Zainudin Kornain - Academia.edu (original) (raw)
Papers by Zainudin Kornain
Komitmen industri dalam membantu penyusunan program pembangunan dan kompetensi bagi memenuhi tuntutan negara
Telemedicine system: Development of wireless healthcare units with GSM and Bluetooth link
2012 Ieee Symposium on Industrial Electronics and Applications, Sep 1, 2012
Indonesian Journal of Electrical Engineering and Computer Science
This paper presents the classification of EMG signal for multiple hand gestures based on neural n... more This paper presents the classification of EMG signal for multiple hand gestures based on neural network. In this study, the Electromyography is used to measure the muscle cell’s electrical activities which is commonly represented in a function time. Every muscle has their own signals, which was produced in every movement. Surface electromyography (sEMG) is used as a non-invasive technique for acquiring the EMG signal. The development of sensors’ detection and measuring the EMG have been improved and have become more precise while maintaining a small size. In this paper, the main objective is to identify the hand gestures based on: (1) Cylindrical Grasp, (2) Supination (Twist Left), (3) Pronation (Twist Right), (4) Resting Hand and (5) Open Hand that are predefined by using Arduino IDE, CoolTerm software and Microsoft Excel before using artificial neural network for classifying purposes in MATLAB. Finally, the extraction of the EMG patterns for each movement went through features ext...
The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging
Key Engineering Materials, Apr 30, 2011
Underfilling is the vital process to reduce the impact of the thermal stress that results from th... more Underfilling is the vital process to reduce the impact of the thermal stress that results from the mismatch in the co-efficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. This paper reported the pattern of underfill’s hardness during curing process for large die Ceramic Flip Chip Ball Grid Array (FC-CBGA). A commercial amine based underfill epoxy was dispensed into HiCTE FC-CBGA and cured in curing oven under a new method of two-step curing profile. Nano-identation test was employed to investigate the hardness of underfill epoxy during curing steps. The result has shown the almost similar hardness of fillet area and centre of the package after cured which presented uniformity of curing states. The total curing time/cycle in production was potentially reduced due to no significant different of hardness after 60 min and 120 min during the period of second hold temperature.
American Journal of Engineering and Applied Sciences, 2010
Problem statement: This study mainly to study the effect of several commercial underfill material... more Problem statement: This study mainly to study the effect of several commercial underfill materials to the reliability of HiCTE Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to Accelerated Thermal Cycling (ATC) effect. Approach: The warpage condition of package, die back stress, interfacial die shear stress, and solder bump fatigue for different commercial underfills were assessed and compared via a commercial Finite Element Analysis (FEA) under JEDEC Standard of ATC. The thermo-mechanical properties of underfills for simulation were obtained by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA). The actual package of HiCTE FC-CBGA were assembled with those underfill materials and underwent ATC to be compared with FEA result. Results: The results from FEA and experimental were discussed to characterize the performance of each underfill material. The results of this study indicate that the underfill materials investigated, those with a glass transition temperature (Tg) and a Young ' s modulus of approximately above 105°C and 8-9 GPa, respectively, were appropriate for HiCTE FC-CBGA with high lead solder bumps. Conclusion: The result from FEA analysis and ATC reliability test found that the underfill materials with high and medium low Young's modulus has high reliability in FC-CBGA package.
International Journal of Engineering and Technology, 2013
2004 IEEE International Conference on Semiconductor Electronics, 2004
The effect of temperature change to electrical resistivity of Aluminum bond pad (Al pad) on die s... more The effect of temperature change to electrical resistivity of Aluminum bond pad (Al pad) on die surface of Under Bump Metallurgy (UBM) were discussed in this paper. Four categories of samples were involved in measurement; a sample without UBM and the samples with single, double and
The Investigation of Die Back Edge Cracking in Flip Chip Ceramic Ball Grid Array Package (FC-CBGA)
ABSTRACT
Implementation of novel reflow profile of no-clean fluxes to enhance flux stability and oxide layer removal of the high lead solder bump
Abstract Various retlow profiles have been applied on different no-clean tluxes amount in removin... more Abstract Various retlow profiles have been applied on different no-clean tluxes amount in removing the oxide layer of high lead solder blUnp. TIle wafers exposed to open air induce an oxide layer on the high lead solder bump. TItis oxide layer eventually creates the non wet ...
