tatiparti padma - Academia.edu (original) (raw)

Papers by tatiparti padma

2023 2nd International Conference on Applied Artificial Intelligence and Computing (ICAAIC)

F1000Research

Ionosphere is the highest contributor of positional error in Global Navigation Satellite System (... more Ionosphere is the highest contributor of positional error in Global Navigation Satellite System (GNSS) owing to the trans-ionospheric signal delay, distortion and possible outage. Equatorial and Low latitudinal ionosphere experiences frequent perturbations in plasma density most of which is due to the presence of Equatorial Plasma Bubbles (EPBs). In order to improve positional and navigational precision of GNSS signals, EPBs must be identified and corrected. EPBs begin to manifest post-sunset and continue to thrive past midnight. This paper proposes a Rate of TEC Index (ROTI) based EPB identifier using single frequency GNSS receiver data. GNSS data has been collected from the archives of Scripps Orbit and Permanent Array Center (SOPAC). The raw data has been downloaded from the global continuous network station, IISC, located at Bangalore (13.0219°N, 77.5671°E) in Receiver Independent Exchange (RINEX) format. Analysis of EPB occurrence has been carried out for six consecutive years ...

Nanomaterials, 2022

In this work, MoSe2-WS2 nanocomposites consisting of WS2 nanoparticles covered with few MoSe2 nan... more In this work, MoSe2-WS2 nanocomposites consisting of WS2 nanoparticles covered with few MoSe2 nanosheets were successfully developed via an easy hydrothermal synthesis method. Their nanostructure and photocatalytic hydrogen evolution (PHE) performance are investigated by a series of characterization techniques. The PHE rate of MoSe2-WS2 is evaluated under the white light LED irradiation. Under LED illumination, the highest PHE of MoSe2-WS2 nanocomposite is 1600.2 µmol g−1 h−1. When compared with pristine WS2, the MoSe2-WS2 nanostructures demonstrated improved PHE rate, which is 10-fold higher than that of the pristine one. This work suggests that MoSe2-WS2 could be a promising photocatalyst candidate and might stimulate the further studies of other layered materials for energy conversion and storage.

Large organizations that deal with massive BigData has become a challenging task to process with ... more Large organizations that deal with massive BigData has become a challenging task to process with advanced technologies. Many IoT industries manifest the interrelationship among large organizations mostly with healthcare sectors which advances in the well-being of trendy society based systems, functions, and modern manufacturing tendencies. IoT placed its importance in remote medical organizations scrutinizing format that generates unceasing data on the web information regarding the physiological situations of a patient. This paper uses are fined collective network model to drop protection risks and examine how phenomenal wearable gadgets are prodigious in science and intelligent technology. Insurance policies from various IoT and eHealth regulations discover the perspectives of economics and society needs regarding endless prosperity and yields expected out come in research step in Big Data concerning physical disorders and threats which are more beneficial in healthcare contexts. T...

2018 International Conference on Recent Innovations in Electrical, Electronics & Communication Engineering (ICRIEECE), 2018

An Epileptic Seizure is a sudden and uncontrolled symptom originated in brain. They could be due ... more An Epileptic Seizure is a sudden and uncontrolled symptom originated in brain. They could be due to abnormal electrical activity start in brain for very brief period and also recurring seizures due to a brain disorder. Therefore during the event there is an effect due to bumps, cuts /bruises are commonly observed occurrences. The effect of injuries are seriously caused due to falling and losing alertness or realization during or after a seizure, for instance a broken bone or injury. This project used an Arduino based airbag protection system for the people suffering from seizures by using an accelerometer, which will detect the fall of the person and triggers the airbag. A push pull solenoid is used to puncture a canister that is present in the airbag. A relay is used to operate the solenoid. When the fall is detected, the Arduino will trigger the airbag. This project helps the people who are suffering from epilepsy and protect them from injuries. This project objectives to design a...

