Improvement In The COP Of Thermoelectric Cooler (original) (raw)
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Compact design of thermoelectric cooler and its performance analysis
1ST INTERNATIONAL CONFERENCE ON MANUFACTURING, MATERIAL SCIENCE AND ENGINEERING (ICMMSE-2019), 2019
Thermoelectric cooling is one of the easiest and cheapest ways of recovering waste heat and convert it to obtain required cooling effect. A 127 couple thermoelectric cooler (TEC) is taken and its performance is analyzed. Also focus has been made to get an optimal and compact design with a better cooling capacity. Simulation is carried out in COMSOL Multiphysics 5.0 by varying parameters such as size and cross section of thermoelectric leg, number of couples in the module, thickness of copper conductor and the most important parameter the semiconductor material. Choosing Bismuth Telluride as semiconducting material, the cooling capacity is found to be 21.04 W when the TEC legs are made in circular cross section with 0.2 cm leg length and 41.87 W when leg length is 0.1 cm with copper plate thickness of 0.05cm which is almost double. With Bismuth antimony as a semiconductor material cooling effect is measured to be 538.38W for the same configuration which makes any designer to incline towards choosing this material. Non-linear circular cross section leg TEC, Bismuth Antimony as semiconducting material is giving a better cooling capacity than a non-linear square cross section leg TEC, Bismuth Telluride as material. For a given cooling capacity the size of TEC can be minimized since the results of 126 couple TEC is showing just 0.1 % lesser value as that of 127 couple TEC.
A Review on Thermoelectric Cooler
Energy disaster and environment pollution are the two major problems of 21 century. Thermoelectric devices are one of key solutions to these problems. These devices attract the researchers because of its solid state nature that converting the heat given off from vehicles, electrical instruments, etc. into the electricity. This paper contains the previous research on thermoelectric cooler and recent advance on it.
Performance analysis and assessment of thermoelectric micro cooler for electronic devices
Energy Conversion and Management, 2016
A novel operating mode of thermoelectric module (TEM, cooling, heating, generation) is established for electronic devices cooling, based on the method of effectiveness-number of transfer units (e À NTUÞ. This work mainly focused on the effect of thermoelectric properties and the scale of extender block on cooling performance under different operating conditions in order to obtain effective cooling operating mode. Based on the TEM parameters, two sets of analytical solutions for thermoelectric cooler (TEC) are derived for the chip temperature T j at a fixed cooling power Q c and Q c at a fixed T j, respectively. The performance of TEC with/without scale of extender block is studied for the lowest chip temperature and maximum cooling capacity at fixed conditions. Analysis results show the thermoelectric properties and extender block are significant characteristics for different operating conditions. However, the coefficient of performance (COP) and temperature difference changed a little under given thermoelectric properties. The results indicate TEC system applied in electronic devices obtains effectively cooling module by controlling operating parameters, which do not changed with scale of extender block. The validation of the present analysis is also conducted compared with previous studies and through the infrared thermal imager.
Performance of Novel Thermoelectric Cooling Module
A geometrical shape factor was investigated for optimum thermoelectric performance of a thermoelectric module using finite element analysis. The cooling power, electrical energy consumption, and coefficient of performance were analyzed using simulation with different current values passing through the thermoelectric elements for varying temperature differences between the two sides. A dramatic increase in cooling power density was obtained, since it was inversely proportional to the length of the thermoelectric legs. An artificial neural network model for each thermoelectric property was also developed using input-output relations. The models including the shape factor showed good predictive capability and agreement with simulation results. The correlation of the models was found to be 99%, and the overall prediction error was in the range of 1.5% and 1.0%, which is within acceptable limits. A thermoelectric module was produced based on the numerical results and was shown to be a promising device for use in cooling systems.
ARTICLE INFO Cooling of electronics component is one of the major challenges faced by thermal engineers. In recent years, a significant increase in microprocessor power dissipation coupled with CPU size has resulted in an increase in heat fluxes. Microprocessor heat fluxes have also increased for many commercial applications. Therefore, thermal management is becoming one of most challenging issues and an important subject in regard to cooling system performance. For a number of applications, direct air-cooling systems like by applying blower, fan or water cooling are having moving parts and not reliable for continuous operation for long time and will have to be replaced or enhanced by other high performance compact cooling techniques. Liquid–vapor phase change, impinging jets spray, the use of thermoelectric modules and heat pipes are attractive cooling solutions for removing high heat fluxes because of their high heat transfer coefficients. In the present work we perform the initial experimental investigation and basic mathematical modeling to determine the thermal performance of thermoelectric module integrated with heat pipe for electronics cooling at different operating variables and parameters. Currently the experiments are in progress, so we put our initial experimental setup and discussions. The detail results after experiments will help us to analyze the temperature distribution and heat transfer limitation characteristic in thermoelectric module and its role in future of electronics cooling.
