Attaining Process Robustness through Design of Experiment and Statistical Process Control (original) (raw)

Abstract

Two important aspects of Quality Management, regarding to Life Cycle Product: • Design of Experiment (DoE), as part of Quality Engineering, and • Statistical Process Control (SPC), as a part of Quality Assurance/Control, will be considered in this paper, through an example of microelectronic package. The essential process in microelectronic assembly is wire bonding process. Design of Experiment has been performed in order to achieve robust thermosonic copper wire bonding process. Process robustness has been measured by implemented Statistical Process Control. Together, it assures higher reliability level in the microelectronic package life cycle.

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