An approach on underfill material selection for the low-k Flip Chip Plastic Ball Grid Array (FCPBGA)
Abstract The role of underfill is expanding from preserving solder joint reliability to also prot... more Abstract The role of underfill is expanding from preserving solder joint reliability to also protecting fragile low-k chip dielectric layers in flip chip packaging. The aim of this study is to pre-evaluate or presume the reliability performance of several commercial underfill materials for the ...
Telemedicine system: Development of wireless healthcare units with GSM and Bluetooth link
2012 IEEE Symposium on Industrial Electronics and Applications, 2012
Automated car braking system: Using neural network system via Labview environment
2012 IEEE Conference on Open Systems, 2012
—This paper represents the development of a car braking system based on artificial neural network... more —This paper represents the development of a car braking system based on artificial neural network for use during parking. This project involves replacing the usual car reverse warning system with a system that will react automatically based on the distance between the car and a given obstacle by gradually increasing the braking pressure until such a point that is deemed the closest safe distance to the obstacle, in which the braking pressure will then be increased to max and the car will halt. To realize this application, this project will make use of LabView simulation software to create the artificial neural network engine and present the simulation results.
Advanced Materials Research, 2010
The possible source of die edge cracking for Flip Chip Ceramic Ball Grid Array (FC-CBGA) package ... more The possible source of die edge cracking for Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to thermal cycling have been investigated in this study. Finite Element Analysis (FEA) models were used to analyze the effect of underfill fillet geometry on interfacial stresses between die edge and the underfill fillet. The input parameters of FC-CBGA from industry was used for simulation and the properties of commercial underfill were extracted by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA). Die stress distribution for different fillet height were generated to depict variation of stress due thermal loading. The variation of tensile stress due different fillet height and width were discussed for parameters optimization.
The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging
Key Engineering Materials, 2011
Underfilling is the vital process to reduce the impact of the thermal stress that results from th... more Underfilling is the vital process to reduce the impact of the thermal stress that results from the mismatch in the co-efficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. This paper reported the pattern of underfill’s hardness during curing process for large die Ceramic Flip Chip Ball Grid Array (FC-CBGA). A commercial amine based underfill epoxy was dispensed into HiCTE FC-CBGA and cured in curing oven under a new method of two-step curing profile. Nano-identation test was employed to investigate the hardness of underfill epoxy during curing steps. The result has shown the almost similar hardness of fillet area and centre of the package after cured which presented uniformity of curing states. The total curing time/cycle in production was potentially reduced due to no significant different of hardness after 60 min and 120 min during the period of second hold temperature.
Estimation of Curing Profile's Parameters for Flip Chip Packaging Using DSC and TGA
Key Engineering Materials, 2011
This paper presents the method to estimate curing profile's parameters for curing process of ... more This paper presents the method to estimate curing profile's parameters for curing process of Moisture Resistance Cyanate Ester (MRCE) based underfill used in Flip Chip Ceramic Ball Grid Array (FC-CBGA). The two steps curing profile was found to eliminate voids formation in underfill during curing process. The important parameters in two steps curing profile such as first fixed temperature and duration of second temperature rise were estimated by superimposed of cure initiation curve and weight percentage loss curve of underfill epoxy material. Differential Scanning Calorimeter (DSC) analysis was carried out to characterize the cure kinetics reaction of underfill epoxy and produced the cure initiation curve. Thermal Gravimetric Analysis (TGA) was performed to characterize the weight loss of underfill and produced the weight loss curve. It was estimated that the first fixed temperature and duration of second temperature rise for two steps curing profile were 100 oC and 60-80 minut...
Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)
2008 IEEE International Conference on Semiconductor Electronics, 2008
Abstract Electrically conductive adhesive (ECA) is a popular alternative to replace lead solder i... more Abstract Electrically conductive adhesive (ECA) is a popular alternative to replace lead solder interconnect material in most areas of electronic packaging. ECA mainly consists of an organic/polymeric binder matrix and metal filler. These composite materials provide both ...
