Spatially Resolved Characterization of Electromigration-Induced Plastic Deformation in al (0.5WT% CU) Interconnect
Rozaliya I Barabash
MRS Proceedings, 2002
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Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt % Cu) interconnect
Nobumichi Tamura
Journal of Applied Physics, 2003
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Quantitative Characterization of Dislocation Structure coupled with Electromigration in a Passivated Al (0.5 wt% Cu) Interconnects
Nobumichi Tamura
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Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction
Nobumichi Tamura
Journal of Applied Physics, 2008
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Distribution and evolution of plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotronpolychromatic X-ray microdiffraction
Nobumichi Tamura
2007
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In-situ early stage electromigration study in Al line using synchrotron polychromatic X-ray microdiffraction
Nobumichi Tamura
MRS Proceedings, 2008
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Electromigration-Induced Plastic Deformation in Cu Damascene Interconnect Lines as Revealed by Synchrotron X-Ray Microdiffraction
Arief Budiman
MRS Proceedings, 2006
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Coupling between precipitation and plastic deformation during electromigration in a passivated Al (0.5 wt% Cu) interconnect
Nobumichi Tamura
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Grain-Scale Strain and Orientation Measurements during Electromigration in Al Conductor Lines by Synchrotron X-Ray Microbeam Diffraction
Hongqing Zhang
MRS Proceedings, 2007
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Microstructural and surface effects on electromigration failure mechanism in Cu interconnects
Alexander Palevski
Microelectronics Reliability, 1997
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Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction
Nobumichi Tamura
Applied Physics Letters, 2006
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Analysis of grain-boundary structure in Al–Cu interconnects
John Sanchez
Journal of Applied Physics, 1997
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X-ray microdiffraction study of Cu interconnects
Zhong-hou Cai
Applied Physics Letters, 2000
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Unexpected Mode of Plastic Deformation in Cu Damascene Lines Undergoing Electromigration
W. Nix
MRS Proceedings, 2004
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Stress‐Induced Anisotropy of Electromigration in Copper Interconnects
Johann Cervenka
2009
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Measurement of strain in Al–Cu interconnect lines with x-ray microdiffraction
Zhong-hou Cai
Journal of Applied Physics, 1999
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Observation and Modelling of Electromigration-Induced Void growth in Al-Based Interconnects
Stefan Bader
MRS Proceedings, 1993
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Simulations of Dislocation Dynamics in Aluminum Interconnects
Erik Van der Giessen
MRS Proceedings, 2002
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Electromigration-induced plastic deformation in passivated metal lines
Alastair MacDowell
Applied Physics Letters, 2002
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Effect of microstructure on electromigration kinetics in Cu lines
Yuri Kaganovskii
Journal of Physics D: Applied Physics, 1998
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Damage mechanics of electromigration in microelectronics copper interconnects
Cemal Basaran
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Investigation of the role of compositional effects on electromigration damage of metallic interconnects
L. Reggiani
Computational Materials Science, 2001
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In situ X-ray Microscopy Studies of Electromigration in Copper Interconnects
Ehrenfried Zschech
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Electromigration Failure Kinetics in Al Alloy Lines: A Microstructure-Based Constitutive Equation
Choong-Un Kim
MRS Proceedings, 1998
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Electromigration failure in ultra-fine copper interconnects
Choong-un Kim
Journal of Electronic Materials, 2003
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Strain-Induced Grain Growth during Rapid Thermal Cycling of Aluminum Interconnects
Roy Geiss
Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science, 2007
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Void nucleation and growth during electromigration in 30 nm wide Cu lines: Impact of different interfaces on failure mode
Kris Vanstreels
2013 IEEE International Interconnect Technology Conference - IITC, 2013
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Dislocation mechanism of interface point defect migration
kedarnath kolluri
2010
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In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures
Ehrenfried Zschech
Microelectronic Engineering, 2002
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