Reliability analysis of electronic equipment subjected to shock and vibration – A review (original) (raw)

A Comparative Overview of Electronic Devices Reliability Prediction Methods-Applications and Trends

Majlesi Journal of Telecommunication Devices, 2017

Reliability prediction is vital in the conception, definition, design, development, operation and maintenance phase of electronic devices. It is needed at various system levels and degrees of detail, in order to evaluate, determine and improve the dependability measures of an item when designing electronic devices in view of the high level competition among device manufacturers. Different reliability prediction methods or models are available for electronic devices. This paper comparatively examined the commonly used methods such as empirically based failure rate modeling methodologies used in reliability prediction handbooks, and physics of failure (PoF) based models. Three empirical approaches such as MIL-HDBK-217F – a conservative standard applicable principally to military equipment, and Bellcore TR-332/Telcordia SR-332, which are applicable to commercial devices are reviewed in closer details. Also reviewed is Recueil de Donnes de Fiabilite (RDF) 2000, used in Telecom industry....

Virtual Remaining Life Assessment of Electronic Hardware Subjected to Shock and Random Vibration Life Cycle Loads

2007

This study presents a physics-of-failure-based virtual remaining life assessment method for assessing the remaining life of an electronic circuit card. The approach is then demonstrated through a case study of a circuit card assembly in the Space Shuttle solid rocket booster. Using thermal and mechanical stress damage models, the accumulated damage in the circuit card due to the life cycle environment loads on the card was calculated. Based on the amount of damage accumulated, the remaining life of the circuit card was estimated.

Reliability assessment of electronic components exposed to long-term non-operating conditions

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1998

This paper targets the reliability of electronics components, specially avionics and automotive electronic system, under random vibration conditions. A fatigue life estimation procedure is presented and each step of procedure is explained. Finite Element model of the test vehicle is built in ANSYS. The model is first validated by correlating the natural frequencies, mode shapes and transmissibility functions from simulation with experimentally measured ones. The model is then used to simulate random vibration response spectrum at critical solder interconnects. The obtained results are then transformed into time domain and it's number of cycles are counted to determine the effective number of cycles which can then be used to predict fatigue life with Miner's damage rule.

Comparison of failure characteristics of different electronic technologies by using modified physics-of-failure approach

International Journal of System Assurance Engineering and Management, 2014

The electronic components are used in several safety and maintenance systems that require accurate reliability prediction for higher availability. The traditional reliability prediction methods that draw on standard handbooks such as MIL-HDBK 217F, Telcordia, CNET etc., are inappropriate to determine the reliability indices of these components due to empirical methods does not comply with operating life cycle and technology advancements. The progressive reliability prediction methodology, the physicsof-failure (PoF), emphasizes the root cause of failure, failure analysis, and failure mechanisms based on the analysis of parameter characteristics. However, there is a limitation: it is sometimes difficult to obtain manufacturer's details for failure analysis and quality information. Several statistical and probability modeling methods can be performed on the experimental data of these components to measure the time to failure. These experiments can be conducted using the accelerated-testing of dominant stress parameters such as voltage, current, temperature, radiation etc. In this paper, the combination of qualitative data from PoF approach and quantitative data from the statistical analysis is used to create a modified physics-of-failure approach. The critical electronic components used in certain safety systems from different technologies are chosen for reliability prediction: optocoupler, constant fraction discriminator, BJT transistor, voltage comparator, voltage follower and instrumentation amplifier is studied. The failure characteristics of each of the technologies are studied and compared according to operating conditions. Keywords Reliability prediction Á Failure modeling Á Time-to-failure Á Design of experiments Á Accelerated testing

Reliability assessment of electronic components under random vibration loading

2009

This paper targets the reliability of electronics components, specially avionics and automotive electronic system, under random vibration conditions. A fatigue life estimation procedure is presented and each step of procedure is explained. Finite Element model of the test vehicle is built in ANSYS. The model is first validated by correlating the natural frequencies, mode shapes and transmissibility functions from simulation with experimentally measured ones. The model is then used to simulate random vibration response spectrum at critical solder interconnects. The obtained results are then transformed into time domain and it's number of cycles are counted to determine the effective number of cycles which can then be used to predict fatigue life with Miner's damage rule.

