Saeed Ghalambor | University of Texas at Arlington (original) (raw)

Saeed Ghalambor

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Papers by Saeed Ghalambor

Research paper thumbnail of Analytical Solutions Of Steady-state Heat Conduction In Multi-layer Stack Packaging

Analytical models that can be utilized in modeling the steady-state temperature solutions of plan... more Analytical models that can be utilized in modeling the steady-state temperature solutions of planar and 3D packaged integrated circuits are discussed. This mathematically-driven model will include solutions for uniform and non-uniform footprint die stack systems as well as planar flip chip packages. These analytically obtained temperature solutions will include the contribution of thermal resistance for both cases as well as perfect contact scenarios. The acquired solution will accommodate any kind of boundary conditions (first, second and third kind) on the top and bottom surfaces of the stack system with the sides being adiabatic. Furthermore, the algorithm developed will consider volumetric heat generation as well as heat source at any cross section within the model. Finally, the diffusion equation for heterogeneous layers is solved using the Galerkin-based integral approach. The latest development pertains to the analytical solutions of the steady-state heat conduction in stacked dies of an electronic chipset with or without TSV (Through Silicon Via) technology. TSVs are used as interconnections between different dies in vertical layers. Furthermore, the effect of thermal conductance between the constituents of the layers is considered.

Research paper thumbnail of The Impact of Surface Roughness and PTFE/TiF3/FeF3 Additives in Plain ZDDP Oil on the Friction and Wear Behavior Using Thermal and Tribological Analysis under Extreme Pressure Condition

Authors : Gabi N. Nehme, Saeed Ghalambor Abstract : The use of titanium fluoride and iron fluorid... more Authors : Gabi N. Nehme, Saeed Ghalambor Abstract : The use of titanium fluoride and iron fluoride (TiF3/FeF3) catalysts in combination with polutetrafluoroethylene (PTFE) in plain zinc dialkyldithiophosphate (ZDDP) oil is important for the study of engine tribocomponents and is increasingly a strategy to improve the formation of tribofilm and to provide low friction and excellent wear protection in reduced phosphorus plain ZDDP oil. The influence of surface roughness and the concentration of TiF3/FeF3/PTFE were investigated using bearing steel samples dipped in lubricant solution @100°C for two different heating time durations. This paper addresses the effects of water drop contact angle using different surface finishes after treating them with different lubricant combination. The calculated water drop contact angles were analyzed using Design of Experiment software (DOE) and it was determined that a 0.05 μm Ra surface roughness would provide an excellent TiF3/FeF3/PTFE coating for...

Research paper thumbnail of Effects of break in period on the 4-ball wear tests using molybdenum disulphide (MoSշ) as EP additives in lithium based grease

Research paper thumbnail of The importance of 2 per cent PTFE/FeF3 additives in engine fully formulated oil for reducing friction and wear under boundary lubrication condition

Industrial Lubrication and Tribology

Purpose – This paper aims to focus on the topics of phosphorus (P) and sulfur (S) in engine oil. ... more Purpose – This paper aims to focus on the topics of phosphorus (P) and sulfur (S) in engine oil. Very reproducible boundary lubrication tests were conducted as part of Design of Experiments software to study the behavior of fluorinated catalyst iron fluoride (FeF3) and polytetrafluoroethylene (PTFE) in the development of environment-friendly (reduced P and S) anti-wear additives for future engine oil formulations. Multi-component fully formulated oils were used with and without the addition of PTFE and fluorinated catalyst to characterize and analyze their performance. Design/methodology/approach – A boundary lubrication protocol was used in the DOE tests to study their tribological behavior. Lubricant additives like PTFE and FeF3 catalyst were used at different concentrations to investigate the wear resistance and the time for a full breakdown under extreme loading conditions. Experiments indicated that new sub-micron FeF3 catalyst plays an important role in preventing the breakdow...

Research paper thumbnail of Optimization of Important Relief Areas in Prosthetic Socket for Below-Knee Amputees Using Design of Experiment and Finite Element Model

Journal of Prosthetics and Orthotics

Research paper thumbnail of Towards minimizing wear by improving antiwear additives and surface characteristics using reduced phosphorus plain ZDDP oil under boundary lubrication

Industrial Lubrication and Tribology

Research paper thumbnail of Analytical Thermal Solution to a Nonuniformly Powered Stack Package With Contact Resistance

Research paper thumbnail of Analytical Thermal Model of a Generic Multi-Layer Spacerless 3D Package

Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 2011

Research paper thumbnail of Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 1 — Modification of Heat Sink Assembly

Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, 2013

Research paper thumbnail of Multi-design variable optimization for a fixed pumping power of a water-cooled cold plate for high power electronics applications

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012

Research paper thumbnail of Coupled Computational Thermal and Mechanical Analysis of a Single Chip Flip Chip Module With Low-k Dielectric Medium

Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 2011

Research paper thumbnail of Combining Computational Fluid Dynamics (CFD) and Flow Network Modeling (FNM) for Design of a Multi-Chip Module (MCM) Cold Plate

Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, 2013

Research paper thumbnail of Enhanced Thermal Map Prediction and Floor Plan Optimization in Electronic Devices Considering Sub-Continuum Thermal Effects

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 2011

Research paper thumbnail of Estimation of temperature between plates of different footprints by an iterative approach

Inverse Problems in Science and Engineering, 2012

Research paper thumbnail of Determination of steady state temperature in a two-layer body with different form factors

International Journal of Heat and Mass Transfer, 2012

Research paper thumbnail of Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 1 — Modification of Heat Sink Assembly

Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, 2013

Research paper thumbnail of Analytical Solutions Of Steady-state Heat Conduction In Multi-layer Stack Packaging

Analytical models that can be utilized in modeling the steady-state temperature solutions of plan... more Analytical models that can be utilized in modeling the steady-state temperature solutions of planar and 3D packaged integrated circuits are discussed. This mathematically-driven model will include solutions for uniform and non-uniform footprint die stack systems as well as planar flip chip packages. These analytically obtained temperature solutions will include the contribution of thermal resistance for both cases as well as perfect contact scenarios. The acquired solution will accommodate any kind of boundary conditions (first, second and third kind) on the top and bottom surfaces of the stack system with the sides being adiabatic. Furthermore, the algorithm developed will consider volumetric heat generation as well as heat source at any cross section within the model. Finally, the diffusion equation for heterogeneous layers is solved using the Galerkin-based integral approach. The latest development pertains to the analytical solutions of the steady-state heat conduction in stacked dies of an electronic chipset with or without TSV (Through Silicon Via) technology. TSVs are used as interconnections between different dies in vertical layers. Furthermore, the effect of thermal conductance between the constituents of the layers is considered.

Research paper thumbnail of The Impact of Surface Roughness and PTFE/TiF3/FeF3 Additives in Plain ZDDP Oil on the Friction and Wear Behavior Using Thermal and Tribological Analysis under Extreme Pressure Condition

Authors : Gabi N. Nehme, Saeed Ghalambor Abstract : The use of titanium fluoride and iron fluorid... more Authors : Gabi N. Nehme, Saeed Ghalambor Abstract : The use of titanium fluoride and iron fluoride (TiF3/FeF3) catalysts in combination with polutetrafluoroethylene (PTFE) in plain zinc dialkyldithiophosphate (ZDDP) oil is important for the study of engine tribocomponents and is increasingly a strategy to improve the formation of tribofilm and to provide low friction and excellent wear protection in reduced phosphorus plain ZDDP oil. The influence of surface roughness and the concentration of TiF3/FeF3/PTFE were investigated using bearing steel samples dipped in lubricant solution @100°C for two different heating time durations. This paper addresses the effects of water drop contact angle using different surface finishes after treating them with different lubricant combination. The calculated water drop contact angles were analyzed using Design of Experiment software (DOE) and it was determined that a 0.05 μm Ra surface roughness would provide an excellent TiF3/FeF3/PTFE coating for...

Research paper thumbnail of Effects of break in period on the 4-ball wear tests using molybdenum disulphide (MoSշ) as EP additives in lithium based grease

Research paper thumbnail of The importance of 2 per cent PTFE/FeF3 additives in engine fully formulated oil for reducing friction and wear under boundary lubrication condition

Industrial Lubrication and Tribology

Purpose – This paper aims to focus on the topics of phosphorus (P) and sulfur (S) in engine oil. ... more Purpose – This paper aims to focus on the topics of phosphorus (P) and sulfur (S) in engine oil. Very reproducible boundary lubrication tests were conducted as part of Design of Experiments software to study the behavior of fluorinated catalyst iron fluoride (FeF3) and polytetrafluoroethylene (PTFE) in the development of environment-friendly (reduced P and S) anti-wear additives for future engine oil formulations. Multi-component fully formulated oils were used with and without the addition of PTFE and fluorinated catalyst to characterize and analyze their performance. Design/methodology/approach – A boundary lubrication protocol was used in the DOE tests to study their tribological behavior. Lubricant additives like PTFE and FeF3 catalyst were used at different concentrations to investigate the wear resistance and the time for a full breakdown under extreme loading conditions. Experiments indicated that new sub-micron FeF3 catalyst plays an important role in preventing the breakdow...

Research paper thumbnail of Optimization of Important Relief Areas in Prosthetic Socket for Below-Knee Amputees Using Design of Experiment and Finite Element Model

Journal of Prosthetics and Orthotics

Research paper thumbnail of Towards minimizing wear by improving antiwear additives and surface characteristics using reduced phosphorus plain ZDDP oil under boundary lubrication

Industrial Lubrication and Tribology

Research paper thumbnail of Analytical Thermal Solution to a Nonuniformly Powered Stack Package With Contact Resistance

Research paper thumbnail of Analytical Thermal Model of a Generic Multi-Layer Spacerless 3D Package

Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 2011

Research paper thumbnail of Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 1 — Modification of Heat Sink Assembly

Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, 2013

Research paper thumbnail of Multi-design variable optimization for a fixed pumping power of a water-cooled cold plate for high power electronics applications

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012

Research paper thumbnail of Coupled Computational Thermal and Mechanical Analysis of a Single Chip Flip Chip Module With Low-k Dielectric Medium

Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 2011

Research paper thumbnail of Combining Computational Fluid Dynamics (CFD) and Flow Network Modeling (FNM) for Design of a Multi-Chip Module (MCM) Cold Plate

Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, 2013

Research paper thumbnail of Enhanced Thermal Map Prediction and Floor Plan Optimization in Electronic Devices Considering Sub-Continuum Thermal Effects

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 2011

Research paper thumbnail of Estimation of temperature between plates of different footprints by an iterative approach

Inverse Problems in Science and Engineering, 2012

Research paper thumbnail of Determination of steady state temperature in a two-layer body with different form factors

International Journal of Heat and Mass Transfer, 2012

Research paper thumbnail of Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 1 — Modification of Heat Sink Assembly

Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, 2013

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