K. Seetharamu | PES University (original) (raw)
Papers by K. Seetharamu
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Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000
... 'A. Parthiban, K. Jeevan, K. N. Seetharamu, I. A. hid ... Although a little more tim... more ... 'A. Parthiban, K. Jeevan, K. N. Seetharamu, I. A. hid ... Although a little more time is spent on getting the right GA parameter settings, the output is definitely rewarding. AU problems above were solved in a computer with a 600Mhz Pentium I11 processor and 128 MB of RAM. ...
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Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000
In this investigation, closed loop immersion cooling of an electronic package with external conde... more In this investigation, closed loop immersion cooling of an electronic package with external condenser-a wire-on-tube heat exchanger being attached to its enclosure-is analysed. The dielectric vapour leaving the enclosure flows through the tubes of the heat exchanger. The vapour is then cooled by ambient air in free or forced convection environments. The finite element method is used in the analysis.
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Semiconductor chips are encapsulated for their protection from mechanical and chemical hazards as... more Semiconductor chips are encapsulated for their protection from mechanical and chemical hazards as well as help in heat dissipation and signal transmission. In this paper, flow during underfilling encapsulation process has been analyzed using generalized porous medium approach. The analysis is carried out by writing down the conservation equations for mass, momentum and energy for a two-dimensional flow in an
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ASEAN Journal on Science and Technology for Development
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Communications in Applied Numerical Methods, 1986
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International Journal of Numerical Methods for Heat & Fluid Flow, 1996
ABSTRACT A finite element method is used to study the effect of flow past a circular cylinder wit... more ABSTRACT A finite element method is used to study the effect of flow past a circular cylinder with an integral wake splitter. A fractional step algorithm is employed to solve the Navier-Stokes and Energy equations with a Galerkin weighted residual formulation. The vortex shedding ...
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Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000
... CW Wong, KN Seethariunu, Zyinal Aliinuddiii and Hnssari AY School of Mechanical Engineering I... more ... CW Wong, KN Seethariunu, Zyinal Aliinuddiii and Hnssari AY School of Mechanical Engineering I hii versi t y ... 2/3 Kulim Hi Tech Park, 09000 Kulim, Keduh I);ruI Amnii, Ma1:iysia Einail :teck.iw.coh (Ir ... From the figures, it is clearly seen that the boiling curves show the trend of the ...
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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004
... K. Jeevan, I. A. Azid, KN Seetharamu School of Mechanical Engineering, University Science Mal... more ... K. Jeevan, I. A. Azid, KN Seetharamu School of Mechanical Engineering, University Science Malaysia USM Engineering campus, 14300, Nihong Tehal, Penang, Malaysia email: jeevan4@yahoo.com ... A B C ' D B A D C C D A B ' D C B . A u+w u+w u+x u+x u+w u+w u+x U+ ...
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ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208), 1998
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Key Engineering Materials, 2005
Abstract Delamination and crack were considered as significant failures in electronic packaging. ... more Abstract Delamination and crack were considered as significant failures in electronic packaging. For these circumstances, Modified Crack Closure Integral method was tested and applied to determine crack growth rate and for the purpose to understand failures. ...
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Sadhana, 2001
Abstract This paper enumerates finite-element based prediction of internal flow problems, with he... more Abstract This paper enumerates finite-element based prediction of internal flow problems, with heat transfer. The present numerical simulations employ a velocity correction algorithm, with a Galerkin weighted residual formulation. Two problems each in laminar and ...
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Sadhana, 2001
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Numerical Heat Transfer, Part A: Applications, 1994
This paper discusses the application of a finite element method based on the first-order projecti... more This paper discusses the application of a finite element method based on the first-order projection scheme, which is an extension of Chorin's algorithm, to transient laminar natural convection in a square cavity. Results have been presented for a fluid of Prandtl number 0.71 in the ...
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Numerical Heat Transfer, Part A: Applications, 1997
... К1Ш AI» « -«.Ю|,,,н,,4ни^м..4 r.,,|i,1T J Richardson number С» При» 3. DifMbeioB шва ...... more ... К1Ш AI» « -«.Ю|,,,н,,4ни^м..4 r.,,|i,1T J Richardson number С» При» 3. DifMbeioB шва ... MIXED CONVECTION PAST IN-LINE CYLINDERS SII ; He=60 POR-1.5 S/0 - 2.5 Angle (a) MO-Ш ... 2.0 Яе=50.0 P0H-1.SS/0-1,5 1 -jt.-a *■-* ■ 3 -Î ~\ s Richardsen number (# i I ...
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International Journal of Thermal Sciences, 2006
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International Journal of Heat and Mass Transfer, 1984
This paper deals with a theoretical analysis of direct contact evaporation of a drop moving in a ... more This paper deals with a theoretical analysis of direct contact evaporation of a drop moving in a stagnant column of an immiscible liquid. The non-dimensional pa.
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International Journal of Heat and Mass Transfer, 1989
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Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000
... 'A. Parthiban, K. Jeevan, K. N. Seetharamu, I. A. hid ... Although a little more tim... more ... 'A. Parthiban, K. Jeevan, K. N. Seetharamu, I. A. hid ... Although a little more time is spent on getting the right GA parameter settings, the output is definitely rewarding. AU problems above were solved in a computer with a 600Mhz Pentium I11 processor and 128 MB of RAM. ...