This paper presents a novel approach in the estimation of noninvasive haemoglobin concentration. ... more This paper presents a novel approach in the estimation of noninvasive haemoglobin concentration. The proposed method in the paper involves both hardware and software. The hardware part is used for the implementation of the non-invasive haemoglobin measurement using Photo-plethysmography (PPG) principle. The PPG signals are acquired by illuminating an extremity such as a finger with monochromatic light at a certain given wavelength. In the proposed method the haemoglobin is measured at the tip of any finger, an Infrared LED and a Red LED are used as a light source and a photodiode is used for detecting the absorbed light. The empirical equation for calculation of hemoglobin content in blood is derived using a model for attenuation of light through skin-tissue-blood in that extremity, using well known extinction coefficients of hemoglobin (with and without oxygen). Further analysis of the obtained signal is done using software methods like signal processing and filtering. The conclusi...

Materials Today: Proceedings, 2020

Through-silicon-via (TSV) technology has emerged as the key technology to enable 3D IC integratio... more Through-silicon-via (TSV) technology has emerged as the key technology to enable 3D IC integration. 3D integration is seen as the leading candidate, which can help in sustaining Moore's Law to future IC technology nodes. It clearly set a benchmark to the IC industry due to its tremendous benefits in performance, data bandwidth, and supports heterogeneous integration. In 3D IC structure TSV's are used to carry the overall electrical signal between the layers. The major drawback in the TSV based 3D integration is noise coupling between aggressive (electrical signal carrying TSV; ETSV) and victim TSV's (ground). It can be reduced by creating very good isolation between TSV's and Si substrate by using different liner materials around TSV's. In this work, we have addressed various TSV models to reduce noise coupling between the TSV's. The models we have studied are single layer model and stacked layers of liner model. Apart from this we have studied how the core materials in the TSV reduces noise coupling between aggressive and victim TSV's. Also, we have shown the high frequency study for proposed models. Finally, our work shows single layer model with Crystalline-Germanium is comparably better noise coupling reduction even at higher frequency.

Materials Today: Proceedings, 2020

3D Integration technology is probably the best methodologies among others which suits CMOS applic... more 3D Integration technology is probably the best methodologies among others which suits CMOS applications with in various layers of devices are stacked with high thickness interconnects between the layers. In 3D IC structure electrical and thermal models are introduced for the interface between Through-Silicon-Via's (TSV's). TSV's can be used to enable the 3-D platform; however this TSV's will represent additional concerns. TSV-to-substrate and TSV-to-TSV noise coupling is assessed inside the 3-D IC's. A vertical TSV's design is proposed to reduce the area per TSV, capacitive coupling and effective inductance as compared with the other classical design patterns. TSV's and substrate noise coupling is one of the major drawbacks in 3D IC. Some of the researchers have tried to overcome the problems in TSV based 3D IC due to noise coupling using different models, materials and different circuit techniques. This paper shows the complete road map for the noise coupling reduction in future IC integration.

Materials Today: Proceedings, 2020

Semiconductor Industries are mainly facing problems by using planar integration (2D IC) in order ... more Semiconductor Industries are mainly facing problems by using planar integration (2D IC) in order to overcome the paradigm shift has been adopted as vertical IC integration so called 3D IC. It not only provides higher bandwidth, higher system performance, but also consumes less power with system scaling. 3D IC has an ability to coordinate IC chips by stacking them vertically and electrically associated utilizing TSV's (Through Silicon Via). By utilizing TSV's in 3D IC, TSV noise coupling is one of the vital factors for the system performance aspects. TSV's play major role in carrying the electrical signal between the IC's of 3D integrated structures. Noise coupling is the major drawback between the signal carrying TSV's (ETSV) and victim TSV's. In this work, we have shown better electrical integrity by reducing the noise coupling from TSV to Silicon substrate by essentially changing the CMOS compatible dielectric materials as liner structures. In addition to this performance of various proposed structures are analyzed and verified under different parameters like electrical signal and at high frequencies. Also, the noise coupling analysis has been studied for Electrical TSV's (ETSV), TTSV (Thermal Through Silicon Via) and heat source. Finally, our work shows liner material Teflon AF1600 shows comparably better noise coupling performance for all the proposed models even at higher frequencies like THz.

