Ho Kok Hoe | Monash University (Malaysia) (original) (raw)

Scholarship recipient (Mybrain15-MyPhD) / Grant (Ph.D. study)

Ts (MBOT); Associate ASEAN Engineer (ASEAN Federation of Engineering Organization - AFEO) - (https://aer.afeo.org/@33a74ca7e4d44be9825f9e57825bbe13); Graduate Engineer (BEM/IEM)

FIDE Title (Lead School Instructor - LSI) - from 17 June 2022 to 17 June 2025

Teacher (Mechanical / Electronics and Electrical Engineering);

Certified Trainer (TTT - Train the Trainer) - HRD Corp

Field of Expertise (Industrial Engineering, Manufacturing, Operations Research, Process Engineering)

Interests (Automation, Industry 4.0, Process Optimization, Analytical Analysis, Quality, and Productivity Analysis, Robotics, Simulation, Cyber-Physical System)

Play Chess, Rubiks, Sudoku, Puzzle, Mensa, Scrabbles, Sport

17 years of industry experience (Polymer and Semiconductor), > 6 years tutoring, > 4 years of lecturing (Engineering subjects), <1 year of managing school at college

Industrial Experience (Process Engineering – Assembly Semiconductor and Polymer Industries)

Education Management Experience - Managed school of engineering and IT (ISO audit, accreditation, compliance audit, CQI - continuous quality improvement on curriculum, micro-credential, industry engagement, and other related matters for the school), internal auditor.

Education (Lecture) Experience - develop curriculum on the new subject and current subject (lesson, tutorial, lab sessions, continuous assessment, final exam, students performance monitoring, integrate the subjects with industry practice, classroom management (physical and online).

Education (Others) Experience - Industry and research engagement (research, solving industry problems), accreditation activity, project supervision

Industry Experience - Polymer industry (keypad, injection molding, hot stamping, printing, reflow oven), assembly semiconductor (integrated circuits, multi-dies processes, substrate, solder bump, flip chip, flux, MEMS (micro-electro-mechanical systems), sensor IC (Integrated Circuit), pre-mold packages, mounting, sawing, 2nd optical, die-attach, wire bond, oven cure, 3rd optical, gel coating, lid attach, dispensing) - experience in handling automotive IC (Integrated Circuit), customers, audit, and ISO (9001, TS16949 - IATF16949:2016).

Other Industry Experience - 8D, low yield report, yield improvement analysis, capacity expansion, lean six sigma yellow and green belt, quality analysis and solution, productivity improvement, process optimization, statistical analysis, sustaining new products and processes operation, SPC, FMEA, control plan, projects, DOE
Supervisors: Prof Ir Dr Tan Chee Pin (HOD School of Engineering), Dr Joshua Prakash; Prof Ir Dr Ong Kok Seng (PhD Supervisor), and Prof Ir Dr Kanesan Muthusamy; Dr K. Harikrishnan (Master Supervisor)

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