istvan novak - Academia.edu (original) (raw)

Papers by istvan novak

Research paper thumbnail of Statistical analysis of high-accuracy measurement of radio-frequency carrier signals from DFT spectra

Conference on Precision Electromagnetic Measurements

Research paper thumbnail of Calculating partial inductance of vias for printed circuit board modeling

Electrical Performance of Electronic Packaging,, 2000

Page 1. Calculating Partial Inductance of Vias for Printed Circuit Board Modeling Jason R. Miller... more Page 1. Calculating Partial Inductance of Vias for Printed Circuit Board Modeling Jason R. Miller', Istvan Novak', Tai-yu Chou2 'Sun Microsystems, 1 Network Drive, Burlington, MA 01803 Tel: (78 1) 442-2774, Fax: (78 1) 442-2246 ...

Research paper thumbnail of Impact of PCB laminate parameters on suppressing modal resonances

Page 1. Jason R. Miller, Gustavo Blando, Barry Williams, Istvan Novak 1 Impact of PCB Laminate Pa... more Page 1. Jason R. Miller, Gustavo Blando, Barry Williams, Istvan Novak 1 Impact of PCB Laminate Parameters on Suppressing Modal Resonances February 5, 2008 Page 2. 2 • Introduction • Simulation methodology • Impact of > Dielectric thickness > Conductor thickness ...

Research paper thumbnail of Direct plane attachment for capacitors

Research paper thumbnail of Method and apparatus for reducing capacitively coupled radio frequency energy between a semiconductor device and an adjacent metal structure

Research paper thumbnail of Method and apparatus for reducing electrical resonances in power and noise propagation in power distribution circuits employing plane conductors

Research paper thumbnail of Power integrity circuits with EMI benefits

Research paper thumbnail of System and method for testing integrated passive components in a printed circuit board

Research paper thumbnail of Wideband bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure

Research paper thumbnail of System and Method for Edge Termination of Parallel Conductive Planes in an Electrical Interconnecting Apparatus

Research paper thumbnail of Bypass Capacitor Methods for Achieving a Desired Value of Electrical Impedance Between Parallel Planar Conductors of an Electrical Power Distribution Structure, and Associated Electrical Power Distribution Structures

Research paper thumbnail of Accuracy considerations of power-ground plane models

Ieee 8th Topical Meeting on Electrical Performance of Electronic Packaging, Feb 1, 1999

Research paper thumbnail of Modeling the impact of power/ground via arrays on power delivery

Electrical Performance of Electronic Packaging 2004, Nov 25, 2004

Research paper thumbnail of Printed circuit board employing lossy power distribution network to reduce power plane resonances

Research paper thumbnail of Method for adaptive sub-gridding for power/ground plane simulations

Research paper thumbnail of Coarse and fine search methods to identify and measure noisy sinusoidal signals in a spectrum-monitoring system

1991 Conference Record Ieee Instrumentation and Measurement Technology Conference, May 14, 1991

Research paper thumbnail of Method and apparatus for distributing power to integrated circuits

Research paper thumbnail of Method for edge termination of parallel conductive planes including estimating the characteristic impedance of the structure

Research paper thumbnail of Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conducts of an electrical power distribution structure

Research paper thumbnail of Adding electrical resistance in series with bypass capacitors using annular resistors

Research paper thumbnail of Statistical analysis of high-accuracy measurement of radio-frequency carrier signals from DFT spectra

Conference on Precision Electromagnetic Measurements

Research paper thumbnail of Calculating partial inductance of vias for printed circuit board modeling

Electrical Performance of Electronic Packaging,, 2000

Page 1. Calculating Partial Inductance of Vias for Printed Circuit Board Modeling Jason R. Miller... more Page 1. Calculating Partial Inductance of Vias for Printed Circuit Board Modeling Jason R. Miller', Istvan Novak', Tai-yu Chou2 'Sun Microsystems, 1 Network Drive, Burlington, MA 01803 Tel: (78 1) 442-2774, Fax: (78 1) 442-2246 ...

Research paper thumbnail of Impact of PCB laminate parameters on suppressing modal resonances

Page 1. Jason R. Miller, Gustavo Blando, Barry Williams, Istvan Novak 1 Impact of PCB Laminate Pa... more Page 1. Jason R. Miller, Gustavo Blando, Barry Williams, Istvan Novak 1 Impact of PCB Laminate Parameters on Suppressing Modal Resonances February 5, 2008 Page 2. 2 • Introduction • Simulation methodology • Impact of > Dielectric thickness > Conductor thickness ...

Research paper thumbnail of Direct plane attachment for capacitors

Research paper thumbnail of Method and apparatus for reducing capacitively coupled radio frequency energy between a semiconductor device and an adjacent metal structure

Research paper thumbnail of Method and apparatus for reducing electrical resonances in power and noise propagation in power distribution circuits employing plane conductors

Research paper thumbnail of Power integrity circuits with EMI benefits

Research paper thumbnail of System and method for testing integrated passive components in a printed circuit board

Research paper thumbnail of Wideband bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure

Research paper thumbnail of System and Method for Edge Termination of Parallel Conductive Planes in an Electrical Interconnecting Apparatus

Research paper thumbnail of Bypass Capacitor Methods for Achieving a Desired Value of Electrical Impedance Between Parallel Planar Conductors of an Electrical Power Distribution Structure, and Associated Electrical Power Distribution Structures

Research paper thumbnail of Accuracy considerations of power-ground plane models

Ieee 8th Topical Meeting on Electrical Performance of Electronic Packaging, Feb 1, 1999

Research paper thumbnail of Modeling the impact of power/ground via arrays on power delivery

Electrical Performance of Electronic Packaging 2004, Nov 25, 2004

Research paper thumbnail of Printed circuit board employing lossy power distribution network to reduce power plane resonances

Research paper thumbnail of Method for adaptive sub-gridding for power/ground plane simulations

Research paper thumbnail of Coarse and fine search methods to identify and measure noisy sinusoidal signals in a spectrum-monitoring system

1991 Conference Record Ieee Instrumentation and Measurement Technology Conference, May 14, 1991

Research paper thumbnail of Method and apparatus for distributing power to integrated circuits

Research paper thumbnail of Method for edge termination of parallel conductive planes including estimating the characteristic impedance of the structure

Research paper thumbnail of Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conducts of an electrical power distribution structure

Research paper thumbnail of Adding electrical resistance in series with bypass capacitors using annular resistors