Stanton Weaver - Academia.edu (original) (raw)
Papers by Stanton Weaver
2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 2003
The efficiency and reliability of the solid-state lighting devices strongly depend on successful ... more The efficiency and reliability of the solid-state lighting devices strongly depend on successful thermal management. Light emitting diodes, LEDs, a strong candidate for the next generation general illumination applications are of interest. Typical white LEDs start with either blue ...
A system is provided. The system includes a device that includes top and bottom thermally conduct... more A system is provided. The system includes a device that includes top and bottom thermally conductive substrates positioned opposite to one another, wherein a top surface of the bottom thermally conductive substrate is substantially atomically flat and a thermal blocking layer disposed between the top and bottom thermally conductive substrates. The device also includes top and bottom electrodes separated from
Third International Conference on Solid State Lighting, 2004
Light emitting diodes, LEDs, historically have been used for indicators and produced low amounts ... more Light emitting diodes, LEDs, historically have been used for indicators and produced low amounts of heat. The introduction of high brightness LEDs with white light and monochromatic colors have led to a movement towards general illumination. The increased electrical currents used to drive the LEDs have focused more attention on the thermal paths in the developments of LED power packaging. The luminous efficiency of LEDs is soon expected to reach over 80 lumens/W, this is approximately 6 times the efficiency of a conventional incandescent tungsten bulb. Thermal management for the solid-state lighting applications is a key design parameter for both package and system level. Package and system level thermal management is discussed in separate sections. Effect of chip packages on junction to board thermal resistance was compared for both SiC and Sapphire chips. The higher thermal conductivity of the SiC chip provided about 2 times better thermal performance than the latter, while the under-filled Sapphire chip package can only catch the SiC chip performance. Later, system level thermal management was studied based on established numerical models for a conceptual solid-state lighting system. A conceptual LED illumination system was chosen and CFD models were created to determine the availability and limitations of passive air-cooling.
Fourth International Conference on Solid State Lighting, 2004
The efficiency and reliability of the solid-state lighting devices strongly depend on successful ... more The efficiency and reliability of the solid-state lighting devices strongly depend on successful thermal management.
Advances in Electronic Packaging, Parts A, B, and C, 2005
ABSTRACT
ABSTRACT A method for fabricating a component is disclosed. The method includes: providing a memb... more ABSTRACT A method for fabricating a component is disclosed. The method includes: providing a member having an effective work function of an initial value, disposing a sacrificial layer on a surface of the member, disposing a first agent within the member to obtain a predetermined concentration of the agent at said surface of the member, annealing the member, and removing the sacrificial layer to expose said surface of the member, wherein said surface has a post-process effective work function that is different from the initial value.
Nanoscience and Nanotechnology Letters, 2010
ABSTRACT
Micro- and Nanotechnology Sensors, Systems, and Applications II, 2010
ABSTRACT
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 2005
ABSTRACT
Heat Transfer: Volume 2, 2008
ABSTRACT
ASME 2009 InterPACK Conference, Volume 2, 2009
Heat pipes have been gaining a lot of popularity in electronics cooling applications due to their... more Heat pipes have been gaining a lot of popularity in electronics cooling applications due to their ease of operation, reliability, and high effective thermal conductivity. An important component of a heat pipe is the wick structure, which transports the condensate from condenser to evaporator. The design of wick structures is complicated by competing requirements to create high capillary driving forces and maintain high permeability. While generating large pore sizes will help achieve high permeability, it will significantly reduce the wick's capillary performance. This study presents a novel experimental method to simultaneously measure capillary and permeability characteristics of the wick structures using fluorescent visualization. This technique will be used to study the effects of pore size and gravitational force on the flow-related properties of the wick structures. Initial results are presented on wick samples visually characterized from zero to nine g acceleration on a centrifuge. These results will provide a tool to understand the physics involved in transport through porous structures and help in the design of high performance heat pipes.
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2010
ABSTRACT
ASME/JSME 2011 8th Thermal Engineering Joint Conference, 2011
Heat pipes are commonly used in electronics cooling applications to spread heat from a concentrat... more Heat pipes are commonly used in electronics cooling applications to spread heat from a concentrated heat source to a larger heat sink. Heat pipes work on the principles of two-phase heat transfer by evaporation and condensation of a working fluid. The amount of ...
ASME 2009 InterPACK Conference, Volume 1, 2009
ABSTRACT
Optical Engineering, 2005
... [bold Stanton Weaver] received a dual AAS degree in electrical engineering technology and dig... more ... [bold Stanton Weaver] received a dual AAS degree in electrical engineering technology and digital communications in 1983 from SUNY Morrisville. ... He was a key member of the team responsible for development of state-of-the-art direct laser write and drill machines. ...