The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA
2008 IEEE International Conference on Semiconductor Electronics, 2008
Abstract Five different types of clean flux and no-clean flux, which are mainly used in flip chip... more Abstract Five different types of clean flux and no-clean flux, which are mainly used in flip chip die attach, have been analyzed in respect to the wettability of eutectic solder bump in flip chip PBGA. An experimental study is carried out to measure the spreading area of the ...
Study of Lifetime Prediction of N-MOS Transistor Due to Hot Carrier Effect
2006 Conference on Optoelectronic and Microelectronic Materials and Devices, 2006
... Ahmad*, Zainudin Kornain, Mohd Faizul Md Idros* *National University of Malaysia Faculty of ... more ... Ahmad*, Zainudin Kornain, Mohd Faizul Md Idros* *National University of Malaysia Faculty of Engineering 43600, Bangi, Selangor, MALAYSIA Email : ibrahim@vlsi.eng ... [9] Shahrul Aman Mohd Saari, Mohd Rofei Mat Hussin, Ahmad Sabirin Zoolfakar and Dr. Mohd Rais Ahmad ...
An Optimization of Two-Steps Curing Profile to Eliminate Voids Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging
Advanced Materials Research, 2010
Underfilling is the preferred process to reduce the impact of the thermal stress that results fro... more Underfilling is the preferred process to reduce the impact of the thermal stress that results from the mismatch in the coefficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. Voids formation in underfill is considered as failure in flip chip manufacturing process. Voids formation possibly caused by several factors such as poor soldering and flux residue during die attach process, voids entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the optimization of two steps curing profile in order to reduce voids formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids after curing process. Statistic analysis was conducted to analyze the suitable curing profile in order to minimize or eliminate the voids formation. It was shown that the two steps curing profil...
Automated Car Braking System using Labview
2012 IEEE Symposium on Industrial Electronics and Applications, 2012
— This paper intends to represent the development of Automated Car Braking System using fuzzy log... more — This paper intends to represent the development of Automated Car Braking System using fuzzy logic for parking purpose. This project will involve replacing usual car reverse warning system to one application which it will react to the obstacle range and stop the car when it close to obstacle. To realize this application, this project will use Labview simulation software to create the fuzzy logic controller and present the simulation output.
Komitmen industri dalam membantu penyusunan program pembangunan dan kompetensi bagi memenuhi tuntutan negara
Telemedicine system: Development of wireless healthcare units with GSM and Bluetooth link
2012 Ieee Symposium on Industrial Electronics and Applications, Sep 1, 2012
Indonesian Journal of Electrical Engineering and Computer Science
This paper presents the classification of EMG signal for multiple hand gestures based on neural n... more This paper presents the classification of EMG signal for multiple hand gestures based on neural network. In this study, the Electromyography is used to measure the muscle cell’s electrical activities which is commonly represented in a function time. Every muscle has their own signals, which was produced in every movement. Surface electromyography (sEMG) is used as a non-invasive technique for acquiring the EMG signal. The development of sensors’ detection and measuring the EMG have been improved and have become more precise while maintaining a small size. In this paper, the main objective is to identify the hand gestures based on: (1) Cylindrical Grasp, (2) Supination (Twist Left), (3) Pronation (Twist Right), (4) Resting Hand and (5) Open Hand that are predefined by using Arduino IDE, CoolTerm software and Microsoft Excel before using artificial neural network for classifying purposes in MATLAB. Finally, the extraction of the EMG patterns for each movement went through features ext...
The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging
Key Engineering Materials, Apr 30, 2011
Underfilling is the vital process to reduce the impact of the thermal stress that results from th... more Underfilling is the vital process to reduce the impact of the thermal stress that results from the mismatch in the co-efficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. This paper reported the pattern of underfill’s hardness during curing process for large die Ceramic Flip Chip Ball Grid Array (FC-CBGA). A commercial amine based underfill epoxy was dispensed into HiCTE FC-CBGA and cured in curing oven under a new method of two-step curing profile. Nano-identation test was employed to investigate the hardness of underfill epoxy during curing steps. The result has shown the almost similar hardness of fillet area and centre of the package after cured which presented uniformity of curing states. The total curing time/cycle in production was potentially reduced due to no significant different of hardness after 60 min and 120 min during the period of second hold temperature.