Materials Today: Proceedings, 2020

Thermal through silicon via (TTSV) and heat spreaders plays a vital role in heat management in 3-... more Thermal through silicon via (TTSV) and heat spreaders plays a vital role in heat management in 3-Dimentional IC integration. However in recent years FIN to TTSV and heat spreaders has proposed to detects and spread heat in any one direction which leads to the damage of an integration circuit (IC). This paper proposes a FIN with optimal directions and heat spreaders to spread the heat in various directions and finally the heat absorb towards heat sink effectively. In this work, we have also demonstrated various thermal cooling effects and its impact on the distribution of potential across IC at different conditions. We have studied these using FEM Simulator for (1) 3D IC architecture with FIN and heat spreaders using Graphene and CNT material, (2) TTSV with FIN and heat spreaders of Graphene, (3) TTSV with fin and heat spreaders of CNT, (4) TTSV with FIN direction towards heat source made of Graphene and CNT, and (5) TTSV with FIN direction towards TSV made of CNT and Graphene. Our result shows that CNT has better thermal cooling management towards heat source as well TSVs than Graphene with order greater than 100 Kelvin.

International Journal of Research in Engineering and Technology, 2014

The most commonly used technique to record the bioelectric current generated by the heart is Elec... more The most commonly used technique to record the bioelectric current generated by the heart is Electrocardiogram. It is a simple, painless and valuable test done by placing the surface electrodes at the predetermined locations on the surface of the heart. It is a composite signal consisting of P, QRS, T and U waves, vital information related to arrhythmias (heart rhythm abnormalities) can be extracted from intervals and segments of these waves. The present study includes the development of an algorithm which preprocesses and automatically extracts the features of an ECG signal using wavelet transformation. As Wavelets provide both temporal and spatial information simultaneously and offers flexibility with the choice of wavelet functions with different properties. The initial step of the algorithm includes pre-processing of the signal in order to remove noise from the signal (denoising) and then uses the pre-processed signal for feature extraction. The accuracy of the analysis is increased and also the analysis time is reduced by using this algorithm.

IFMBE Proceedings

In this paper, learning vector quantization artificial neural network method was used for designi... more In this paper, learning vector quantization artificial neural network method was used for designing decision support system for Electrocardiogram (ECG) analysis. Four types of ECG patterns were chosen from the data obtained from ECG simulator device to be recognized, ...

2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2011

Wireless sensor network (WSN) is the prominent way as one of the auspicious domain. It is collect... more Wireless sensor network (WSN) is the prominent way as one of the auspicious domain. It is collection of motes that are equipped with wireless interfaces, small scalable having sensing capabilities. These sensors have restricted processing and computing resources. The main concern of this research work is to provide a brief idea of recent proposed algorithms by applying optimization technique using genetic algorithm is described after contemplating on their communication architecture, various applications, challenges, routing protocols and clustering particularly designed for efficient energy consumption and frame stable network.

Journal of Biomedical Science and Engineering, 2009

It is often very difficult for the patient to tell the difference between angina symptoms and hea... more It is often very difficult for the patient to tell the difference between angina symptoms and heart attack symptoms, so it is very important to recognize the signs of heart attack and immediately seek medical attention. A practical case of this type of remote consultation is examined in this paper. To deal with the huge amount of electrocardiogram (ECG) data for analysis, storage and transmission; an efficient ECG compression technique is needed to reduce the amount of data as much as possible while preserving the clinical significant signal for cardiac diagnosis. Here the ECG signal is analyzed for various parameters such as heart rate, QRS-width, etc. Then the various parameters and the compressed signal can be transmitted with less channel capacity. Comparison of various ECG compression techniques like TURNING POINT, AZTEC, CORTES, FFT and DCT it was found that DCT is the best suitable compression technique with compression ratio of about 100:1. In addition, different techniques are available for implementation of hardware components for signal pickup the virtual implementation with labview is also used for analysis of various cardiac parameters and to identify the abnormalities like Tachycardia, Bradycardia, AV Block, etc. Both hardware and virtual implementation are also detailed in this context.

