Paul P Conway | Loughborough University (original) (raw)
Papers by Paul P Conway
Mechanical Systems and Signal Processing, 2019
2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015
Proceedings - Electronic Components and Technology Conference, 2006
Computational Materials Science, 2008
CIRP Annals - Manufacturing Technology, 1991
ABSTRACT This paper presents a number of numerical process models of the infra-red reflow solderi... more ABSTRACT This paper presents a number of numerical process models of the infra-red reflow soldering process, the major joining process for surface mount assemblies. The aim of this work is to investigate the key process and design variables and their effect on joint quality in the final assembly. The paper includes models of a bare printed circuit board and “J” and “Gull-Wing” leaded components on a printed circuit board all passing through an infra-red oven. The process models are based and I-DEAS modeling suite and TMG thermal solver and are likely to find application in process design.
Applied Mechanics and Materials, 2006
Page 1. Analysis of Stress Distribution in SnAgCu Solder Joint J. Gong a , C. Liu b , PP Conway c... more Page 1. Analysis of Stress Distribution in SnAgCu Solder Joint J. Gong a , C. Liu b , PP Conway c and VV Silberschmidt d Wolfson School of Mechanical and Manufacturing Engineering Loughborough University, Loughborough, LE11 3TU, UK ...
Chinese Science Bulletin, 2013
Scripta Materialia, 2009
ABSTRACT
Journal of Electronic Packaging
Thermal stress-induced protrusions of copper through-silicon-vias (Cu-TSVs) during thermal proces... more Thermal stress-induced protrusions of copper through-silicon-vias (Cu-TSVs) during thermal processing pose substantial reliability concerns in three-dimensional system integration. In this study, a phase-field-crystal model is used to investigate the protrusions and microstructural evolutions of blind Cu-TSVs under different loading conditions. Protrusions are observed only when the TSVs are under varepsilonx\varepsilon_xvarepsilonx, varepsilony\varepsilon_yvarepsilony and gammaxy\gamma_{xy}gammaxy, whereas no protrusions are observed when the TSVs are subjected to pure shear strains gammayx\gamma_{yx}gammayx. The simulation results suggest that the grains in the top layer of a TSV contribute more to both the protrusion profile and the protrusion height than the grains in the lower layers. Moreover, the protrusion is larger when the misorientation among the grains is larger and the grain size along the yyy-direction is smaller. In addition, a phenomenological model linking protrusion and microstructural factors and a visual guide from the viewpo...
18Th European Microelectronics Packaging Conference, 2011
... Olivia M Flahertyl, Xiaoyun Cuil, Divya Rajamohan2, David Anderson2, David Huttl, Chris Denni... more ... Olivia M Flahertyl, Xiaoyun Cuil, Divya Rajamohan2, David Anderson2, David Huttl, Chris Denning2, Paul P Conwayl, Andrew A Westl ... SA Wilson, RPJ Jourdain, Q. Zhang, RA Dorey, CR Bowen, M. Willander, QU Wahab, SM Al-hilli, O. Nur, E. Quandt, C. Johansson, E. Pagounis ...
There is an increasing interest in Multi-Electrode Array (MEA) technology arising from a diversit... more There is an increasing interest in Multi-Electrode Array (MEA) technology arising from a diversity of bio-scientific areas, which is especially strong in stem cell, drug discovery or safety pharmacology applications. There are limitations in the quantity of useful data captured during an MEA-based trial that can be attributed to reasons such as the time intensive nature of MEA application, the
2014 Ieee 16th Electronics Packaging Technology Conference, Dec 1, 2014
... (2009) Publisher: EUROSIS-ETI Publications, Pages: 79-85. ... Sign up today, find more releva... more ... (2009) Publisher: EUROSIS-ETI Publications, Pages: 79-85. ... Sign up today, find more relevant papers and organise your research all in one place. First name. Last name. E-mail address. ...or sign in with Facebook. Readership Statistics. ...