Reliability assessment of aerospace electronic equipment

Quality and Reliability Engineering International, 1999

Reliability assessment has been discussed extensively in the commercial aerospace and military avionics industries where, unlike most other industries, it is necessary to have formal, quantitative estimates of the reliability of products prior to the start of production. Until recently, handbook databases and equations were used almost universally for electronic equipment reliability prediction based on failure rates; however, handbook usage is declining and new approaches are needed. Representatives of a large segment of the aerospace industry have worked together to develop an alternative. The Reliability Assessment Program (RAP) is credible, easy to use and holds promise for wide acceptance. RAP does not prescribe a uniform method for all users; instead, it is flexible, encouraging the user to take into account all the unique design, manufacturing and use factors critical to the reliability of the product being assessed. A RAP document is being developed as an industry consensus standard for aerospace electronic equipment manufacturers to use in documenting their reliability assessment processes, including data sources, calculation and analysis methods, results reporting and continuous improvement of the assessment process by comparing assessment results with achieved in-service reliability. RAP is described in this paper, along with current activities to implement it and gain acceptance across the industry.

Prognostics implementation of electronics under vibration loading

Microelectronics Reliability, 2007

In this paper, a methodology is developed for monitoring, recording, and analyzing the life-cycle vibration loads for remaining-life prognostics of electronics. The responses of printed circuit boards to vibration loading in terms of bending curvature are monitored using strain gauges. An analytical model calibrated by finite element analysis is developed to calculate the strain at interconnects using the measured response. The interconnect strain values are then used in a vibration failure fatigue model for damage assessment. Damage estimates are accumulated using Miner's rule after every mission and then used to predict the life consumed and remaining-life. The methodology has been demonstrated for remaining-life prognostics of a printed circuit board. The result has also been verified by the real-time to failure of the components by checking the components' resistance data.

Life Prediction and Damage Equivalency for Shock Survivability of Electronic Components

2006

There is a fundamental need for development of predictive techniques for electronic failure mechanisms in shock and drop-impact. Presently, one of the primary methodologies for assessment of shock and vibration survivability of electronic packaging is the JEDEC drop test method, JESD22-B111 which tests board-level reliability of packaging. However, packages in electronic products may be subjected to a wide-array of boundary conditions beyond those targeted in the test method. Development of damage-equivalency methodologies will be invaluable in correlating standard test conditions to widely varying design-use conditions. In this paper, the development of a solder-joint stress based relative damage index has been investigated to establish a method for damage equivalency. Modal analysis, wavelet decomposition, and explicit finite element analysis has been used to assess reliability performance of the electronic boards. Deformation kinematics have been measured with the help of ultra high-speed data acquisition and video systems. Experimental data has been correlated to the finite element models. Failure predictions along with their modes and mechanisms have been discussed. Damage proxies for failure mechanisms in first-level interconnects have been developed. The approach is scalable to a wide variety of electronic applications. Component types examined include, plastic ball-grid arrays, flex ball-grid arrays for various pitch sizes between 0.5 mm to 1 mm in both 63Sn37Pb and 95.5Sn4.0Ag0.5Cu solder alloy compositions. Dynamic measurements like acceleration, strain and resistance are measured and analyzed using highspeed data acquisition system capable of capturing in-situ strain, continuity and acceleration data in excess of 5 million samples per second. Ultra high-speed video up to 50,000 fps has been used to capture the deformation kinematics. Experimental results are correlated with finite element models which include reduced integration element formulations

The IEEE standards on reliability program and reliability prediction methods for electronic equipment

Microelectronics Reliability, 2002

Reliability is the ability of a part or product to perform as intended (i.e., without failure and within specified performance limits) for a specified time, in its life cycle application environment. Reliability specification and demonstration is an activity between customers and suppliers. In the absence of proper procedure, this activity may not meet the customer requirements and product needs. IEEE standard 1332 was developed to streamline the process of developing a reliability program that is value added and suits the needs of both customers and suppliers. This standard is briefly introduced in this paper.