Investigations on assembling of electronic packages onto glass substrates using lead-free technology (original) (raw)

2008 31st International Spring Seminar on Electronics Technology, 2008

Abstract

In the last decade new materials were launched on the market. This is the case of PCB substrates, also. Requirements for improved heat transfer between power components and the solid metal base led to a new PCB technology, on copper and aluminum substrates. Typical applications are those where high level of heat has to be dissipated from the circuit (in

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