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… Symposium, 2004. IEEE/ …, 2004
Gold Wire Bonding on Low-K Material A New Challenge for Interconnection Technology Ralph Binner A... more Gold Wire Bonding on Low-K Material A New Challenge for Interconnection Technology Ralph Binner Andreas Schopper ESEC (Asia Pacific) Pte Ltd Jimmy Castaneda SPT Asia Pte. Ltd 1. Introduction The gold wire bond technology is still widely used in back end assembly. ...
… Symposium, 2004. IEEE/ …, 2004
Gold Wire Bonding on Low-K Material A New Challenge for Interconnection Technology Ralph Binner A... more Gold Wire Bonding on Low-K Material A New Challenge for Interconnection Technology Ralph Binner Andreas Schopper ESEC (Asia Pacific) Pte Ltd Jimmy Castaneda SPT Asia Pte. Ltd 1. Introduction The gold wire bond technology is still widely used in back end assembly. ...