Compact and passive-alignment 4-channel × 25-Gbps optical interconnect modules based on silicon optical benches with 45° micro-reflectors (original) (raw)
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VCSEL array module using (111) facet mirrors of a V-grooved silicon optical bench and angled fibers
IEEE Photonics Technology Letters, 2000
We propose an advanced scheme of optical subassembly (OSA) using a silicon optical bench (SiOB) for the vertical-cavity surface-emitting laser (VCSEL) array. The VCSEL beams were deflected on the (111) end facets of the V-grooves in a SiOB and were coupled into the angled fibers. The inclined angle and position of the fibers were designed to maximize the coupling efficiency. The fabricated OSA showed a coupling efficiency of 30%-50% and a large misalignment tolerance of about 90 m along the longitudinal direction of the V-grooves. Data transmission of 2.5 Gb/s 12 channels was demonstrated with clear eye diagrams.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013
For short-and long-wavelength vertical surfaceemitting lasers (VCSELs), performances of optical transmitter array modules with vertically and horizontally packaged structures are analyzed for application to on-board optical interconnection. 850 and 1310 nm wavelengths are selected for the short-and long-wavelength light sources. For each wavelength, top-and bottom-emitting VCSELs are used to compare the performances of four different module structures: bottomemitting types of 850 and 1310 nm for the vertical modules, and top-emitting types of 850 and 1310 nm for the horizontal modules. The horizontal transmitter modules are packaged using the conventional wire-bonding technology for the interconnect between VCSEL and driver chips while the vertical modules are packaged using the flip-chip-bonding technology. Signal crosstalk is investigated using 1 × 4 VCSEL array chips, which are driven using the same Si-CMOS circuits designed for 5 Gb/s operation. The vertical modules show lower crosstalk than the horizontal modules. When the gap distance between the VCSEL aperture and the waveguide input port increases up to 500 µm for each module, the crosstalk increases in a range −58 to −37 dB. The 3-dB bandwidth performances are sensitively degraded in a range 4.6-2.0 GHz when the gap distance increases. In the crosstalk, the 1310-nm vertical module shows the best performance, while in the 3-dB bandwidth, the 850-nm horizontal module shows the best performance. The four modules shows clear eye openings at 2.5 Gb/s with bit error rate < 10 −12 and can be used for on-board optical interconnections.
A 36-channel parallel optical interconnect module based on optoelectronics-on-VLSI technology
2003
We describe the packaging and testing of a two-dimensional array parallel-optics module with 36 channels with each channel operating up to 3.3 Gb/s. This represents the first commercial module based on direct integration of vertical-cavity surface-emitting lasers (VCSELs) onto Silicon very large scale integration (VLSI) circuits using a hybrid optoelectronic-VLSI technology. The module eliminates wire bonds between the driver/receiver chips and the corresponding VCSELs therby reducing crosstalk and power dissipation, simplifying packaging and alignment, and simultaneously improving bandwidth and total link jitter performance.
SPIE Proceedings, 2009
Multichip transmitter modules in which VCSEL chips were packaged on Si-CMOS driver IC chips have been investigated to apply in the optical interconnection using optical printed-circuit board. The modules were prepared using of 1 x 4 bottom-emitting VCSELs which were flip-chip-bonded on a driver IC fabricated by 0.18 μm Si-CMOS technology. Dynamic characteristics and optical crosstalk were compared for two types of VCSELs; 850 nm short-wavelength and 1310nm long-wavelength VCSELs. The two modules showed bit error rate less than 10-12 with clear eye openings at 2.5 Gbps. The 3-dB bandwidth was 3.2 GHz for the 850 nm module and 3.8 GHz for the 1310 nm module. When the VCSEL aperture was directly contacted with the input port of the fiber, the optical crosstalk within the 3-dB bandwidth showed-53.2 dB for 850 nm module and-57.2 dB for 1310 nm module. These low crosstalk values for both modules might be attributed to the flat surface of the bottom-emitting VCSEL devices allowing tight contact with the fiber surface. This low optical crosstalk performance is an additional advantage of the multichip module, adding to the general advantages in compact packaging and low electrical crosstalk.
Alignment Tolerant Slim Optical Interconnect for On-Board Interconnections
Journal of Lightwave Technology, 2016
A four-channel slim optical interconnect is proposed and realized, featuring relaxed structural tolerance along with passive alignment. A compact micro-optic beam coupler in plastic, in which a prism and lens are integrated with a plastic optical fiber (POF) guide in a single body, is commonly incorporated in the transmitter (Tx) and receiver (Rx). A pair of finely controlled reference holes is created in a printed circuit board (PCB), onto which a vertical cavity surface emitting laser (VCSEL) and photodetector (PD) are mounted. The optical coupling for VCSEL-to-POF and POF-to-PD was meticulously performed via the pick-and-place scheme in a cost effective manner, through the mediation of the beam coupler in conjunction with the reference holes. For the manufactured slim interconnect, the effective thicknesses of the Tx and Rx modules were only 1.43 mm. The achieved 3-dB alignment tolerances were 28 and 46 μm for the VCSEL and PD, respectively. The proposed optical interconnect was finally demonstrated to deliver high speed video data at 5.4 Gb/s with high fidelity.
