K. Seetharamu - Profile on Academia.edu (original) (raw)

Papers by K. Seetharamu

The solder joint reliability is the biggest disadvantage the PBGA has as compared with other conv... more The solder joint reliability is the biggest disadvantage the PBGA has as compared with other conventional packages. A 2-D steady state stress analysis based on FE method has been carried out to study the most critical item, the solder joint. The parametric studies have been carried out to study the effect of chip length and the substrate thickness on the magnitude of the stress in the solder joints. The results indicate that the ball nearest to the die has the highest magnitude of the stress and hence is the most critical. The results are expected to act as database for the better design of reliable PBGAs.

Evolutionary genetic approach to determine junction temperature in electronic packages

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000

... 'A. Parthiban, K. Jeevan, K. N. Seetharamu, I. A. hid ... Although a little more tim... more ... 'A. Parthiban, K. Jeevan, K. N. Seetharamu, I. A. hid ... Although a little more time is spent on getting the right GA parameter settings, the output is definitely rewarding. AU problems above were solved in a computer with a 600Mhz Pentium I11 processor and 128 MB of RAM. ...

Performance of wire-on-tube heat exchangers used in immersion cooling for electronic packages

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000

In this investigation, closed loop immersion cooling of an electronic package with external conde... more In this investigation, closed loop immersion cooling of an electronic package with external condenser-a wire-on-tube heat exchanger being attached to its enclosure-is analysed. The dielectric vapour leaving the enclosure flows through the tubes of the heat exchanger. The vapour is then cooled by ambient air in free or forced convection environments. The finite element method is used in the analysis.

Characteristic Based Split Algorithm Used in Underfilling Encapsulation Process

Semiconductor chips are encapsulated for their protection from mechanical and chemical hazards as... more Semiconductor chips are encapsulated for their protection from mechanical and chemical hazards as well as help in heat dissipation and signal transmission. In this paper, flow during underfilling encapsulation process has been analyzed using generalized porous medium approach. The analysis is carried out by writing down the conservation equations for mass, momentum and energy for a two-dimensional flow in an

A simplified steady state heat transfer model for human body

ASEAN Journal on Science and Technology for Development

Communications in Applied Numerical Methods, 1986

The application of finite elements in heat exchangers is illustrated, with the newly proposed ele... more The application of finite elements in heat exchangers is illustrated, with the newly proposed element for two types of heat exchangers. It is found that the present model predicts the temperature distribution accurately.

Simulation of laminar confined flow past a circular cylinder with integral wake splitter involving heat transfer

International Journal of Numerical Methods for Heat & Fluid Flow, 1996

ABSTRACT A finite element method is used to study the effect of flow past a circular cylinder wit... more ABSTRACT A finite element method is used to study the effect of flow past a circular cylinder with an integral wake splitter. A fractional step algorithm is employed to solve the Navier-Stokes and Energy equations with a Galerkin weighted residual formulation. The vortex shedding ...

Three-dimensional analysis of an enhanced cooling system for electronic packaging

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000

... CW Wong, KN Seethariunu, Zyinal Aliinuddiii and Hnssari AY School of Mechanical Engineering I... more ... CW Wong, KN Seethariunu, Zyinal Aliinuddiii and Hnssari AY School of Mechanical Engineering I hii versi t y ... 2/3 Kulim Hi Tech Park, 09000 Kulim, Keduh I);ruI Amnii, Ma1:iysia Einail :teck.iw.coh (Ir ... From the figures, it is clearly seen that the boiling curves show the trend of the ...

A generalised formulation of the steady state analysis of a double stack cold plate, with and wit... more A generalised formulation of the steady state analysis of a double stack cold plate, with and without heat losses from their top and bottom surfaces using dimensionless parameters, is carried out. Galerkin's weighted residual method is employed to obtain the finite element formulation of the governing equation. A simple one-dimensional fin theory is applied to the discretised elements during the analysis.

Analysis of air film in conveyor pressurized by two parallel slots: Effect of tilting of package both in longitudinal and transverse directions

Optimization of double layer counter flow (DLCF) micro-channel heat sink used for cooling chips directly

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004

... K. Jeevan, I. A. Azid, KN Seetharamu School of Mechanical Engineering, University Science Mal... more ... K. Jeevan, I. A. Azid, KN Seetharamu School of Mechanical Engineering, University Science Malaysia USM Engineering campus, 14300, Nihong Tehal, Penang, Malaysia email: jeevan4@yahoo.com ... A B C ' D B A D C C D A B ' D C B . A u+w u+w u+x u+x u+w u+w u+x U+ ...