American Journal of Engineering and Applied Sciences, 2010
Problem statement: This study mainly to study the effect of several commercial underfill material... more Problem statement: This study mainly to study the effect of several commercial underfill materials to the reliability of HiCTE Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to Accelerated Thermal Cycling (ATC) effect. Approach: The warpage condition of package, die back stress, interfacial die shear stress, and solder bump fatigue for different commercial underfills were assessed and compared via a commercial Finite Element Analysis (FEA) under JEDEC Standard of ATC. The thermo-mechanical properties of underfills for simulation were obtained by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA). The actual package of HiCTE FC-CBGA were assembled with those underfill materials and underwent ATC to be compared with FEA result. Results: The results from FEA and experimental were discussed to characterize the performance of each underfill material. The results of this study indicate that the underfill materials investigated, those with a glass transition temperature (Tg) and a Young ' s modulus of approximately above 105°C and 8-9 GPa, respectively, were appropriate for HiCTE FC-CBGA with high lead solder bumps. Conclusion: The result from FEA analysis and ATC reliability test found that the underfill materials with high and medium low Young's modulus has high reliability in FC-CBGA package.
International Journal of Engineering and Technology, 2013
2004 IEEE International Conference on Semiconductor Electronics, 2004
The effect of temperature change to electrical resistivity of Aluminum bond pad (Al pad) on die s... more The effect of temperature change to electrical resistivity of Aluminum bond pad (Al pad) on die surface of Under Bump Metallurgy (UBM) were discussed in this paper. Four categories of samples were involved in measurement; a sample without UBM and the samples with single, double and
The Investigation of Die Back Edge Cracking in Flip Chip Ceramic Ball Grid Array Package (FC-CBGA)
ABSTRACT
Implementation of novel reflow profile of no-clean fluxes to enhance flux stability and oxide layer removal of the high lead solder bump
Abstract Various retlow profiles have been applied on different no-clean tluxes amount in removin... more Abstract Various retlow profiles have been applied on different no-clean tluxes amount in removing the oxide layer of high lead solder blUnp. TIle wafers exposed to open air induce an oxide layer on the high lead solder bump. TItis oxide layer eventually creates the non wet ...
An approach on underfill material selection for the low-k Flip Chip Plastic Ball Grid Array (FCPBGA)
Abstract The role of underfill is expanding from preserving solder joint reliability to also prot... more Abstract The role of underfill is expanding from preserving solder joint reliability to also protecting fragile low-k chip dielectric layers in flip chip packaging. The aim of this study is to pre-evaluate or presume the reliability performance of several commercial underfill materials for the ...
Telemedicine system: Development of wireless healthcare units with GSM and Bluetooth link
2012 IEEE Symposium on Industrial Electronics and Applications, 2012
Automated car braking system: Using neural network system via Labview environment
2012 IEEE Conference on Open Systems, 2012
—This paper represents the development of a car braking system based on artificial neural network... more —This paper represents the development of a car braking system based on artificial neural network for use during parking. This project involves replacing the usual car reverse warning system with a system that will react automatically based on the distance between the car and a given obstacle by gradually increasing the braking pressure until such a point that is deemed the closest safe distance to the obstacle, in which the braking pressure will then be increased to max and the car will halt. To realize this application, this project will make use of LabView simulation software to create the artificial neural network engine and present the simulation results.
Advanced Materials Research, 2010
The possible source of die edge cracking for Flip Chip Ceramic Ball Grid Array (FC-CBGA) package ... more The possible source of die edge cracking for Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to thermal cycling have been investigated in this study. Finite Element Analysis (FEA) models were used to analyze the effect of underfill fillet geometry on interfacial stresses between die edge and the underfill fillet. The input parameters of FC-CBGA from industry was used for simulation and the properties of commercial underfill were extracted by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA). Die stress distribution for different fillet height were generated to depict variation of stress due thermal loading. The variation of tensile stress due different fillet height and width were discussed for parameters optimization.