Journal of Electronic Packaging, 2007
ABSTRACT
Journal of Electronic Packaging, 2005
ABSTRACT
2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 2003
The efficiency and reliability of the solid-state lighting devices strongly depend on successful ... more The efficiency and reliability of the solid-state lighting devices strongly depend on successful thermal management. Light emitting diodes, LEDs, a strong candidate for the next generation general illumination applications are of interest. Typical white LEDs start with either blue ...
A system is provided. The system includes a device that includes top and bottom thermally conduct... more A system is provided. The system includes a device that includes top and bottom thermally conductive substrates positioned opposite to one another, wherein a top surface of the bottom thermally conductive substrate is substantially atomically flat and a thermal blocking layer disposed between the top and bottom thermally conductive substrates. The device also includes top and bottom electrodes separated from
Third International Conference on Solid State Lighting, 2004
Light emitting diodes, LEDs, historically have been used for indicators and produced low amounts ... more Light emitting diodes, LEDs, historically have been used for indicators and produced low amounts of heat. The introduction of high brightness LEDs with white light and monochromatic colors have led to a movement towards general illumination. The increased electrical currents used to drive the LEDs have focused more attention on the thermal paths in the developments of LED power packaging. The luminous efficiency of LEDs is soon expected to reach over 80 lumens/W, this is approximately 6 times the efficiency of a conventional incandescent tungsten bulb. Thermal management for the solid-state lighting applications is a key design parameter for both package and system level. Package and system level thermal management is discussed in separate sections. Effect of chip packages on junction to board thermal resistance was compared for both SiC and Sapphire chips. The higher thermal conductivity of the SiC chip provided about 2 times better thermal performance than the latter, while the under-filled Sapphire chip package can only catch the SiC chip performance. Later, system level thermal management was studied based on established numerical models for a conceptual solid-state lighting system. A conceptual LED illumination system was chosen and CFD models were created to determine the availability and limitations of passive air-cooling.
Fourth International Conference on Solid State Lighting, 2004
The efficiency and reliability of the solid-state lighting devices strongly depend on successful ... more The efficiency and reliability of the solid-state lighting devices strongly depend on successful thermal management.
Advances in Electronic Packaging, Parts A, B, and C, 2005
ABSTRACT
ABSTRACT A method for fabricating a component is disclosed. The method includes: providing a memb... more ABSTRACT A method for fabricating a component is disclosed. The method includes: providing a member having an effective work function of an initial value, disposing a sacrificial layer on a surface of the member, disposing a first agent within the member to obtain a predetermined concentration of the agent at said surface of the member, annealing the member, and removing the sacrificial layer to expose said surface of the member, wherein said surface has a post-process effective work function that is different from the initial value.
Nanoscience and Nanotechnology Letters, 2010
ABSTRACT
Micro- and Nanotechnology Sensors, Systems, and Applications II, 2010
ABSTRACT
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 2005
ABSTRACT
Heat Transfer: Volume 2, 2008
ABSTRACT
ASME 2009 InterPACK Conference, Volume 2, 2009
Heat pipes have been gaining a lot of popularity in electronics cooling applications due to their... more Heat pipes have been gaining a lot of popularity in electronics cooling applications due to their ease of operation, reliability, and high effective thermal conductivity. An important component of a heat pipe is the wick structure, which transports the condensate from condenser to evaporator. The design of wick structures is complicated by competing requirements to create high capillary driving forces and maintain high permeability. While generating large pore sizes will help achieve high permeability, it will significantly reduce the wick's capillary performance. This study presents a novel experimental method to simultaneously measure capillary and permeability characteristics of the wick structures using fluorescent visualization. This technique will be used to study the effects of pore size and gravitational force on the flow-related properties of the wick structures. Initial results are presented on wick samples visually characterized from zero to nine g acceleration on a centrifuge. These results will provide a tool to understand the physics involved in transport through porous structures and help in the design of high performance heat pipes.
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2010
ABSTRACT
ASME/JSME 2011 8th Thermal Engineering Joint Conference, 2011
Heat pipes are commonly used in electronics cooling applications to spread heat from a concentrat... more Heat pipes are commonly used in electronics cooling applications to spread heat from a concentrated heat source to a larger heat sink. Heat pipes work on the principles of two-phase heat transfer by evaporation and condensation of a working fluid. The amount of ...
ASME 2009 InterPACK Conference, Volume 1, 2009
ABSTRACT
Optical Engineering, 2005
... [bold Stanton Weaver] received a dual AAS degree in electrical engineering technology and dig... more ... [bold Stanton Weaver] received a dual AAS degree in electrical engineering technology and digital communications in 1983 from SUNY Morrisville. ... He was a key member of the team responsible for development of state-of-the-art direct laser write and drill machines. ...
Journal of Electronic Packaging, 2007
ABSTRACT
Journal of Electronic Packaging, 2005
ABSTRACT