K. Seetharamu | PES University (original) (raw)

Papers by K. Seetharamu

Research paper thumbnail of Thermo-mechanical stress analysis of PBGA

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Research paper thumbnail of Evolutionary genetic approach to determine junction temperature in electronic packages

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000

... 'A. Parthiban, K. Jeevan, K. N. Seetharamu, I. A. hid ... Although a little more tim... more ... 'A. Parthiban, K. Jeevan, K. N. Seetharamu, I. A. hid ... Although a little more time is spent on getting the right GA parameter settings, the output is definitely rewarding. AU problems above were solved in a computer with a 600Mhz Pentium I11 processor and 128 MB of RAM. ...

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Research paper thumbnail of Performance of wire-on-tube heat exchangers used in immersion cooling for electronic packages

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000

In this investigation, closed loop immersion cooling of an electronic package with external conde... more In this investigation, closed loop immersion cooling of an electronic package with external condenser-a wire-on-tube heat exchanger being attached to its enclosure-is analysed. The dielectric vapour leaving the enclosure flows through the tubes of the heat exchanger. The vapour is then cooled by ambient air in free or forced convection environments. The finite element method is used in the analysis.

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Research paper thumbnail of Characteristic Based Split Algorithm Used in Underfilling Encapsulation Process

Semiconductor chips are encapsulated for their protection from mechanical and chemical hazards as... more Semiconductor chips are encapsulated for their protection from mechanical and chemical hazards as well as help in heat dissipation and signal transmission. In this paper, flow during underfilling encapsulation process has been analyzed using generalized porous medium approach. The analysis is carried out by writing down the conservation equations for mass, momentum and energy for a two-dimensional flow in an

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Research paper thumbnail of A simplified steady state heat transfer model for human body

ASEAN Journal on Science and Technology for Development

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Research paper thumbnail of Application of finite elements in heat exchangers

Communications in Applied Numerical Methods, 1986

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Research paper thumbnail of Simulation of laminar confined flow past a circular cylinder with integral wake splitter involving heat transfer

International Journal of Numerical Methods for Heat & Fluid Flow, 1996

ABSTRACT A finite element method is used to study the effect of flow past a circular cylinder wit... more ABSTRACT A finite element method is used to study the effect of flow past a circular cylinder with an integral wake splitter. A fractional step algorithm is employed to solve the Navier-Stokes and Energy equations with a Galerkin weighted residual formulation. The vortex shedding ...

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Research paper thumbnail of Three-dimensional analysis of an enhanced cooling system for electronic packaging

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000

... CW Wong, KN Seethariunu, Zyinal Aliinuddiii and Hnssari AY School of Mechanical Engineering I... more ... CW Wong, KN Seethariunu, Zyinal Aliinuddiii and Hnssari AY School of Mechanical Engineering I hii versi t y ... 2/3 Kulim Hi Tech Park, 09000 Kulim, Keduh I);ruI Amnii, Ma1:iysia Einail :teck.iw.coh (Ir ... From the figures, it is clearly seen that the boiling curves show the trend of the ...

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Research paper thumbnail of Steady state finite element analysis of a double stack cold plate with heat losses

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Research paper thumbnail of Analysis of air film in conveyor pressurized by two parallel slots: Effect of tilting of package both in longitudinal and transverse directions

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Research paper thumbnail of Optimization of double layer counter flow (DLCF) micro-channel heat sink used for cooling chips directly

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004

... K. Jeevan, I. A. Azid, KN Seetharamu School of Mechanical Engineering, University Science Mal... more ... K. Jeevan, I. A. Azid, KN Seetharamu School of Mechanical Engineering, University Science Malaysia USM Engineering campus, 14300, Nihong Tehal, Penang, Malaysia email: jeevan4@yahoo.com ... A B C ' D B A D C C D A B ' D C B . A u+w u+w u+x u+x u+w u+w u+x U+ ...

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Research paper thumbnail of Thermal performance of flip chip using finite element method

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208), 1998

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Research paper thumbnail of Fracture Mechanic Analysis for Package Delamination

Key Engineering Materials, 2005

Abstract Delamination and crack were considered as significant failures in electronic packaging. ... more Abstract Delamination and crack were considered as significant failures in electronic packaging. For these circumstances, Modified Crack Closure Integral method was tested and applied to determine crack growth rate and for the purpose to understand failures. ...