The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging
Key Engineering Materials, 2011
Underfilling is the vital process to reduce the impact of the thermal stress that results from th... more Underfilling is the vital process to reduce the impact of the thermal stress that results from the mismatch in the co-efficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. This paper reported the pattern of underfill’s hardness during curing process for large die Ceramic Flip Chip Ball Grid Array (FC-CBGA). A commercial amine based underfill epoxy was dispensed into HiCTE FC-CBGA and cured in curing oven under a new method of two-step curing profile. Nano-identation test was employed to investigate the hardness of underfill epoxy during curing steps. The result has shown the almost similar hardness of fillet area and centre of the package after cured which presented uniformity of curing states. The total curing time/cycle in production was potentially reduced due to no significant different of hardness after 60 min and 120 min during the period of second hold temperature.
Estimation of Curing Profile's Parameters for Flip Chip Packaging Using DSC and TGA
Key Engineering Materials, 2011
This paper presents the method to estimate curing profile's parameters for curing process of ... more This paper presents the method to estimate curing profile's parameters for curing process of Moisture Resistance Cyanate Ester (MRCE) based underfill used in Flip Chip Ceramic Ball Grid Array (FC-CBGA). The two steps curing profile was found to eliminate voids formation in underfill during curing process. The important parameters in two steps curing profile such as first fixed temperature and duration of second temperature rise were estimated by superimposed of cure initiation curve and weight percentage loss curve of underfill epoxy material. Differential Scanning Calorimeter (DSC) analysis was carried out to characterize the cure kinetics reaction of underfill epoxy and produced the cure initiation curve. Thermal Gravimetric Analysis (TGA) was performed to characterize the weight loss of underfill and produced the weight loss curve. It was estimated that the first fixed temperature and duration of second temperature rise for two steps curing profile were 100 oC and 60-80 minut...
Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)
2008 IEEE International Conference on Semiconductor Electronics, 2008
Abstract Electrically conductive adhesive (ECA) is a popular alternative to replace lead solder i... more Abstract Electrically conductive adhesive (ECA) is a popular alternative to replace lead solder interconnect material in most areas of electronic packaging. ECA mainly consists of an organic/polymeric binder matrix and metal filler. These composite materials provide both ...
The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA
2008 IEEE International Conference on Semiconductor Electronics, 2008
Abstract Five different types of clean flux and no-clean flux, which are mainly used in flip chip... more Abstract Five different types of clean flux and no-clean flux, which are mainly used in flip chip die attach, have been analyzed in respect to the wettability of eutectic solder bump in flip chip PBGA. An experimental study is carried out to measure the spreading area of the ...
Study of Lifetime Prediction of N-MOS Transistor Due to Hot Carrier Effect
2006 Conference on Optoelectronic and Microelectronic Materials and Devices, 2006
... Ahmad*, Zainudin Kornain, Mohd Faizul Md Idros* *National University of Malaysia Faculty of ... more ... Ahmad*, Zainudin Kornain, Mohd Faizul Md Idros* *National University of Malaysia Faculty of Engineering 43600, Bangi, Selangor, MALAYSIA Email : ibrahim@vlsi.eng ... [9] Shahrul Aman Mohd Saari, Mohd Rofei Mat Hussin, Ahmad Sabirin Zoolfakar and Dr. Mohd Rais Ahmad ...
An Optimization of Two-Steps Curing Profile to Eliminate Voids Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging
Advanced Materials Research, 2010
Underfilling is the preferred process to reduce the impact of the thermal stress that results fro... more Underfilling is the preferred process to reduce the impact of the thermal stress that results from the mismatch in the coefficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. Voids formation in underfill is considered as failure in flip chip manufacturing process. Voids formation possibly caused by several factors such as poor soldering and flux residue during die attach process, voids entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the optimization of two steps curing profile in order to reduce voids formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids after curing process. Statistic analysis was conducted to analyze the suitable curing profile in order to minimize or eliminate the voids formation. It was shown that the two steps curing profil...
Automated Car Braking System using Labview
2012 IEEE Symposium on Industrial Electronics and Applications, 2012
— This paper intends to represent the development of Automated Car Braking System using fuzzy log... more — This paper intends to represent the development of Automated Car Braking System using fuzzy logic for parking purpose. This project will involve replacing usual car reverse warning system to one application which it will react to the obstacle range and stop the car when it close to obstacle. To realize this application, this project will use Labview simulation software to create the fuzzy logic controller and present the simulation output.