Deformation Behavior of Pure Cu and Cu-Ni-Si Alloy Evaluated by Micro-Tensile Testing (original) (raw)
Related papers
Heterogeneous Deformation Behavior of Cu-Ni-Si Alloy by Micro-Size Compression Testing
Crystals, 2020
The aim of this study is to investigate a characteristic deformation behavior of a precipitation strengthening-type Cu-Ni-Si alloy (Cu-2.4Ni-0.51Si-9.3Zn-0.15Sn-0.13Mg) by microcompression specimens. Three micropillars with a square cross-section of 20 × 20 × 40 μm3 were fabricated by focused ion beam (FIB) micromachining apparatus and tested by a machine specially designed for microsized specimens. The three pillars were deformed complicatedly and showed different yield strengths depending on the crystal orientation. The micromechanical tests revealed work hardening by the precipitation clearly. Electron backscattered diffraction analysis of a deformed specimen showed a gradual rotation of grain axis at the grain boundaries after the compression test.
Effects of microstructure on mechanical properties of CuNiSi alloys
Journal of Alloys and Compounds
There is an increasing demand for precipitation-hardened Cu-Ni-Si alloys in the industry, where the high strength and moderate electrical conductivity are required. The main objective of this study was to apply a combination of microstructure refinement using swaging (SW) to generate an ultrafine-grained (UFG) microstructure in Cu-2.5 wt%Ni-0.5 wt%Si-0.06 wt%Mg (Cu-2.5Ni-0.5Si-0.06Mg), along with an optimized precipitation hardening. As a result, a substantial improvement of mechanical properties of the swaged samples (UFG condition) after precipitation hardening is apparent as compared to the precipitation-hardened non-swaged samples (coarse-grained (CG) condition). The mechanical properties of the UFG state are significantly superior to those of the CG state, i.e., a sharp increase in the elongation to fracture of 14% and a tensile strength of 800e900 MPa can be achieved. This study summarizes a detailed description of the microstructure after different processing steps using optical microscope (OM), electron channeling contrast imaging (ECCI) methods, and transmission electron microscopy (TEM), and presents the consequences on the most important mechanical properties such as the strength and ductility.
Effects of Deformation on Microstructure of Cu-Zn-Ni Alloy
The thermal and mechanical effects on microstructure of Cu-12.44%Zn-4.75%Ni (wt%) alloy were investigated. The effects mechanical on both rapidly cooled sample and slowly cooled sample obtained from Cu-Zn-Ni alloy were investigated by using scanning electron microscopy (SEM), X-ray diffraction techniques (XRD). The thermal energy changes of in the alloy were examined by means of differential scanning calorimetry (DSC). As a result of SEM observations, annealing twins structures are observed in rapidly and slowly cooled samples. According to pictures of the SEM and XRD, the stress applied to samples caused to lose existing annealing twins, and led to formation of slip planes lying parallel to each other in between plates. The stress-strain behaviour is associated with applied heat treatment effect to samples. It's shown that the intensities of XRD peaks to be decrease, as a result of the increase in cooling rate. This result indicates that density defects of crystal increases with rapidly cooled in the Cu-Zn-Ni alloy. In both samples of the thermal energy changes, at the process of diffusion transformation eutectoid separation reactions have been proved to exist.
Precipitation Strengthening of Cu–Ni–Si Alloy
Materials
The work examines the effect of rhenium addition on the structure and properties of Cu–2Ni–1Si alloys. The aim of this work was to answer the question of how the addition of rhenium will affect the strengthening mechanisms of rhenium-modified, saturated, plastically deformed and aged Cu–2Ni–1Si alloys. How will this affect the crystallization process? What effect will it have on the properties? Scanning electron microscopy (SEM) and analysis of chemical composition in microareas (energy-dispersive X-ray spectroscopy, EDS), light microscopy, measurements of microhardness and conductivity of the alloys were used for the investigations. Research on chemical and phase composition were carried out with application of transmission electron microscopy (TEM), and scanning transmission electron microscopy (STEM). Modification with rhenium has caused an increase in hardness as a result of precipitation of small phases with rhenium. As the effect of supersaturation, cold plastic treatment as w...
Twinning Induced Plasticity and Work Hardening Behavior of Aged Cu–Ni–Si Alloy
MATERIALS TRANSACTIONS, 2014
The work hardening behavior and deformed microstructure of the CuNiSi alloy aged at 723 K for various times and then deformed at 293 and 77 K were extensively investigated. The precipitate microstructure was also observed using transmission electron microscopy after aging treatment at 723 K for 0.30, 3.6, 64.8 and 345.6 ks. Deformation twins were clearly observed by transmission electron microscopy in the under-aged specimen deformed by 10% in tension at 293 K, in accordance with the enhanced work hardening rate observed during tensile deformation. The thickness of the deformation twins observed was approximately 140 nm. In addition, a significant fraction of larger deformation twins were observed by EBSD on the surface of the under-aged and peak-aged specimens tested at 77 K, for which the stressstrain behavior exhibited a nearly constant work hardening rate, i.e., high tensile strength and high elongation. These results show that the deformation twins formed during tensile deformation at 293 K contribute to strengthening of the specimen as new obstacles to the dislocation slip. Moreover, the enhanced twinning deformation at 77 K achieves high strength and elongation in the under-aged and peak-aged conditions. On the other hand, only a few deformation twins were observed in the supersaturated solid solution and over-aged specimens.
