enwei qin - Academia.edu (original) (raw)

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D. Ponge

D. Ponge

Max Planck Institute for Iron Research

Rahul Mitra

Huajie  Yang

Dierk Raabe

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Papers by enwei qin

Research paper thumbnail of Enhanced fracture toughness of bulk nanocrystalline Cu with embedded nanoscale twins

Scripta Materialia, 2009

We report an enhanced fracture toughness of bulk Cu sample processed by dynamic plastic deformati... more We report an enhanced fracture toughness of bulk Cu sample processed by dynamic plastic deformation with a composite microstructure of nanoscale grains and embedded nanoscale twin bundles. The improvement in fracture toughness is mainly due to the embedded twin bundles which generate elongated deep fracture dimples that consume much higher fracture energy.

Research paper thumbnail of Enhanced fracture toughness and strength in bulk nanocrystalline Cu with nanoscale twin bundles

Acta Materialia, 2009

Bulk nanocrystalline pure Cu samples with embedded nanoscale twin bundles were prepared by means ... more Bulk nanocrystalline pure Cu samples with embedded nanoscale twin bundles were prepared by means of dynamic plastic deformation (DPD) at cryogenic temperature. By adjusting the DPD parameters, we increased the volume fraction of nanotwin bundles, resulting in an increase in both tensile strength and fracture toughness. The enhanced strength is attributed to the strengthening effect of the nanotwin bundles. The highly anisotropic nanotwin lamellar structures are found to be effective in energy absorption and arresting crack propagation during fracture. Coarse and deep dimples associated with obvious recrystallization underneath were detected in the fracture surfaces, owing to the presence of the nanotwin bundles. The enhancement of fracture toughness is closely correlated with the formation of these deep dimples.

Research paper thumbnail of Vickers Indentation Induced One-Way and Two-Way Shape Memory Effect in Austenitic NiTi

Advanced Engineering Materials, 2013

Research paper thumbnail of Enhanced fracture toughness of bulk nanocrystalline Cu with embedded nanoscale twins

Scripta Materialia, 2009

We report an enhanced fracture toughness of bulk Cu sample processed by dynamic plastic deformati... more We report an enhanced fracture toughness of bulk Cu sample processed by dynamic plastic deformation with a composite microstructure of nanoscale grains and embedded nanoscale twin bundles. The improvement in fracture toughness is mainly due to the embedded twin bundles which generate elongated deep fracture dimples that consume much higher fracture energy.

Research paper thumbnail of Enhanced fracture toughness and strength in bulk nanocrystalline Cu with nanoscale twin bundles

Acta Materialia, 2009

Bulk nanocrystalline pure Cu samples with embedded nanoscale twin bundles were prepared by means ... more Bulk nanocrystalline pure Cu samples with embedded nanoscale twin bundles were prepared by means of dynamic plastic deformation (DPD) at cryogenic temperature. By adjusting the DPD parameters, we increased the volume fraction of nanotwin bundles, resulting in an increase in both tensile strength and fracture toughness. The enhanced strength is attributed to the strengthening effect of the nanotwin bundles. The highly anisotropic nanotwin lamellar structures are found to be effective in energy absorption and arresting crack propagation during fracture. Coarse and deep dimples associated with obvious recrystallization underneath were detected in the fracture surfaces, owing to the presence of the nanotwin bundles. The enhancement of fracture toughness is closely correlated with the formation of these deep dimples.

Research paper thumbnail of Vickers Indentation Induced One-Way and Two-Way Shape Memory Effect in Austenitic NiTi

Advanced Engineering Materials, 2013

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