2023 2nd International Conference on Applied Artificial Intelligence and Computing (ICAAIC)

F1000Research

Ionosphere is the highest contributor of positional error in Global Navigation Satellite System (... more Ionosphere is the highest contributor of positional error in Global Navigation Satellite System (GNSS) owing to the trans-ionospheric signal delay, distortion and possible outage. Equatorial and Low latitudinal ionosphere experiences frequent perturbations in plasma density most of which is due to the presence of Equatorial Plasma Bubbles (EPBs). In order to improve positional and navigational precision of GNSS signals, EPBs must be identified and corrected. EPBs begin to manifest post-sunset and continue to thrive past midnight. This paper proposes a Rate of TEC Index (ROTI) based EPB identifier using single frequency GNSS receiver data. GNSS data has been collected from the archives of Scripps Orbit and Permanent Array Center (SOPAC). The raw data has been downloaded from the global continuous network station, IISC, located at Bangalore (13.0219°N, 77.5671°E) in Receiver Independent Exchange (RINEX) format. Analysis of EPB occurrence has been carried out for six consecutive years ...

Nanomaterials, 2022

In this work, MoSe2-WS2 nanocomposites consisting of WS2 nanoparticles covered with few MoSe2 nan... more In this work, MoSe2-WS2 nanocomposites consisting of WS2 nanoparticles covered with few MoSe2 nanosheets were successfully developed via an easy hydrothermal synthesis method. Their nanostructure and photocatalytic hydrogen evolution (PHE) performance are investigated by a series of characterization techniques. The PHE rate of MoSe2-WS2 is evaluated under the white light LED irradiation. Under LED illumination, the highest PHE of MoSe2-WS2 nanocomposite is 1600.2 µmol g−1 h−1. When compared with pristine WS2, the MoSe2-WS2 nanostructures demonstrated improved PHE rate, which is 10-fold higher than that of the pristine one. This work suggests that MoSe2-WS2 could be a promising photocatalyst candidate and might stimulate the further studies of other layered materials for energy conversion and storage.

Large organizations that deal with massive BigData has become a challenging task to process with ... more Large organizations that deal with massive BigData has become a challenging task to process with advanced technologies. Many IoT industries manifest the interrelationship among large organizations mostly with healthcare sectors which advances in the well-being of trendy society based systems, functions, and modern manufacturing tendencies. IoT placed its importance in remote medical organizations scrutinizing format that generates unceasing data on the web information regarding the physiological situations of a patient. This paper uses are fined collective network model to drop protection risks and examine how phenomenal wearable gadgets are prodigious in science and intelligent technology. Insurance policies from various IoT and eHealth regulations discover the perspectives of economics and society needs regarding endless prosperity and yields expected out come in research step in Big Data concerning physical disorders and threats which are more beneficial in healthcare contexts. T...

2018 International Conference on Recent Innovations in Electrical, Electronics & Communication Engineering (ICRIEECE), 2018

An Epileptic Seizure is a sudden and uncontrolled symptom originated in brain. They could be due ... more An Epileptic Seizure is a sudden and uncontrolled symptom originated in brain. They could be due to abnormal electrical activity start in brain for very brief period and also recurring seizures due to a brain disorder. Therefore during the event there is an effect due to bumps, cuts /bruises are commonly observed occurrences. The effect of injuries are seriously caused due to falling and losing alertness or realization during or after a seizure, for instance a broken bone or injury. This project used an Arduino based airbag protection system for the people suffering from seizures by using an accelerometer, which will detect the fall of the person and triggers the airbag. A push pull solenoid is used to puncture a canister that is present in the airbag. A relay is used to operate the solenoid. When the fall is detected, the Arduino will trigger the airbag. This project helps the people who are suffering from epilepsy and protect them from injuries. This project objectives to design a...