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208), 1998

This study deals with the use of finite element methods to determine the thet-mal performance and... more This study deals with the use of finite element methods to determine the thet-mal performance and limits of flip chip packaging. Tlie simulations show good agreement with the available experimental data.

Fracture Mechanic Analysis for Package Delamination

Key Engineering Materials, 2005

Abstract Delamination and crack were considered as significant failures in electronic packaging. ... more Abstract Delamination and crack were considered as significant failures in electronic packaging. For these circumstances, Modified Crack Closure Integral method was tested and applied to determine crack growth rate and for the purpose to understand failures. ...

Finite element simulation of internal flows with heat transfer using a velocity correction approach

Sadhana, 2001

Abstract This paper enumerates finite-element based prediction of internal flow problems, with he... more Abstract This paper enumerates finite-element based prediction of internal flow problems, with heat transfer. The present numerical simulations employ a velocity correction algorithm, with a Galerkin weighted residual formulation. Two problems each in laminar and ...

Sadhana, 2001

The process of solidification process is complex in nature and the simulation of such process is ... more The process of solidification process is complex in nature and the simulation of such process is required in industry before it is actually undertaken. Finite element method is used to simulate the heat transfer process accompanying the solidification process. The metal and the mould along with the air gap formation is accounted in the heat transfer simulation. Distortion of the casting is caused due to non-uniform shrinkage associated with the process. Residual stresses are induced in the final castings. Simulation of the shrinkage and the thermal stresses are also carried out using finite element methods. The material behaviour is considered as visco-plastic. The simulations are compared with available experimental data and the comparison is found to be good. Special considerations regarding the simulation of solidification process are also brought out.

Solution of Transient Laminar Natural Convection in a Square Cavity by an Explicit Finite Element Scheme

Numerical Heat Transfer, Part A: Applications, 1994

This paper discusses the application of a finite element method based on the first-order projecti... more This paper discusses the application of a finite element method based on the first-order projection scheme, which is an extension of Chorin's algorithm, to transient laminar natural convection in a square cavity. Results have been presented for a fluid of Prandtl number 0.71 in the ...

Mixed Convection Heat Transfer Past In-Line Cylinders in a Vertical Duct

Numerical Heat Transfer, Part A: Applications, 1997

... К1Ш AI» « -«.Ю|,,,н,,4ни^м..4 r.,,|i,1T J Richardson number С» При» 3. DifMbeioB шва ...... more ... К1Ш AI» « -«.Ю|,,,н,,4ни^м..4 r.,,|i,1T J Richardson number С» При» 3. DifMbeioB шва ... MIXED CONVECTION PAST IN-LINE CYLINDERS SII ; He=60 POR-1.5 S/0 - 2.5 Angle (a) MO-Ш ... 2.0 Яе=50.0 P0H-1.SS/0-1,5 1 -jt.-a *■-* ■ 3 -Î ~\ s Richardsen number (# i I ...

International Journal of Thermal Sciences, 2006

Free convection with and without radiation past a vertical plate embedded in a saturated porous m... more Free convection with and without radiation past a vertical plate embedded in a saturated porous medium has been analysed. The partial differential equations are non-dimensionalised and solved using Finite Element Method. Temperature distribution in the porous medium has been studied for constant and varying wall temperatures. For non-isothermal case, the wall temperature has been assumed as power law function. Numerical results for local Nusselt number are presented for the case of, with and without radiation. It is found that the local Nusselt number decreases with the height of the vertical plate for an isothermal wall temperature. However, local Nusselt number increases with the height of the plate for linearly varying wall temperature and it also increases with radiation.  2005 Elsevier SAS. All rights reserved.

Parametric studies on direct contact evaporation of a drop in an immiscible liquid

International Journal of Heat and Mass Transfer, 1984

This paper deals with a theoretical analysis of direct contact evaporation of a drop moving in a ... more This paper deals with a theoretical analysis of direct contact evaporation of a drop moving in a stagnant column of an immiscible liquid. The non-dimensional pa.

International Journal of Heat and Mass Transfer, 1989

An analysis of a crossflow compact heat exchanger is carried out using a finite element model. Th... more An analysis of a crossflow compact heat exchanger is carried out using a finite element model. The predictions are in good agreement with analytical solutions available for cases with constant heat transfer coefficients. The analysis is extended to variable heat transfer coefficient cases, and the results compared with constant heat transfer coefficient cases. In addition to thermal analysis, the pressure drops are calculated for all cases.