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Research paper thumbnail of Finite element simulation of internal flows with heat transfer using a velocity correction approach

Sadhana, 2001

Abstract This paper enumerates finite-element based prediction of internal flow problems, with he... more Abstract This paper enumerates finite-element based prediction of internal flow problems, with heat transfer. The present numerical simulations employ a velocity correction algorithm, with a Galerkin weighted residual formulation. Two problems each in laminar and ...

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Research paper thumbnail of Finite element modelling of solidification phenomena

Sadhana, 2001

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Research paper thumbnail of Solution of Transient Laminar Natural Convection in a Square Cavity by an Explicit Finite Element Scheme

Numerical Heat Transfer, Part A: Applications, 1994

This paper discusses the application of a finite element method based on the first-order projecti... more This paper discusses the application of a finite element method based on the first-order projection scheme, which is an extension of Chorin's algorithm, to transient laminar natural convection in a square cavity. Results have been presented for a fluid of Prandtl number 0.71 in the ...

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Research paper thumbnail of Mixed Convection Heat Transfer Past In-Line Cylinders in a Vertical Duct

Numerical Heat Transfer, Part A: Applications, 1997

... К1Ш AI» « -«.Ю|,,,н,,„4ни^„м.„.4 r.,,|„i„,1T J Richardson number С» При» 3. DifMbeioB шва ...... more ... К1Ш AI» « -«.Ю|,,,н,,„4ни^„м.„.4 r.,,|„i„,1T J Richardson number С» При» 3. DifMbeioB шва ... MIXED CONVECTION PAST IN-LINE CYLINDERS SII ; He=60 POR-1.5 S/0 - 2.5 Angle (a) MO-Ш ... 2.0 Яе=50.0 P0H-1.SS/0-1,5 1 -jt.-a *■-* ■ 3 -Î ~\ s Richardsen number (# i I ...

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Research paper thumbnail of Free convection and radiation for a vertical wall with varying temperature embedded in a porous medium

International Journal of Thermal Sciences, 2006

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Research paper thumbnail of Parametric studies on direct contact evaporation of a drop in an immiscible liquid

International Journal of Heat and Mass Transfer, 1984

This paper deals with a theoretical analysis of direct contact evaporation of a drop moving in a ... more This paper deals with a theoretical analysis of direct contact evaporation of a drop moving in a stagnant column of an immiscible liquid. The non-dimensional pa.

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Research paper thumbnail of Performance evaluation of crossflow compact heat exchangers using finite elements

International Journal of Heat and Mass Transfer, 1989

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Research paper thumbnail of Thermo-mechanical stress analysis of PBGA

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Research paper thumbnail of Evolutionary genetic approach to determine junction temperature in electronic packages

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000

... 'A. Parthiban, K. Jeevan, K. N. Seetharamu, I. A. hid ... Although a little more tim... more ... 'A. Parthiban, K. Jeevan, K. N. Seetharamu, I. A. hid ... Although a little more time is spent on getting the right GA parameter settings, the output is definitely rewarding. AU problems above were solved in a computer with a 600Mhz Pentium I11 processor and 128 MB of RAM. ...

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Research paper thumbnail of Performance of wire-on-tube heat exchangers used in immersion cooling for electronic packages

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000

In this investigation, closed loop immersion cooling of an electronic package with external conde... more In this investigation, closed loop immersion cooling of an electronic package with external condenser-a wire-on-tube heat exchanger being attached to its enclosure-is analysed. The dielectric vapour leaving the enclosure flows through the tubes of the heat exchanger. The vapour is then cooled by ambient air in free or forced convection environments. The finite element method is used in the analysis.

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Research paper thumbnail of Characteristic Based Split Algorithm Used in Underfilling Encapsulation Process

Semiconductor chips are encapsulated for their protection from mechanical and chemical hazards as... more Semiconductor chips are encapsulated for their protection from mechanical and chemical hazards as well as help in heat dissipation and signal transmission. In this paper, flow during underfilling encapsulation process has been analyzed using generalized porous medium approach. The analysis is carried out by writing down the conservation equations for mass, momentum and energy for a two-dimensional flow in an

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Research paper thumbnail of A simplified steady state heat transfer model for human body

ASEAN Journal on Science and Technology for Development

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Application of finite elements in heat exchangers

Communications in Applied Numerical Methods, 1986

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Research paper thumbnail of Simulation of laminar confined flow past a circular cylinder with integral wake splitter involving heat transfer

International Journal of Numerical Methods for Heat & Fluid Flow, 1996

ABSTRACT A finite element method is used to study the effect of flow past a circular cylinder wit... more ABSTRACT A finite element method is used to study the effect of flow past a circular cylinder with an integral wake splitter. A fractional step algorithm is employed to solve the Navier-Stokes and Energy equations with a Galerkin weighted residual formulation. The vortex shedding ...

