Uttam Ghoshal - Academia.edu (original) (raw)

Papers by Uttam Ghoshal

Research paper thumbnail of 2012 ARPA-E Energy Innovation Summit: Profiling Sheetak: Low Cost - Solid State Cooling

Research paper thumbnail of 20 Gb/s self-timed vector processing with Josephson single-flux quantum technology

1997 IEEE International Solids-State Circuits Conference. Digest of Technical Papers

Self-timing and vector processing are combined in the 20 Gb/s superconducting single flux quantum... more Self-timing and vector processing are combined in the 20 Gb/s superconducting single flux quantum (SFQ) digital system presented. Experimental test results are presented for circuit components including the Muller-C element, the shift register, the vector completion detector, and the clock generator

Research paper thumbnail of Method and system for forming a thermoelement for a thermoelectric cooler

Research paper thumbnail of Monolithically Integrated Cold Point Thermoelectric Cooler

Research paper thumbnail of Thermoelectric microcoolers for cooling write coils and GMR sensors in magnetic heads for disk drives

Research paper thumbnail of Two dimensional thermoelectric cooler configuration

Research paper thumbnail of Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms

结合脉冲电力和多个选择性启动的热开关、利用热电元件动力学而用于低温冷却的设备和方法。 在一种形式中,利用电力脉冲使珀尔贴装置动态地启动,而在装置冷侧与热侧之间的热通路响应于珀尔贴装置内的温度动力... more 结合脉冲电力和多个选择性启动的热开关、利用热电元件动力学而用于低温冷却的设备和方法。 在一种形式中,利用电力脉冲使珀尔贴装置动态地启动,而在装置冷侧与热侧之间的热通路响应于珀尔贴装置内的温度动力学被选择性切换传导状态。 通过脱开否则影响净热传导的焦尔发热和导热传递损失,与珀尔贴装置的电和热动力学相对同步地切换热连接的耦合,显著提高了效率。 最佳实例利用MEMS完成选择性的切换,由此提高了低温冷却能力。

Research paper thumbnail of Enhanced interface thermoelectric coolers with all-metal tips

Research paper thumbnail of Method and Apparatus for Thermal Management of Integrated Circuits

Research paper thumbnail of Cold point design for efficient thermoelectric coolers

Research paper thumbnail of Method for performing a high-temperature burn-in test on integrated circuits

Research paper thumbnail of Apparatus and methods for performing switching in magnetic refrigeration systems using inductively coupled thermoelectric switches

Research paper thumbnail of Clock Generator for Integrated Circuit

Research paper thumbnail of Apparatus for dense chip packaging using heat pipes and thermoelectric coolers

PURPOSE: An apparatus for dense chip package using heat pipes and thermoelectric coolers is provi... more PURPOSE: An apparatus for dense chip package using heat pipes and thermoelectric coolers is provided to minimize a fluid resistance by using a capillary structure based on fractal and structural geometry supplying a maximum capillary force. CONSTITUTION: An apparatus includes an evaporator region(210), a condenser region(225) and a capillary region(220). The evaporator region(210) further includes one or more hot point elements used to transfer heat from a heat source to a transport fluid(260). The transport fluid(260) changes state to a vapor when heat is applied to the transport fluid(260). The vapor travels to the condenser region(225) via vapor channels(235) and is condensed to a fluid once again by transferring heat from the vapor to a heat sink. Then, the condensed fluid is returned to the evaporator region(210) by way of capillary forces and capillaries formed in a capillary structure(245). The apparatus further includes a flexible region that allows the apparatus to be bent around corners and edges.