Bookmarks Related papers MentionsView impact
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000
In this investigation, closed loop immersion cooling of an electronic package with external conde... more In this investigation, closed loop immersion cooling of an electronic package with external condenser-a wire-on-tube heat exchanger being attached to its enclosure-is analysed. The dielectric vapour leaving the enclosure flows through the tubes of the heat exchanger. The vapour is then cooled by ambient air in free or forced convection environments. The finite element method is used in the analysis.
Bookmarks Related papers MentionsView impact
Semiconductor chips are encapsulated for their protection from mechanical and chemical hazards as... more Semiconductor chips are encapsulated for their protection from mechanical and chemical hazards as well as help in heat dissipation and signal transmission. In this paper, flow during underfilling encapsulation process has been analyzed using generalized porous medium approach. The analysis is carried out by writing down the conservation equations for mass, momentum and energy for a two-dimensional flow in an
Bookmarks Related papers MentionsView impact
ASEAN Journal on Science and Technology for Development
Bookmarks Related papers MentionsView impact
Communications in Applied Numerical Methods, 1986
Bookmarks Related papers MentionsView impact
International Journal of Numerical Methods for Heat & Fluid Flow, 1996
ABSTRACT A finite element method is used to study the effect of flow past a circular cylinder wit... more ABSTRACT A finite element method is used to study the effect of flow past a circular cylinder with an integral wake splitter. A fractional step algorithm is employed to solve the Navier-Stokes and Energy equations with a Galerkin weighted residual formulation. The vortex shedding ...
Bookmarks Related papers MentionsView impact
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000
... CW Wong, KN Seethariunu, Zyinal Aliinuddiii and Hnssari AY School of Mechanical Engineering I... more ... CW Wong, KN Seethariunu, Zyinal Aliinuddiii and Hnssari AY School of Mechanical Engineering I hii versi t y ... 2/3 Kulim Hi Tech Park, 09000 Kulim, Keduh I);ruI Amnii, Ma1:iysia Einail :teck.iw.coh (Ir ... From the figures, it is clearly seen that the boiling curves show the trend of the ...
Bookmarks Related papers MentionsView impact
Bookmarks Related papers MentionsView impact
Bookmarks Related papers MentionsView impact
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004
... K. Jeevan, I. A. Azid, KN Seetharamu School of Mechanical Engineering, University Science Mal... more ... K. Jeevan, I. A. Azid, KN Seetharamu School of Mechanical Engineering, University Science Malaysia USM Engineering campus, 14300, Nihong Tehal, Penang, Malaysia email: jeevan4@yahoo.com ... A B C ' D B A D C C D A B ' D C B . A u+w u+w u+x u+x u+w u+w u+x U+ ...
Bookmarks Related papers MentionsView impact
ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208), 1998
Bookmarks Related papers MentionsView impact
Key Engineering Materials, 2005
Abstract Delamination and crack were considered as significant failures in electronic packaging. ... more Abstract Delamination and crack were considered as significant failures in electronic packaging. For these circumstances, Modified Crack Closure Integral method was tested and applied to determine crack growth rate and for the purpose to understand failures. ...
Bookmarks Related papers MentionsView impact
Sadhana, 2001
Abstract This paper enumerates finite-element based prediction of internal flow problems, with he... more Abstract This paper enumerates finite-element based prediction of internal flow problems, with heat transfer. The present numerical simulations employ a velocity correction algorithm, with a Galerkin weighted residual formulation. Two problems each in laminar and ...
Bookmarks Related papers MentionsView impact
Sadhana, 2001
Bookmarks Related papers MentionsView impact
Numerical Heat Transfer, Part A: Applications, 1994
This paper discusses the application of a finite element method based on the first-order projecti... more This paper discusses the application of a finite element method based on the first-order projection scheme, which is an extension of Chorin's algorithm, to transient laminar natural convection in a square cavity. Results have been presented for a fluid of Prandtl number 0.71 in the ...
Bookmarks Related papers MentionsView impact
Numerical Heat Transfer, Part A: Applications, 1997
... К1Ш AI» « -«.Ю|,,,н,,4ни^м..4 r.,,|i,1T J Richardson number С» При» 3. DifMbeioB шва ...... more ... К1Ш AI» « -«.Ю|,,,н,,4ни^м..4 r.,,|i,1T J Richardson number С» При» 3. DifMbeioB шва ... MIXED CONVECTION PAST IN-LINE CYLINDERS SII ; He=60 POR-1.5 S/0 - 2.5 Angle (a) MO-Ш ... 2.0 Яе=50.0 P0H-1.SS/0-1,5 1 -jt.-a *■-* ■ 3 -Î ~\ s Richardsen number (# i I ...
Bookmarks Related papers MentionsView impact
International Journal of Thermal Sciences, 2006
Bookmarks Related papers MentionsView impact
International Journal of Heat and Mass Transfer, 1984
This paper deals with a theoretical analysis of direct contact evaporation of a drop moving in a ... more This paper deals with a theoretical analysis of direct contact evaporation of a drop moving in a stagnant column of an immiscible liquid. The non-dimensional pa.
Bookmarks Related papers MentionsView impact
International Journal of Heat and Mass Transfer, 1989
Bookmarks Related papers MentionsView impact