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Three-dimensional analysis of an enhanced cooling system for electronic packaging

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000

... CW Wong, KN Seethariunu, Zyinal Aliinuddiii and Hnssari AY School of Mechanical Engineering I... more ... CW Wong, KN Seethariunu, Zyinal Aliinuddiii and Hnssari AY School of Mechanical Engineering I hii versi t y ... 2/3 Kulim Hi Tech Park, 09000 Kulim, Keduh I);ruI Amnii, Ma1:iysia Einail :teck.iw.coh (Ir ... From the figures, it is clearly seen that the boiling curves show the trend of the ...

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Research paper thumbnail of Steady state finite element analysis of a double stack cold plate with heat losses

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Analysis of air film in conveyor pressurized by two parallel slots: Effect of tilting of package both in longitudinal and transverse directions

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Optimization of double layer counter flow (DLCF) micro-channel heat sink used for cooling chips directly

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004

... K. Jeevan, I. A. Azid, KN Seetharamu School of Mechanical Engineering, University Science Mal... more ... K. Jeevan, I. A. Azid, KN Seetharamu School of Mechanical Engineering, University Science Malaysia USM Engineering campus, 14300, Nihong Tehal, Penang, Malaysia email: jeevan4@yahoo.com ... A B C ' D B A D C C D A B ' D C B . A u+w u+w u+x u+x u+w u+w u+x U+ ...

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Thermal performance of flip chip using finite element method

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208), 1998

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Fracture Mechanic Analysis for Package Delamination

Key Engineering Materials, 2005

Abstract Delamination and crack were considered as significant failures in electronic packaging. ... more Abstract Delamination and crack were considered as significant failures in electronic packaging. For these circumstances, Modified Crack Closure Integral method was tested and applied to determine crack growth rate and for the purpose to understand failures. ...

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Finite element simulation of internal flows with heat transfer using a velocity correction approach

Sadhana, 2001

Abstract This paper enumerates finite-element based prediction of internal flow problems, with he... more Abstract This paper enumerates finite-element based prediction of internal flow problems, with heat transfer. The present numerical simulations employ a velocity correction algorithm, with a Galerkin weighted residual formulation. Two problems each in laminar and ...

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Finite element modelling of solidification phenomena

Sadhana, 2001

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Solution of Transient Laminar Natural Convection in a Square Cavity by an Explicit Finite Element Scheme

Numerical Heat Transfer, Part A: Applications, 1994

This paper discusses the application of a finite element method based on the first-order projecti... more This paper discusses the application of a finite element method based on the first-order projection scheme, which is an extension of Chorin's algorithm, to transient laminar natural convection in a square cavity. Results have been presented for a fluid of Prandtl number 0.71 in the ...

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Mixed Convection Heat Transfer Past In-Line Cylinders in a Vertical Duct

Numerical Heat Transfer, Part A: Applications, 1997

... К1Ш AI» « -«.Ю|,,,н,,„4ни^„м.„.4 r.,,|„i„,1T J Richardson number С» При» 3. DifMbeioB шва ...... more ... К1Ш AI» « -«.Ю|,,,н,,„4ни^„м.„.4 r.,,|„i„,1T J Richardson number С» При» 3. DifMbeioB шва ... MIXED CONVECTION PAST IN-LINE CYLINDERS SII ; He=60 POR-1.5 S/0 - 2.5 Angle (a) MO-Ш ... 2.0 Яе=50.0 P0H-1.SS/0-1,5 1 -jt.-a *■-* ■ 3 -Î ~\ s Richardsen number (# i I ...

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Research paper thumbnail of Free convection and radiation for a vertical wall with varying temperature embedded in a porous medium

International Journal of Thermal Sciences, 2006

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Research paper thumbnail of Parametric studies on direct contact evaporation of a drop in an immiscible liquid

International Journal of Heat and Mass Transfer, 1984

This paper deals with a theoretical analysis of direct contact evaporation of a drop moving in a ... more This paper deals with a theoretical analysis of direct contact evaporation of a drop moving in a stagnant column of an immiscible liquid. The non-dimensional pa.

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Research paper thumbnail of Performance evaluation of crossflow compact heat exchangers using finite elements

International Journal of Heat and Mass Transfer, 1989

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