Gb/s/ch Long Wavelength Transmitter Modules for Chip-to-Chip Optical PCB Applications
—We have fabricated 2.5-Gb/s/ch long wavelength optical transmitter modules in planar and multichip module structures for chip-to-chip optical printed-circuit board (OPCB) applications. Their performance has been analyzed and compared with two types of short wavelength structures. The long wavelength multichip module showed a 3-dB bandwidth of 2.46 GHz while the planar showed 2.16 GHz. The modules showed clear eye openings at 2.5 Gb/s with a bit-error rate less than and can be used for optical interconnections in OPCBs. Index Terms—Flip-chip bonding, long wavelength vertical cavity surface-emitting laser (VCSEL), optical intercon-nection, optical printed-circuit board (OPCB), short wavelength VCSEL, silicon complementary metal–oxide–semiconductor (Si-CMOS) driver integrated circuit (IC).
Photonics Packaging, Integration, and Interconnects IX, 2009
Multichip transmitter modules in which VCSEL chips were packaged on Si-CMOS driver IC chips have been investigated to apply in the optical interconnection using optical printed-circuit board. The modules were prepared using of 1 x 4 bottom-emitting VCSELs which were flip-chip-bonded on a driver IC fabricated by 0.18 μm Si-CMOS technology. Dynamic characteristics and optical crosstalk were compared for two types of VCSELs; 850 nm short-wavelength and 1310nm long-wavelength VCSELs. The two modules showed bit error rate less than 10 -12 with clear eye openings at 2.5 Gbps. The 3-dB bandwidth was 3.2 GHz for the 850 nm module and 3.8 GHz for the 1310 nm module. When the VCSEL aperture was directly contacted with the input port of the fiber, the optical crosstalk within the 3-dB bandwidth showed -53.2 dB for 850 nm module and -57.2 dB for 1310 nm module. These low crosstalk values for both modules might be attributed to the flat surface of the bottom-emitting VCSEL devices allowing tight contact with the fiber surface. This low optical crosstalk performance is an additional advantage of the multichip module, adding to the general advantages in compact packaging and low electrical crosstalk.
40 Gb/s optical subassembly module for a multi-channel bidirectional optical link
Optics Express, 2014
A 40 Gb/s bidirectional optical link using four-channel optical subassembly (OSA) modules and two different wavelengths for the up-and down-link is demonstrated. Widely separated wavelengths of 850 nm and 1060 nm are used to reduce the optical crosstalk between the up-and downlink signals. Due to the integration capabilities of silicon, the OSA is implemented, all based on silicon: V-grooved silicon substrates to embed fibers and silicon optical benches (SiOBs) to mount optical components. The SiOBs are separately prepared for array chips of photodiodes (PDs), vertical-cavity surface-emitting lasers (VCSELs), and monitoring PDs, which are serially configured on an optical fiber array for direct coupling to the transmission fibers. The separation of the up-and down-link wavelengths is implemented using a wavelength-filtering 45° mirror which is formed in the fiber under the VCSEL. To guide the light signal to the PD another 45° mirror is formed at the end of the fiber. The fabricated bidirectional OSA module shows good performances with a clear eyediagram and a BER of less than 10 −12 at a data rate of 10 Gb/s for each of the channels with input powers of −8 dBm and −6.5 dBm for the up-link and the down-link, respectively. The measured inter-channel crosstalk of the bidirectional 40 Gb/s optical link is about −22.6 dB, while the fullduplex operation mode demonstrates negligible crosstalk between the upand down-link.
IEEE Photonics Technology Letters, 2006
We present the operation characteristics of 850-nm wavelength GaAs-based monolithically integrated transceiver chips designed for low-cost short-distance bidirectional optical data transmission over a butt-coupled 200-m core diameter polymer-clad silica fiber. The chips containing a vertical-cavity surface-emitting laser and a large-area metal-semiconductor-metal photodiode can well handle data rates of 2.5 Gb/s in back-to-back mode and 0.5 Gb/s for 10-m fiber length.
Optical interconnect modules with fully integrated reflector mirrors
IEEE Photonics Technology Letters, 2005
A robust and cost-effective technology for integration of 45 reflector mirrors and polymer waveguides (WGs) into optical interconnect (OI) substrates is developed. The planar WGs are formed from photopatternable polymers with propagation losses as low as 0.05 dB/cm. The mirrors with losses of 0.5-0.8 dB are fabricated by the microdicing technique allowing lateral and vertical positioning of the mirror plane within several microns. A prototype OI module with integrated channel WGs, mirrors, and assembled connectors is fabricated and successfully tested at 10-Gb/s transmission rate.