Microstructural stability of Cu processed by different routes of severe plastic deformation
Materials Science and Engineering: A, 2011
The thermal stability of ultrafine-grained (UFG) microstructure in Cu processed by different routes of severe plastic deformation (SPD) was studied at both high and room temperatures (RT). It was found that the microstructures produced by multi-directional forging or twist extrusion were more stable than those obtained by equal-channel angular pressing (ECAP) or high-pressure torsion (HPT). During storage of the ECAP-processed specimen at RT for 4 years the vacancy concentration reduced significantly while the dislocation density and the crystallite size remained unchanged. In the case of the HPT-processed sample both grain-growth and reduction of the dislocation density were observed.
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2008
Using the high pressure torsion (HPT) deformation method the medium carbon steel (AISI 1045) was the experimental material used to conduct the deformation process. The torsion deformation experiment was performed at increased temperature of 400°C. The influence of deformation processing parameters, resolved shear strain c (number of turns N = 1-6) and applied pressure p (constant pressure of 7 GPa), was evaluated by microstructure analysis and mechanical properties. The strength behaviour was assessed by microhardness measurements across the disc to detect the positional hardening, by tensile tests and in situ measured torque. In situ measurement of torque during deformation allows characterizing the changes in mechanical properties due to the large shear deformation developed across the disc. To obtain absolute values of strength the ultimate tensile strength was measured in radial direction with respect to the deformed sample. From each deformed disc two sub-sized tensile test specimens with gauge length of 2.5 mm were machined. The tensile strength in samples increased markedly with the number of turns. The hardness measured at disc edge gradually increases as straining increases until it saturates after 2-3 turns. However, the hardness values at edge were different from those measured in disc centre and for applied straining no saturation was reached across the disc. The SEM and TEM investigations were carried out to analyze the fine microstructure evolution regarding the strain introduced. To follow the difference in strain distribution across the deformed disc the microstructure analysis was performed at edge and central site of the disc in order to evaluate the effect of the strain distribution. TEM investigation confirmed the increasing misorientation even in very small grains, the fragmentation and dissolution of the cementite lamellae, (diffuse cementite/ferrite boundaries), the alignment of the fragments to the shear plane with increasing deformation. Indistinct deformation of ferrite and preserved cementite lamellae morphology were found at the centre of the disc.
Experimental Analysis of Microstructure and Mechanical Properties of Copper and Brass Based Alloys
International Journal of Automotive and Mechanical Engineering, 2015
The significant demand for copper and brass in industrial applications, the automotive industry and building industry is increasing; this requires the improvement of their mechanical properties by the addition of suitable alloying elements. The objective of this research is to study the effect of adding various alloys to copper and brass and their effects on their tensile strength, hardness and microstructure. The mechanical properties of two copper alloys and two brass alloys have been characterized in terms of tensile strength, impact strength and Rockwell hardness. The mechanical properties and microstructure of annealed specimens of Cu and brass alloys were observed. The results showed that by increasing the addition of alloys, the tensile strength also increases for both cases. The microstructure of the fracture surface after tensile testing has been examined using an inverted microscope. The experimental result shows that after the annealing at two temperatures of specimens of two copper alloys and two brass alloys, ECu shows more ductility than pure copper and C38500 brass alloy shows more ductility, yield strength and tensile strength than brass type 1.
Strengthening of Cu–Ni–Si alloy using high-pressure torsion and aging
Materials Characterization, 2014
An age-hardenable Cu-2.9%Ni-0.6%Si alloy was subjected to high-pressure torsion. Aging behavior was investigated in terms of hardness, electrical conductivity and microstructural features. Transmission electron microscopy showed that the grain size is refined to~150 nm and the Vickers microhardness was significantly increased through the HPT processing. Aging treatment of the HPT-processed alloy led to a further increase in the hardness. Electrical conductivity is also improved with the aging treatment. It was confirmed that the simultaneous strengthening by grain refinement and fine precipitation is achieved while maintaining high electrical conductivity. Three dimensional atom probe analysis including high-resolution transmission electron microscopy revealed that nanosized precipitates having compositions of a metastable Cu 3 Ni 5 Si 2 phase and a stable NiSi phase were formed in the Cu matrix by aging of the HPT-processed samples and these particles are responsible for the additional increase in strength after the HPT processing.
Microstructure Evolution in Cu-Ni-Co-Si-Cr Alloy During Hot Compression by Ce Addition
Materials
Cu-Ni-Si alloys are widely used in lead frames and vacuum devices due to their high electrical conductivity and strength. In this paper, a Cu-Ni-Co-Si-Cr-(Ce) alloy was prepared by vacuum induction melting. Hot compression tests of the Cu-Ni-Co-Si-Cr and Cu-Ni-Co-Si-Cr-Ce alloys were carried out using a Gleeble-1500 simulator at 500–900 °C deformation temperatures and 0.001–10 s−1 strain rates. The texture change was analyzed by electron backscatter diffraction. The <110> fiber component dominated the texture after compression, and the texture intensity was reduced during recrystallization. Moreover, the average misorientation angle φ for Cu-Ni-Co-Si-Cr-Ce (11°) was lower than that of Cu-Ni-Co-Si-Cr (16°) under the same conditions. Processing maps were developed to determine the optimal processing window. The microstructure and precipitates of the Cu-Ni-Co-Si-Cr and Cu-Ni-Co-Si-Cr-Ce alloys were also analyzed. The average grain size of the Cu-Ni-Co-Si-Cr-Ce alloy (48 μm) was f...