A new fabrication method of low stress PECVD SiNx layers for biomedical applications (original) (raw)

Low temperature deposition of SiNx thin films by the LPCVD method

2011

Thin silicon rich nitride (SiNx) films were deposited using the LPCVD (Low Pressure Chemical Vapor Deposition) method. Films with the different values of the nitrogen content were deposited by varying the ratio of the flows of ammonia and silane in the horizontal tube reactor. The films were characterized in terms on the surface quality (by scanning electron microscopy), in terms of the nitrogen content x by time of flight elastic recoil detection analysis and by Raman and FTIR spectroscopy.

SiNx barrier layers deposited at 250°C on a clear polymer substrate

MRS Proceedings, 2006

ABSTRACTInterest is widespread in flexible thin-film transistor backplanes made on clear polymer foil, which could be universally employed for a variety of applications. All ultralow process temperatures, plastic compatible thin film transistor (TFT) technologies battle short or long term device instabilities. The quality and stability of amorphous silicon thin-film transistors (a-Si:H TFTs) improves with increasing process temperature. TFT stacks deposited at less than 250°C by radio frequency plasma enhanced chemical vapor deposition (RF-PECVD) exhibit higher threshold voltage shifts after gate bias stressing than stacks deposited at ∼300°C in the active matrix liquid-crystal display (AMLCD) industry [1]. Therefore, optically clear plastic (CP) substrates are desired that tolerate high process temperatures. The first step in a-Si:H TFT fabrication on a polymer is the deposition of a planarizing barrier and adhesion layer. For this purpose we have been using silicon nitride (SiNx) ...

Chapter Book – Thin films for tissue engineering applications

The role of surface interactions with biological systems is extremely important in tissue engineering applications. Thin films have attracted much attention because of their ability to change these surface interactions selectively. In this concept, many coating technologies have been developed, such as spin-coating, layer-by-layer assembly, dip-coating, electrophoretic deposition, chemical vapour deposition, pulsed laser deposition, the solgel process, etc. It is believed that a combination of these technologies can effectively solve problems associated with the rapid fixation of implants into tissues. These thin films with an optimized composition and structure on different surfaces can significantly improve the integration of tissue-engineered constructs. This chapter describes recent advances and future prospects of using thin films for innovative tissue engineering applications.