microelectronic ceramic-based produc... more There is a strong market need for further miniaturization of microelectronic ceramic-based products; electronic components require an increasingly finer pitch interconnect. Screen-printing resolution is a limiting factor in further miniaturization of classical thick film. Photo imageable thick film technology (PITF) was proposed decades ago as a successor technology to thick film, to achieve finer pitch patterns. However, where classical multilayer thick film provides good routing and interconnect capabilities, but insufficient fine line resolution, PITF does the reverse: no multilayer routing but advanced fine line performance. A combination of PITF for fine pitch mounting with advanced MLTF for efficient routing has been developed, targeting a linewidth of 50 μm line/spaces and below. Test and demo panels were made, using combinations of PITF pastes and conventional screen-print materials. Results, process performance, and limiting factors are discussed.