IEEE Transactions on Device and Materials Reliability, 2014
International Symposium on Microelectronics, 2013
Mechanical Systems and Signal Processing, 2019
2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015
Proceedings - Electronic Components and Technology Conference, 2006
Computational Materials Science, 2008
CIRP Annals - Manufacturing Technology, 1991
ABSTRACT This paper presents a number of numerical process models of the infra-red reflow solderi... more ABSTRACT This paper presents a number of numerical process models of the infra-red reflow soldering process, the major joining process for surface mount assemblies. The aim of this work is to investigate the key process and design variables and their effect on joint quality in the final assembly. The paper includes models of a bare printed circuit board and “J” and “Gull-Wing” leaded components on a printed circuit board all passing through an infra-red oven. The process models are based and I-DEAS modeling suite and TMG thermal solver and are likely to find application in process design.
Applied Mechanics and Materials, 2006
Page 1. Analysis of Stress Distribution in SnAgCu Solder Joint J. Gong a , C. Liu b , PP Conway c... more Page 1. Analysis of Stress Distribution in SnAgCu Solder Joint J. Gong a , C. Liu b , PP Conway c and VV Silberschmidt d Wolfson School of Mechanical and Manufacturing Engineering Loughborough University, Loughborough, LE11 3TU, UK ...
Chinese Science Bulletin, 2013
Scripta Materialia, 2009
ABSTRACT
Journal of Electronic Packaging
Thermal stress-induced protrusions of copper through-silicon-vias (Cu-TSVs) during thermal proces... more Thermal stress-induced protrusions of copper through-silicon-vias (Cu-TSVs) during thermal processing pose substantial reliability concerns in three-dimensional system integration. In this study, a phase-field-crystal model is used to investigate the protrusions and microstructural evolutions of blind Cu-TSVs under different loading conditions. Protrusions are observed only when the TSVs are under varepsilonx\varepsilon_xvarepsilonx, varepsilony\varepsilon_yvarepsilony and gammaxy\gamma_{xy}gammaxy, whereas no protrusions are observed when the TSVs are subjected to pure shear strains gammayx\gamma_{yx}gammayx. The simulation results suggest that the grains in the top layer of a TSV contribute more to both the protrusion profile and the protrusion height than the grains in the lower layers. Moreover, the protrusion is larger when the misorientation among the grains is larger and the grain size along the yyy-direction is smaller. In addition, a phenomenological model linking protrusion and microstructural factors and a visual guide from the viewpo...
18Th European Microelectronics Packaging Conference, 2011
... Olivia M Flahertyl, Xiaoyun Cuil, Divya Rajamohan2, David Anderson2, David Huttl, Chris Denni... more ... Olivia M Flahertyl, Xiaoyun Cuil, Divya Rajamohan2, David Anderson2, David Huttl, Chris Denning2, Paul P Conwayl, Andrew A Westl ... SA Wilson, RPJ Jourdain, Q. Zhang, RA Dorey, CR Bowen, M. Willander, QU Wahab, SM Al-hilli, O. Nur, E. Quandt, C. Johansson, E. Pagounis ...
There is an increasing interest in Multi-Electrode Array (MEA) technology arising from a diversit... more There is an increasing interest in Multi-Electrode Array (MEA) technology arising from a diversity of bio-scientific areas, which is especially strong in stem cell, drug discovery or safety pharmacology applications. There are limitations in the quantity of useful data captured during an MEA-based trial that can be attributed to reasons such as the time intensive nature of MEA application, the
2014 Ieee 16th Electronics Packaging Technology Conference, Dec 1, 2014
... (2009) Publisher: EUROSIS-ETI Publications, Pages: 79-85. ... Sign up today, find more releva... more ... (2009) Publisher: EUROSIS-ETI Publications, Pages: 79-85. ... Sign up today, find more relevant papers and organise your research all in one place. First name. Last name. E-mail address. ...or sign in with Facebook. Readership Statistics. ...
IEEE Transactions on Device and Materials Reliability, 2014
International Symposium on Microelectronics, 2013