This paper presents a novel approach in the estimation of noninvasive haemoglobin concentration. ... more This paper presents a novel approach in the estimation of noninvasive haemoglobin concentration. The proposed method in the paper involves both hardware and software. The hardware part is used for the implementation of the non-invasive haemoglobin measurement using Photo-plethysmography (PPG) principle. The PPG signals are acquired by illuminating an extremity such as a finger with monochromatic light at a certain given wavelength. In the proposed method the haemoglobin is measured at the tip of any finger, an Infrared LED and a Red LED are used as a light source and a photodiode is used for detecting the absorbed light. The empirical equation for calculation of hemoglobin content in blood is derived using a model for attenuation of light through skin-tissue-blood in that extremity, using well known extinction coefficients of hemoglobin (with and without oxygen). Further analysis of the obtained signal is done using software methods like signal processing and filtering. The conclusi...

Materials Today: Proceedings, 2020

Through-silicon-via (TSV) technology has emerged as the key technology to enable 3D IC integratio... more Through-silicon-via (TSV) technology has emerged as the key technology to enable 3D IC integration. 3D integration is seen as the leading candidate, which can help in sustaining Moore's Law to future IC technology nodes. It clearly set a benchmark to the IC industry due to its tremendous benefits in performance, data bandwidth, and supports heterogeneous integration. In 3D IC structure TSV's are used to carry the overall electrical signal between the layers. The major drawback in the TSV based 3D integration is noise coupling between aggressive (electrical signal carrying TSV; ETSV) and victim TSV's (ground). It can be reduced by creating very good isolation between TSV's and Si substrate by using different liner materials around TSV's. In this work, we have addressed various TSV models to reduce noise coupling between the TSV's. The models we have studied are single layer model and stacked layers of liner model. Apart from this we have studied how the core materials in the TSV reduces noise coupling between aggressive and victim TSV's. Also, we have shown the high frequency study for proposed models. Finally, our work shows single layer model with Crystalline-Germanium is comparably better noise coupling reduction even at higher frequency.

Materials Today: Proceedings, 2020

3D Integration technology is probably the best methodologies among others which suits CMOS applic... more 3D Integration technology is probably the best methodologies among others which suits CMOS applications with in various layers of devices are stacked with high thickness interconnects between the layers. In 3D IC structure electrical and thermal models are introduced for the interface between Through-Silicon-Via's (TSV's). TSV's can be used to enable the 3-D platform; however this TSV's will represent additional concerns. TSV-to-substrate and TSV-to-TSV noise coupling is assessed inside the 3-D IC's. A vertical TSV's design is proposed to reduce the area per TSV, capacitive coupling and effective inductance as compared with the other classical design patterns. TSV's and substrate noise coupling is one of the major drawbacks in 3D IC. Some of the researchers have tried to overcome the problems in TSV based 3D IC due to noise coupling using different models, materials and different circuit techniques. This paper shows the complete road map for the noise coupling reduction in future IC integration.

Materials Today: Proceedings, 2020

Semiconductor Industries are mainly facing problems by using planar integration (2D IC) in order ... more Semiconductor Industries are mainly facing problems by using planar integration (2D IC) in order to overcome the paradigm shift has been adopted as vertical IC integration so called 3D IC. It not only provides higher bandwidth, higher system performance, but also consumes less power with system scaling. 3D IC has an ability to coordinate IC chips by stacking them vertically and electrically associated utilizing TSV's (Through Silicon Via). By utilizing TSV's in 3D IC, TSV noise coupling is one of the vital factors for the system performance aspects. TSV's play major role in carrying the electrical signal between the IC's of 3D integrated structures. Noise coupling is the major drawback between the signal carrying TSV's (ETSV) and victim TSV's. In this work, we have shown better electrical integrity by reducing the noise coupling from TSV to Silicon substrate by essentially changing the CMOS compatible dielectric materials as liner structures. In addition to this performance of various proposed structures are analyzed and verified under different parameters like electrical signal and at high frequencies. Also, the noise coupling analysis has been studied for Electrical TSV's (ETSV), TTSV (Thermal Through Silicon Via) and heat source. Finally, our work shows liner material Teflon AF1600 shows comparably better noise coupling performance for all the proposed models even at higher frequencies like THz.