Research paper thumbnail of Integrated quantum cold point coolers

Research paper thumbnail of Practical air dielectric interconnections by post-processing standard CMOS wafers

Research paper thumbnail of Thermoelectric cooling with dynamic switching to isolate heat transport mechanisms

Research paper thumbnail of Method for forming a monolithic thin-film thermoelectric device including complementary thermoelectric materials

Research paper thumbnail of Solid state thermal switch

Research paper thumbnail of Mixed thermoelectric cooling apparatus and method

Research paper thumbnail of 2012 ARPA-E Energy Innovation Summit: Profiling Sheetak: Low Cost - Solid State Cooling

Research paper thumbnail of 20 Gb/s self-timed vector processing with Josephson single-flux quantum technology

1997 IEEE International Solids-State Circuits Conference. Digest of Technical Papers

Self-timing and vector processing are combined in the 20 Gb/s superconducting single flux quantum... more Self-timing and vector processing are combined in the 20 Gb/s superconducting single flux quantum (SFQ) digital system presented. Experimental test results are presented for circuit components including the Muller-C element, the shift register, the vector completion detector, and the clock generator

Research paper thumbnail of Method and system for forming a thermoelement for a thermoelectric cooler

Research paper thumbnail of Monolithically Integrated Cold Point Thermoelectric Cooler

Research paper thumbnail of Thermoelectric microcoolers for cooling write coils and GMR sensors in magnetic heads for disk drives

Research paper thumbnail of Two dimensional thermoelectric cooler configuration

Research paper thumbnail of Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms

结合脉冲电力和多个选择性启动的热开关、利用热电元件动力学而用于低温冷却的设备和方法。 在一种形式中,利用电力脉冲使珀尔贴装置动态地启动,而在装置冷侧与热侧之间的热通路响应于珀尔贴装置内的温度动力... more 结合脉冲电力和多个选择性启动的热开关、利用热电元件动力学而用于低温冷却的设备和方法。 在一种形式中,利用电力脉冲使珀尔贴装置动态地启动,而在装置冷侧与热侧之间的热通路响应于珀尔贴装置内的温度动力学被选择性切换传导状态。 通过脱开否则影响净热传导的焦尔发热和导热传递损失,与珀尔贴装置的电和热动力学相对同步地切换热连接的耦合,显著提高了效率。 最佳实例利用MEMS完成选择性的切换,由此提高了低温冷却能力。

Research paper thumbnail of Enhanced interface thermoelectric coolers with all-metal tips

Research paper thumbnail of Method and Apparatus for Thermal Management of Integrated Circuits

Research paper thumbnail of Cold point design for efficient thermoelectric coolers

Research paper thumbnail of Method for performing a high-temperature burn-in test on integrated circuits

Research paper thumbnail of Apparatus and methods for performing switching in magnetic refrigeration systems using inductively coupled thermoelectric switches

Research paper thumbnail of Clock Generator for Integrated Circuit

Research paper thumbnail of Apparatus for dense chip packaging using heat pipes and thermoelectric coolers

PURPOSE: An apparatus for dense chip package using heat pipes and thermoelectric coolers is provi... more PURPOSE: An apparatus for dense chip package using heat pipes and thermoelectric coolers is provided to minimize a fluid resistance by using a capillary structure based on fractal and structural geometry supplying a maximum capillary force. CONSTITUTION: An apparatus includes an evaporator region(210), a condenser region(225) and a capillary region(220). The evaporator region(210) further includes one or more hot point elements used to transfer heat from a heat source to a transport fluid(260). The transport fluid(260) changes state to a vapor when heat is applied to the transport fluid(260). The vapor travels to the condenser region(225) via vapor channels(235) and is condensed to a fluid once again by transferring heat from the vapor to a heat sink. Then, the condensed fluid is returned to the evaporator region(210) by way of capillary forces and capillaries formed in a capillary structure(245). The apparatus further includes a flexible region that allows the apparatus to be bent around corners and edges.

Research paper thumbnail of Integrated quantum cold point coolers

Research paper thumbnail of Practical air dielectric interconnections by post-processing standard CMOS wafers

Research paper thumbnail of Thermoelectric cooling with dynamic switching to isolate heat transport mechanisms

Research paper thumbnail of Method for forming a monolithic thin-film thermoelectric device including complementary thermoelectric materials

Research paper thumbnail of Solid state thermal switch

Research paper thumbnail of Mixed thermoelectric cooling apparatus and method