A Study on Thermal and Electrical Characteristics of Thermoelectric Cooler TEC1-127 Series
Thermoelectric Coolers (TECs) are widely used in industry for refrigeration applications. Although ample researches have been done on TECs, those are based on either modeling of TECs or applications of TECs. Hence, users find it difficult to gather required information of TECs when those are to be used in applications. This research is based on TEC1-127 series to study their thermal and electrical characteristics. This work includes major results of tests that were conducted in order to identify the relationship between voltage and temperature/ temperature gradient of two surfaces/ current flow in TEC. This also includes results of difference in behavior of, ten sample TECs, the relationship between the number of TECs and time required to cool a static air volume and efficiency and impact of different cooling methods to remove heat from TEC surfaces. Besides test results, the paper includes a discussion on practical limitations of mass scale manufactured TECs.
Analytical Investigation of Thermoelectric Performance for Cooling Application
This paper presents the method used to predict the internal parameters of thermoelectric module (TEM) and the several factors that affect the temperature reduction of air in Thermoelectric (TE) cooling system. A TE cooling system consists of three TEMs attached on the top of an air duct with the dimensions 9.3 cm × 9.3 cm × 55 cm. Ambient air flows through the duct and its outlet temperature is estimated by using the log mean temperature difference (LMTD) method for different weather conditions. At the considered conditions, results showed that 6 A is the optimum operating current, and the maximum temperature reduction can reach to 2.41 °C. The performance of TE cooling system strongly depends on the ambient condition and for the considered 40 hours weather conditions, the maximum temperature reduction happened at around 3 pm. It was also found that the increase of inlet air velocity causes the temperature reduction to decrease exponentially. As a result, this study identified the correlate effects of the ambient weather, the operating current and the air velocity on the TE cooling system. As one does not have control on the ambient weather, selecting the optimum operating current level and inlet air velocity of the system is important to fully utilize the cooling effect of the system.
Design of Thermoelectric Air Cooler: A Review
The impact of ongoing progress in Science and Technology has created variety of systems that can be used in producing of refrigeration effect with the use of thermoelectric module and photovoltaic module for generation of energy in which we further use for cooling and heating effect. The most important utilization of this portable air cooler is for to deliver cold air. A Thermoelectric module (Peltier Module) is used instead of refrigeration system (VCC or VAC cycle). The most important utilization of this air cooler is for to deliver cold air. A Thermoelectric module (TEM) is used as it is based on the principles of Peltier effect. The use ofPeltier effect is to create heating side and cooling side and also to maintain effectiveness. Thermoelectric Air cooler (TEAC) is a solid state heat pump in which uses the components that are available commercially. The thermoelectric refrigerator does not produce chlorofluorocarbon (CFC). It is pollutant free-contains no liquids or gases, portable, compact, creates no vibration or noise because of the difference in the mechanics of the system. It is a prototype and its semiconductor materials, by Peltier effect, to provide instantaneous cooling or heating. It has the advantage of having no moving parts and thus maintenance free.
Journal of Physics: Conference Series, 2020
Thermoelectric cooler is one type of refrigeration system that is environmentally friendly because it does not use refrigerants which have potential damaging the ozone layer. In this study, an experimental performance of thermoelectric refrigerator using fan and without fan is presented. The result shows that the cold side temperature decreases from 25.5 degree C to-5 degree C for 37 watt (with fan) and 25.5 degree C to-7.5 degree C for 37-watt without fan. Using 43-watt power supply, the cold side decreases from 25 degree C to-5 degree C for fan usage, and from 26 degree C to-7.5 degree C in 60 minute and 75 minutes, respectively. Using fan for cold sink inside the cabin will distribute the cabin temperature of cool box evenly and also increase the capability of heat transfer performance of cooler box of thermoelectric. Maximum average COP is 0.103 and achieved by 37-watt power supply with cold sink fan.