Transient Scattering from Metallic Enclosures Using 3D Time Domain Methods (original) (raw)

Springer eBooks, 2003

Abstract

In this paper we present efficient models to study the coupling of an electromagnetic wave with electronic equipment enclosures. The 3D Maxwell’s equations are solved using a Finite Element Time Domain method (FETD) and Transmission-Line Modeling Method (TLM). Numerical results are compared with those obtained by measurements or already published results.

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