Materials Today: Proceedings, 2020

Thermal through silicon via (TTSV) and heat spreaders plays a vital role in heat management in 3-... more Thermal through silicon via (TTSV) and heat spreaders plays a vital role in heat management in 3-Dimentional IC integration. However in recent years FIN to TTSV and heat spreaders has proposed to detects and spread heat in any one direction which leads to the damage of an integration circuit (IC). This paper proposes a FIN with optimal directions and heat spreaders to spread the heat in various directions and finally the heat absorb towards heat sink effectively. In this work, we have also demonstrated various thermal cooling effects and its impact on the distribution of potential across IC at different conditions. We have studied these using FEM Simulator for (1) 3D IC architecture with FIN and heat spreaders using Graphene and CNT material, (2) TTSV with FIN and heat spreaders of Graphene, (3) TTSV with fin and heat spreaders of CNT, (4) TTSV with FIN direction towards heat source made of Graphene and CNT, and (5) TTSV with FIN direction towards TSV made of CNT and Graphene. Our result shows that CNT has better thermal cooling management towards heat source as well TSVs than Graphene with order greater than 100 Kelvin.

International Journal of Research in Engineering and Technology, 2014

The most commonly used technique to record the bioelectric current generated by the heart is Elec... more The most commonly used technique to record the bioelectric current generated by the heart is Electrocardiogram. It is a simple, painless and valuable test done by placing the surface electrodes at the predetermined locations on the surface of the heart. It is a composite signal consisting of P, QRS, T and U waves, vital information related to arrhythmias (heart rhythm abnormalities) can be extracted from intervals and segments of these waves. The present study includes the development of an algorithm which preprocesses and automatically extracts the features of an ECG signal using wavelet transformation. As Wavelets provide both temporal and spatial information simultaneously and offers flexibility with the choice of wavelet functions with different properties. The initial step of the algorithm includes pre-processing of the signal in order to remove noise from the signal (denoising) and then uses the pre-processed signal for feature extraction. The accuracy of the analysis is increased and also the analysis time is reduced by using this algorithm.

IFMBE Proceedings

In this paper, learning vector quantization artificial neural network method was used for designi... more In this paper, learning vector quantization artificial neural network method was used for designing decision support system for Electrocardiogram (ECG) analysis. Four types of ECG patterns were chosen from the data obtained from ECG simulator device to be recognized, ...

2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2011

Wireless sensor network (WSN) is the prominent way as one of the auspicious domain. It is collect... more Wireless sensor network (WSN) is the prominent way as one of the auspicious domain. It is collection of motes that are equipped with wireless interfaces, small scalable having sensing capabilities. These sensors have restricted processing and computing resources. The main concern of this research work is to provide a brief idea of recent proposed algorithms by applying optimization technique using genetic algorithm is described after contemplating on their communication architecture, various applications, challenges, routing protocols and clustering particularly designed for efficient energy consumption and frame stable network.

Journal of Biomedical Science and Engineering, 2009

It is often very difficult for the patient to tell the difference between angina symptoms and hea... more It is often very difficult for the patient to tell the difference between angina symptoms and heart attack symptoms, so it is very important to recognize the signs of heart attack and immediately seek medical attention. A practical case of this type of remote consultation is examined in this paper. To deal with the huge amount of electrocardiogram (ECG) data for analysis, storage and transmission; an efficient ECG compression technique is needed to reduce the amount of data as much as possible while preserving the clinical significant signal for cardiac diagnosis. Here the ECG signal is analyzed for various parameters such as heart rate, QRS-width, etc. Then the various parameters and the compressed signal can be transmitted with less channel capacity. Comparison of various ECG compression techniques like TURNING POINT, AZTEC, CORTES, FFT and DCT it was found that DCT is the best suitable compression technique with compression ratio of about 100:1. In addition, different techniques are available for implementation of hardware components for signal pickup the virtual implementation with labview is also used for analysis of various cardiac parameters and to identify the abnormalities like Tachycardia, Bradycardia, AV Block, etc. Both hardware and virtual implementation are also detailed in this context.