Aashish Shah | University of Waterloo (original) (raw)

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Research paper thumbnail of Mechanical and Tribological Aspects of Microelectronic Wire Bonding

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Research paper thumbnail of Reduction of underpad stress in thermosonic copper ball bonding

Abstract Ball bonding processes on test chips with Al metallized bonding pads are optimized with ... more Abstract Ball bonding processes on test chips with Al metallized bonding pads are optimized with one Au and two Cu wire types, all 25 mum diameter, obtaining average shear strengths of more than 120 MPa. The process temperature is about 110degC. The results demonstrate that ball bonds made with Cu wire show at least 15% higher shear strength than those made with Au wire.

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Research paper thumbnail of Ultrasonic friction power during Al wire wedge-wedge bonding

Abstract Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process u... more Abstract Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensively in the microelectronics industry for interconnections to integrated circuits. The bonding wire used is a 25 μm diameter AlSi1 wire. A friction power model is used to derive the ultrasonic friction power during Al wire bonding.

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Research paper thumbnail of In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding

Ultrasonic in situ force signals from integrated piezo-resistive microsensors were used previousl... more Ultrasonic in situ force signals from integrated piezo-resistive microsensors were used previously to describe the interfacial stick-slip motion as the most important mechanism in thermosonic Au wire ball bonding to Al pads. The same experimental method is applied here with a hard and a soft Cu wire type. The signals are compared with those obtained from ball bonds with standard Au wire.

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Research paper thumbnail of Stochastic Analysis of Human-machine Systems

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Research paper thumbnail of Effect of ultrasonic capillary dynamics on the mechanics of thermosonic ball bonding

… and Frequency Control …, Jan 1, 2010

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Research paper thumbnail of Availability analysis of a generalized maintainable three-state device parallel system with human error and common-cause failures

Journal of Quality in Maintenance …, Jan 1, 2007

Purpose–The purpose of this paper is to study the combined effect of human error, common-cause fa... more Purpose–The purpose of this paper is to study the combined effect of human error, common-cause failure, redundancy, and maintenance policies on the performance of a system composed of three-state devices. Design/methodology/approach–Generalized expressions for time-dependent and steady state availability of a generalized maintainable three-state device parallel system subjected to human errors and common-cause failures are developed in the paper under two maintenance policies: Type I repair policy (ie only the ...

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Research paper thumbnail of Reliability and availability analysis of three-state device redundant systems with human errors and common-cause failures

International Journal of Performability Engineering, Jan 1, 2007

Abstract: This paper presents stochastic models representing redundant three-state device systems... more Abstract: This paper presents stochastic models representing redundant three-state device systems with critical human errors and common-cause failures. The systems are analysed under two situations: without any repair and with repair. All the system transition rates, ie, open-mode and short-mode failure rates, critical human error rate, common-cause failure rate, and the repair rates are assumed constant. The Markov method is used to develop generalized expressions for system state probabilities, system reliability, and system ...

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Research paper thumbnail of Online methods to measure breaking force of bonding wire using a CMOS stress sensor and a proximity sensor

Sensors and Actuators A: Physical, Jan 1, 2008

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Research paper thumbnail of Low-stress thermosonic copper ball bonding

… , IEEE Transactions on, Jan 1, 2009

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Research paper thumbnail of Mechanical and Tribological Aspects of Microelectronic Wire Bonding

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Research paper thumbnail of Reduction of underpad stress in thermosonic copper ball bonding

Abstract Ball bonding processes on test chips with Al metallized bonding pads are optimized with ... more Abstract Ball bonding processes on test chips with Al metallized bonding pads are optimized with one Au and two Cu wire types, all 25 mum diameter, obtaining average shear strengths of more than 120 MPa. The process temperature is about 110degC. The results demonstrate that ball bonds made with Cu wire show at least 15% higher shear strength than those made with Au wire.

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Ultrasonic friction power during Al wire wedge-wedge bonding

Abstract Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process u... more Abstract Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensively in the microelectronics industry for interconnections to integrated circuits. The bonding wire used is a 25 μm diameter AlSi1 wire. A friction power model is used to derive the ultrasonic friction power during Al wire bonding.

Bookmarks Related papers MentionsView impact

Research paper thumbnail of In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding

Ultrasonic in situ force signals from integrated piezo-resistive microsensors were used previousl... more Ultrasonic in situ force signals from integrated piezo-resistive microsensors were used previously to describe the interfacial stick-slip motion as the most important mechanism in thermosonic Au wire ball bonding to Al pads. The same experimental method is applied here with a hard and a soft Cu wire type. The signals are compared with those obtained from ball bonds with standard Au wire.

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Research paper thumbnail of Stochastic Analysis of Human-machine Systems

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Research paper thumbnail of Effect of ultrasonic capillary dynamics on the mechanics of thermosonic ball bonding

… and Frequency Control …, Jan 1, 2010

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Research paper thumbnail of Availability analysis of a generalized maintainable three-state device parallel system with human error and common-cause failures

Journal of Quality in Maintenance …, Jan 1, 2007

Purpose–The purpose of this paper is to study the combined effect of human error, common-cause fa... more Purpose–The purpose of this paper is to study the combined effect of human error, common-cause failure, redundancy, and maintenance policies on the performance of a system composed of three-state devices. Design/methodology/approach–Generalized expressions for time-dependent and steady state availability of a generalized maintainable three-state device parallel system subjected to human errors and common-cause failures are developed in the paper under two maintenance policies: Type I repair policy (ie only the ...

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Research paper thumbnail of Reliability and availability analysis of three-state device redundant systems with human errors and common-cause failures

International Journal of Performability Engineering, Jan 1, 2007

Abstract: This paper presents stochastic models representing redundant three-state device systems... more Abstract: This paper presents stochastic models representing redundant three-state device systems with critical human errors and common-cause failures. The systems are analysed under two situations: without any repair and with repair. All the system transition rates, ie, open-mode and short-mode failure rates, critical human error rate, common-cause failure rate, and the repair rates are assumed constant. The Markov method is used to develop generalized expressions for system state probabilities, system reliability, and system ...

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Research paper thumbnail of Online methods to measure breaking force of bonding wire using a CMOS stress sensor and a proximity sensor

Sensors and Actuators A: Physical, Jan 1, 2008

Bookmarks Related papers MentionsView impact

Research paper thumbnail of Low-stress thermosonic copper ball bonding

… , IEEE Transactions on, Jan 1, 2009

Bookmarks Related papers MentionsView impact

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