Structural, electrical, thermal, mechanical properties and micro-hardness in Sn-based Sn-Pb-Al ternary alloys (original) (raw)
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Solid State Sciences, 2015
The structural, thermal, electrical and mechanical properties and micro-hardness of four different samples of Al-Sn-Pb ternary alloys (Al-[x] wt. % Sn-10 wt. % Pb) (x=40, 30, 20 and 10) with constant lead concentrations were investigated for four different samples. Electrical resistivity and conductivity were measured by using (four-point probe measurement techniques) 4PPT techniques. The variations of thermal conductivity were determined by Wiedemann-Franz law (W-F) and Smith-Palmer (S-P) equation using the data obtained from electrical properties. The mechanical properties of the same alloys were obtained by the tensile test and the Vickers micro-hardness test.
Cumhuriyet Science Journal, 2013
For the first time, the structural and electrical properties of Pb-Al-Sn composite system for constant tin concentrations were investigated in this work. The electrical conductivity of the samples depending on temperature was measured by four-point probe, and it was found that the conductivity decreases almost linearly with the temperature. The structural properties of the samples were determined by Scanning Electron Microscope (SEM), X-ray diffraction (XRD) and Energy Dispersive X - ray Analysis (EDX). The SEM micrographs of the samples illustrated smooth surfaces with a clear grain boundary. The crystal structure of the samples was indexed in face-centered cubic (fcc) by using XRD data. The cell parameters and the grain sizes were determined from the XRD patterns. In addition, the temperature coefficients of electrical resistivities were obtained determined, which were independent of the compositions of the composit...
Journal of Materials Science-materials in Electronics - J MATER SCI-MATER ELECTRON, 2000
Electrical transport properties, structure and mechanical properties of Pb50Sn50-xBix(0=x=50) alloys have been studied and analyzed. The addition of bismuth in the amounts of 30 wt % and 50 wt % results in the appearance of the crystalline metastable ?(Pb-Bi) phase. Y phase is also identified and it is found at 50 wt % bismuth. Electrical transport is sensitive to the alloys composition, decreasing as the bismuth content increases. The Vickers hardness number is sensitive to the structure of the quenched ribbons. The lowest value of Hv is 55 MPa for the Pb50Sn20Bi30 alloy, which is attributed to the formation of the metastable ?(Pb-Bi) after a rapid quench from the melt. Values of the equivalent Fermi temperature, TF Fermi velocity, VF and the Fermi wave vector, KF , are also computed. © 2000 Kluwer Academic Publishers
Thermal and Electrical Properties of Sn-Zn-Bi Ternary Soldering Alloys
Materials Sciences and Applications, 2015
Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work, eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their thermal and electrical properties. Thermo-mechanical Analysis and Differential Thermal Analysis were used to investigate thermal properties. Microstructural study is carried out with Scanning Electron Microscope. The alloys have single melting point. The coefficient of thermal expansion and coefficient of thermal contraction varies with alloy composition and temperature range. Electrical conductivity changes with Bi addition.
Journal of Power Sources, 2006
The effects of tin content and annealing temperature on the transformation sequences of Pb-0.08 wt.%Ca-x wt.%Sn supersaturated alloys (with x = 0.6, 1.2 and 2.0%) have been firstly studied from TEM observations and hardness measurements. Secondly, the age-hardening kinetics of these ternary alloys during isothermal holdings have been characterized by electrical resistivity measurements. In particular, it appeared that increase of tin content both delayed the main metallurgical stages and is accompanied by suppression of the first discontinuous reactions of ageing when the Sn/Ca ratio value is above 9. Moreover, the ageing kinetics are accelerated when increasing the annealing temperature because of the solute diffusion activation.
Metallic Materials
The effect of Si content (0.5, 1.5, and 5 wt.%) and growth velocity on the microstructure, microhardness, ultimate tensile strength, electrical resistivity, enthalpy, and specific heat properties of the directionally solidified Al-Mn eutectic alloy have been investigated. Al-1.94Mn-xSi (x = 0.5, 1.5, 5 wt.%) samples were prepared from pure metals (99.99 % purity) under the vacuum. These alloys were directionally solidified under constant temperature gradient G (4.9 K mm −1) and different growth velocities V (from 8.3 to 978 µm s −1) in a Bridgman-type growth apparatus. Measurements of primary dendrite arm spacing (λ), microhardness (HV), ultimate tensile strength (UTS) and electrical resistivity (ρ) of the samples were carried out and then expressed as functions of growth velocity and Si content (Co). Additionally, the enthalpy of fusion (ΔH) and specific heat capacity (Cp) for the same alloys were determined by a differential scanning calorimeter (DSC) from the heating curves. It has been found that the values of HV, UTS, and ρ increase with increasing values of V and Co. On the contrary, the values of λ decrease with increasing V. The increasing Si content in Al-Mn leads to a decrease of ΔH and Cp.
Journal of Wuhan University of Technology, 2017
The development of lead-free solders has emerged as one of the key issues in the electronics packaging industries. Bi-SnAg eutectic alloy has been considered as one of the lead-free solder materials that can replace the toxic Pb-Sn eutectic solder without increasing soldering temperature. We investigated the effects of temperature gradient and growth rate on the mechanical, electrical and thermal properties of the Bi-SnAg ternary eutectic alloy. Bi-47 wt%Sn-0.68 wt%Ag alloy was directionally solidified upward with different temperature gradients (G=2.33-5.66 K/mm) at a constant growth rate (V=13.25 μm/s) and with different growth rates (V=6.55-132.83 μm/s) at a constant temperature gradient (G=2.33 K/mm) in the growth apparatus. The microstructures (λ), microhardness (HV), tensile stress (σ), electrical resistivity (ρ), and thermal properties (ΔH, C p , T m) were measured on directionally solidified samples. The dependency of the λ, HV, σ, and ρ on G and V was investigated. According to the experimental results, λ values decrease with increasing G and V, but HV, λ, and ρ values increase with increasing G and V. Variations of electrical resistivity (ρ) for cast samples with the temperature in the range of 300-400 K were also measured by using a standard dc four-point probe technique. The enthalpy of fusion (ΔH) and specific heat (C p) for the same alloy was also determined by means of differential scanning calorimeter (DSC) from heating trace during the transformation from eutectic liquid to eutectic solid.